• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.33-49
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• 2002

$\Box$ LTCC/LTCC-M technologies are a cost-effective SOP technology $\Box$ LTCC/LTCC-M materials have good RF characteristics and the materials can be used as excellent substrates for high band width applications $\Box$ Reliability of LTCC/LTCC-M package or module can be greatly improved by embedded passive technology and CTE control of the substrates $\Box$ To expand the application area, more development is needed in realization of embedded passives with tight tolerance

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.764-767
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• 2003

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.599-602
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• 2004

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.214-218
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• 2002

So far, many kinds of researches on the ceramic chip components and MCM-C RF module especially on the 3-dimensional ceramic module using embedded passives have been performed. LTCC system has many kinds of advantages, like low lass, low cost of process, stability of process etc.. But it's so hard to adjust the characteristics of passives in ceramic module after fabrication. So the exact prediction of behavior of components in high frequency region upper than 2 GHz must be made. In this procedure, the exact measurement is need. In this study, many kinds of measurement Jigs are compared and optimized, and measurement methods of each parameter are designed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.678-681
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• 2002

In this paper, Characterization for several 3-D embedded passive elements with different structures was performed. The equivalent circuit optimization for embedded inductor was performed by HSPICE simulation software. After extracting each parameter values, the difference of parameter from each structure was examined. From this work, effective characterization of passive devices with similar structure will be possible.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.607-610
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• 2003

The characteristic prediction and analysis of 3-dimensional (3-D) solenoid-type embedded inductors is investigated. The four different structures of 3-D inductor are fabricated by using low-temperature cofired ceramic (LTCC) process. The circuit model parameters of the each building block are optimized and extracted using the partial element equivalent circuit method and HSPICE circuit simulator. Based on the model parameters, predictive modeling is applied for the structures composed of the combination of the modeled building blocks. And the characteristics of test structures, such as self-resonant frequency, inductance and Q-factor, are analyzed. This approach can provide the characteristic conception of 3-D solenoid embedded inductors for structural variations.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.593-596
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• 2002

In this paper, the effect of device model parameter variation on three-dimensional embedded passive devices was investigated using statistical analysis. The optimized equivalent circuit models for several different structures were obtained from HSPICE simulation. The mean and the standard deviation of model parameters were extracted and the sensitivity analysis for each component was performed. From the analysis, the performance and parametric yield of the devices can be analyzed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.69-73
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• 2002

In ceramic systems, many components including embedded passives and TRL(transmission line) are used for composition of 3-dimensional circuit. So the exact analysis on this components, As for the TRL's, material properties including electrical conductivity of metal, loss factor and effective dielectric constant of dielectric material and geometrical factors like roughness of surface, vias, dimension of stripline structure have a large effect on the charactersistics of transmission lines. In this research, of effect of material and geometrical factors on the characteristics of stripline structure is analyzed and quantified by simulation and measurement.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.3-17
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• 2003

.Package Trend -> Memory : Lighter, Thinner, Smaller & High Density => SiP, 3D Stack -> MPU : High Pin Counts & Multi-functional => FCBGA .Interposer Trend -> Via - Unfilled Via => Filled Via - Staggered Via => Stacked Via -> Emergence of All-layer Build-up Processes -> Interposer Material Requirement => Low CTE, Low $D_{k}$, Low $D_{f}$, Halogen-free .New Technology Concept -> Embedded Passives, Imprint, MLTS, BBUL etc.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.39-44
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• 2008

In this paper, fully embedded 2.4GHz WLAN band pass filter (BPF) was investigated into a multi-layered organic packaging substrate using high Q spiral stacked inductors and high Dk MIM capacitors for low cost RF System on Package (SOP) applications. The proposed 2.4GHz WLAN BPF was designed by modifying chebyshev second order filter circuit topology. It was comprised of two parallel LC resonators for obtaining two transmission zeros. It was designed by using 2D circuit and 3D EM simulators for finding out optimal geometries and verifying their applicability. It exhibited an insertion loss of max -1.7dB and return loss of min -l7dB. The two transmission zeros were observed at 1.85 and 6.7GHz, respectively. In the low frequency band of $1.8GHz{\sim}1.9GHz$, the stop band suppression of min -23dB was achieved. In the high frequency band of $4.1GHz{\sim}5.4GHz$, the stop band suppression of min -l8dB was obtained. It was the first embedded and the smallest one of the filters formed into the organic packaging substrate. It has a size of $2.2{\times}1.8{\times}0.77mm^3$.