• Transactions on Electrical and Electronic Materials
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• v.10 no.3
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• pp.97-101
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• 2009

The use of a filler material in epoxy composite materials is an essential condition for reducing the unit cost of production and reinforcing mechanical strength. However, the dielectric strength of insulators decreases rapidly due to interactions between the epoxy resin and filler particles. In contrast to existing composite materials, nano-composite materials have superior dielectric strength, mechanical strength, and enduring chemical properties due to an increase in the bond strength of the polymer and nano material, It is reported that nano-fillers provide new characteristics different from the properties of the polymer material. This study is to improve the insulation capability of epoxy resins used in the insulation of a power transformer apparatus and many electronic devices mold. To accomplish this, the additional amount of nano-$SiO_2$ to epoxy resin was changed and the epoxy/$SiO_2$ nano composite materials were made, and the fundamental electrical properties were investigated using a physical properties and an analysis breakdown test. Using allowable breakdown probability, the optimum breakdown strength for designing an electrical apparatus was determined. The results found that the electrical characteristics of the nano-$SiO_2$ content specimens were superior to the virgin specimens. The 0.4 wt% specimens showed the highest electrical properties among the specimens examined with an allowable breakdown probability of 20 %, which indicates stable breakdown strength in insulating machinery design.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.8
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• pp.149-154
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• 1999

FRMLs(Fiber Reinforced Metal Laminates) is a new type of hybrid materials. FRMLs consists of high strength metal and fiber which are laminated using a structural adhesive bond(epoxy resin). The effect of resin mixture ratios on the fatigue crack propagation behavior and mechanical property of Aramid fiber reinforced aluminum composites was investigated. The epoxy, diglycidylether of bisphenol A(DGEBA) was cured with methylene dianiline(MDA) with or without accelerator(K-54). Eight kinds of resin mixture ratio were tested for the experiment ; five kinds of FRMLs(1))epoxy & curing agent) and three kinds of FRMLs(2)(epoxy & curing agent & accelerator). FRMLs(2) have a more effective characteristics on the fatigue crack propagation behavior and mechanical property than FRMLs(1)

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• Structural Engineering and Mechanics
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• v.5 no.4
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• pp.355-368
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• 1997

Fiber reinforced plastic (FRP) rods are used as reinforcement (prestressed or not) to concrete. FRP composites can also be combined with steel to form hybrid reinforcing rods that take advantage of the properties of both materials. In order to effectively utilize these rods, their bond behavior with concrete must be understood. The objective of this study is to characterize and model the bond behavior of hybrid FRP rods made with epoxy-impregnated aramid or poly-vinyl alcohol FRP skins directly braided onto a steel core. The model closely examines the split failure of the concrete by quantifying the relationship between slip of the rods resulting transverse stress field in concrete. The model is used to derive coefficients of friction for these rods and, from these, their development length requirements. More testing is needed to confirm this model, but in the interim, it may serve as a design aide, allowing intelligent decisions regarding concrete cover and development length. As such, this model has helped to explain and predict some experimental data from concentric pull-out tests of hybrid FRP rods.

• Journal of Dental Rehabilitation and Applied Science
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• v.22 no.3
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• pp.211-220
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• 2006

Need of porcelain-repair system is largely demanding as dental porcelain restorations are increased in clinical dentistry. This study investigated shear bond strength of commercial porcelain-repair systems on dental porcelain and their reliability. Experimental groups were as follows; Group A Super Bond C&B, Group B Porcelain repair kit, Group C Ceramic repair, and Group D Spectrum system as a control. Porcelain disks were fired and embedded in epoxy resin. Porcelain surface were ground using 220 grit SiC disk, then cleaned in ultrasonic bath. Then porcelain specimens were treated with each repair system. A clear polystyrene cylinder 3.5 mm in internal diameter was filled with composite resin. Then the resin cylinder was polymerized with a visible light curing unit. Thirty one specimens at each group were prepared and stored at $37^{\circ}C$ distilled water for 48 h. Specimens were tested in an Instron testing machine according to ISO TR 11405. Mean shear bond strength and standard deviation of each group was $15.7{\pm}4.1MPa$ (Group A), $12.8{\pm}4.9MPa$ (Group B), $7.2{\pm}3.0MPa$ (Group C) and $9.6{\pm}2.2MPa$ (Group D). ANOVA and Tukey HSD post-hoc test showed that there were significant differences between groups (p<0.05). Data of bond strength were analyzed with two-parameter Weibull distribution. Confidence interval of Weibull modulus (m-parameter) at 95% of Group A (3.5-6.3) and Group D (3.6-6.0) were significantly higher than Group B (2.2-3.7) and Group C (2.0-3.4). There was little correlation between mean shear bond strength and Weibull modulus. Results indicated that acid-etching of porcelain surface increased porcelain-resin shear bonding strength.

