• Title/Summary/Keyword: embedded passive device

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Study of Diplexer Fabrication with Embedded Passive Component Chips (수동소자 칩 함몰공정을 이용한 Diplexer 구현에 관한 연구)

  • Youn, Je-Hyun;Park, Se-Hoon;Yoo, Chan-Sei;Lee, Woo-Sung;Kim, Jun-Chul;Kang, Nam-Kee;Yook, Jong-Gwan;Park, Jong-Chul
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.30-30
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    • 2007
  • 현재 다양한 종류의 RF 통신 제품이 시장에 등장하면서 제품의 경쟁력 확보에 있어 소형화 정도가 중요한 이슈가 되고 있다. Passive Device는 RF Circuit을 제작할 때 많은 면적을 차지하고 있으며 이를 감소시키기 위해 여러 연구가 진행되고 있다. 가장 효과적인 방법으로 반도체 집적기술로 크기를 줄이는 방법이 있으나, 공정이 비싸고 제작 시간이 오래 걸려 제품개발 시간과 개발비용이 상승하게 된다. 반면에 SoP-L 공정은 PCB 제작에 이용되는 일반적인 재료와 공정을 사용하므로 개발 비용과 시간을 줄일 수 있다. SoP-L의 또 하나 장점은 다종 재료를 다층으로 구성할 수 있다는 점이다. 최근 chip-type의 Device를 PCB 기판 안에 내장하는 방법의 RF Circuit 소형화 연구가 많이 진행되고 있다. 본 연구에서는 SoP-L 공정으로 chip-type 수동소자를 PCB 기판 내에 함몰하여 수동소자회로를 구현, 분석하여 보았다. 수동소자회로는 880 MHz~960 MHz(GSM) 영역과 1.71 GHz~1.88 GHz(DCS) 영역을 나누는 Diplexer를 구성하였다. 1005 size의 chip 6개로 구현한 Diplexer를 표면실장과 함몰공정으로 제작하고 Network Analyzer로 측정하여 비교하였다. chip 표면실장으로 구현된 Diplexer는 GSM에서 최대 0.86 dB의 loss, DCS에서 최대 0.68 dB의 loss가 나타났다. 표면실장과 비교하였을 때 함몰공정의 Diplexer는 GSM 대역에서 약 0.5 dB의 추가 loss가 나타났으며 목표대역에서 0.6 GHz정도 내려갔다. 이 결과를 바탕으로 두 공정 간 차이점을 확인하고, 함몰공정으로 chip-type 수동소자를 사용하였을 때 고려해야 할 점을 분석하였다. 이를 바탕으로 SoP-L 함몰공정의 안정성을 높여서 이것을 이용한 회로의 소형화에 적용이 가능할 것으로 기대한다. 특히 능동소자의 DC Power Control에서 고용량의 수동소자를 이용할 때 집적도를 높일 수 있을 것이다.

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Self-sustained n-Type Memory Transistor Devices Based on Natural Cellulose Paper Fibers

  • Martins, Rodrigo;Pereira, Luis;Barquinha, Pedro;Correia, Nuno;Goncalves, Goncalo;Ferreira, Isabel;Dias, Carlos;Correia, N.;Dionisio, M.;Silva, M.;Fortunato, Elvira
    • Journal of Information Display
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    • v.10 no.4
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    • pp.149-157
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    • 2009
  • Reported herein is the architecture for a nonvolatile n-type memory paper field-effect transistor. The device was built via the hybrid integration of natural cellulose fibers (pine and eucalyptus fibers embedded in resin with ionic additives), which act simultaneously as substrate and gate dielectric, using passive and active semiconductors, respectively, as well as amorphous indium zinc and gallium indium zinc oxides for the gate electrode and channel layer, respectively. This was complemented by the use of continuous patterned metal layers as source/drain electrodes.

Heterogeneous Device Packaging Technology for the Internet of Things Applications (IoT 적용을 위한 다종 소자 전자패키징 기술)

  • Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.3
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    • pp.1-6
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    • 2016
  • The Internet of Things (IoT) is a new technology paradigm demanding one packaged system of various semiconductor and MEMS devices. Therefore, the development of electronic packaging technology with very high connectivity is essential for successful IoT applications. This paper discusses both fan-out wafer level packaging (FOWLP) and 3D stacking technologies to achieve the integrattion of heterogeneous devices for IoT. FOWLP has great advantages of high I/O density, high integration, and design flexibility, but ultra-fine pitch redistribution layer (RDL) and molding processes still remain as main challenges to resolve. 3D stacking is an emerging technology solving conventional packaging limits such as size, performance, cost, and scalability. Among various 3D stacking sequences wafer level via after bonding method will provide the highest connectivity with low cost. In addition substrates with ultra-thin thickness, ultra-fine pitch line/space, and low cost are required to improve system performance. The key substrate technologies are embedded trace, passive, and active substrates or ultra-thin coreless substrates.

Event based Rule Processing in Ubiquitous Web Services Environments (유비쿼터스 웹서비스 환경에서 이벤트 기반의 룰 처리 기법)

  • Lee Kang-Chan;Lee Won-Suk;Jeon Jong-Hong;Lee Seung-Yun;Park Jong-Hun
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.10 no.6
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    • pp.1101-1105
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    • 2006
  • Ubiquitous computing network comprises a variety of distributed service devices. Today Web services technology enables the heterogeneous devices to provide their own services and interact with each other via well-defined Internet protocol. Nevertheless, service devices in ubiquitous environments require more event-driven, autonomous interaction beyond rather passive service-oriented architecture of the present time. This paper presents an ECA (Event-Condition-Action) rule description language in an attempt to support capability for autonomous interactions among service-oriented devices in ubiquitous computing network. Specifically, the proposed WS-ECA is an XML-based ECA rule description language for web service-enabled devices. The rules are embedded in distributed devices which invoke appropriate services in the network if the rules are triggered by some internal or external events. The presented ECA-based device coordination approach is expected to facilitate seamless inter-operation among the web service-enabled devices in the emerging ubiquitous computing environment.

Trend and future prospect on the development of technology for electronic security system (기계경비시스템의 기술 변화추세와 개발전망)

  • Chung, Tae-Hwang;So, Sung-Young
    • Korean Security Journal
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    • no.19
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    • pp.225-244
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    • 2009
  • Electronic security system is composed mainly of electronic-information-communication device, so system technology, configuration and management of the electronic security system could be affected by the change of information-communication environment. This study is to propose the future prospect on the development of technique for electronic security system through the analysis of the trend and the actual condition on the development of technique. This study is based on literature study and interview with user and provider of electronic security system, also survey was carried out by system provider and members of security integration company to come up with more practical result. Hybrid DVR technology that has multi-function such as motion detection, target tracking and image identification is expected to be developed. And 'Embedded IP camera' technology that internet server and image identification software are built in. Those technologies could change the configuration and management of CCTV system. Fingerprint identification technology and face identification technology are continually developed to get more reliability, but continual development of surveillance and three-dimension identification technology for more efficient face identification system is needed. As radio identification and tracking function of RFID is appreciated as very useful for access control system, hardware and software of RFID technology is expected to be developed, but government's support for market revitalization is necessary. Behavior pattern identification sensor technology is expected to be developed and could replace passive infrared sensor that cause system error, giving security guard firm confidence for response. The principle of behavior pattern identification is similar to image identification, so those two technology could be integrated with tracking technology and radio identification technology of RFID for total monitoring system. For more efficient electronic security system, middle-ware's role is very important to integrate the technology of electronic security system, this could make possible of installing the integrated security system.

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