• Restorative Dentistry and Endodontics
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• v.46 no.4
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• pp.53.1-53.11
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• 2021

Objectives: This study evaluates the bond strength and marginal adaptation of mineral trioxide aggregate (MTA) Repair HP and Biodentine used as apical plugs; MTA was used as reference material for comparison. Materials and Methods: A total of 30 single-rooted teeth with standardized, artificially created open apices were randomly divided into 3 groups (n = 10 per group), according to the material used to form 6-mm-thick apical plugs: group 1 (MTA Repair HP); group 2 (Biodentine); and group 3 (white MTA). Subsequently, the specimens were transversely sectioned to obtain 2 (cervical and apical) 2.5-mm-thick slices per root. Epoxy resin replicas were observed under a scanning electron microscope to measure the gap size at the material/dentin interface (the largest and smaller gaps were recorded for each replica). The bond strength of the investigated materials to dentin was determined using the push-out test. The variable bond strengths and gap sizes were evaluated independently at the apical and cervical root dentin slices. Data were analyzed using descriptive and analytic statistics. Results: The comparison between the groups regarding the variables' bond strengths and gap sizes showed no statistical difference (p > 0.05) except for a single difference in the smallest gap at the cervical root dentin slice, which was higher in group 3 than in group 1 (p < 0.05). Conclusions: The bond strength and marginal adaptation to root canal walls of MTA HP and Biodentine cement were comparable to white MTA.

• Journal of the Korea Concrete Institute
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• v.19 no.6
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• pp.677-684
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• 2007

This study investigates the failure mechanism of RC beams strengthened with GFRP (glass fiber reinforced polymer) sheets. After analyzing failure mechanisms, the various methods to prevent the debonding failures, such as increasing bonded length of GFRP sheets, U-shape wrappings and epoxy shear keys are examined. The bonded length of GFRP sheets are calculated based on the assumed bond strengths of epoxy resin. The U-shape wrappings are either adopted at the end or center of the CFRP sheets bonded to the beam soft. The epoxy shear keys are embedded to the beam soft to provide sufficient bond strength. The end U-wrappings and the center U-wrappings are conventional, while epoxy shear keys are new details developed in this study. A total six half-scale RC beams have been constructed and tested to investigate the effectiveness of each methods to prevent debonding failure of GFRP sheets. From the experimental results, it was found that increasing bonded length or end U-wrappings do not prevent debonding failure. On the other hand, the beams with center U-wrappings and shear keys reached an ultimate state with their sufficient performance. The center U-wrappings tended to control debonding of the longitudinal GFRP sheets because the growth of the longitudinal cracks along the edges of the composites was delayed. In the case of shear keys, it was sufficient to prevent debonding and the beam was failed by GFRP sheets rupture.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.

• Journal of the Korean Recycled Construction Resources Institute
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• v.6 no.1
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• pp.59-65
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• 2018

RC(Reinforced Concrete) structures are exposed to various exterior conditions, and the performances of both chloride resistance and freezing/thawing action are evaluated for those exposed to corrosive environment-sea shore. Recently developed FRP Hybrid Bars which is coated with glass fiber and epoxy with core steel has an engineering advantage of higher Elasticity than FRP rod. In this work, corrosion resistance, weight loss, and bond strength are evaluated for the FRP Hybrid Bar tested through freezing/thawing action for 300cycles. The double coated FRP Hybrid Bar shows the least weight loss without defection due to freezing/thawing action. Bond strength in FRP Hybrid Bar increases to 120% of normal steel through torturity effect with Si-coating. Bond strength in normal steel shows 0.86~0.89times in 3-day corrosion acceleration and 0.35~0.38times in 5-day corrosion acceleration, however, that in FRP Hybrid Bar shows little changes in bond strength before and after freezing/thawing action.

• Journal of the Korea institute for structural maintenance and inspection
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• v.14 no.5
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• pp.144-152
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• 2010

In this study, cement-based filler is used as an adhesive instead of organic adhesive, epoxy because there were problems under wet condition. First, the bond strength of cement-based filler was measured and the result was satisfied with KS F 4716. However, in case of wet condition, bond strength of epoxy adhesive decreased $0.73N/mm^2$ in 7 days and $0.84N/mm^2$ in 14 days from pilot test. This implies that there would be a problem on reinforced concrete structure in wet condition, such as tunnel and sewage box. In the second experiment, the flexural strength of RC beams with GFRP using different thickness of cement-based filler was investigated, and the result was indicated 113%, 66%, 75% increase in 10mm, 20mm, 30mm thickness, respectively. From the result, it was known that 10mm filler thickness produces stable bond performance.