• Title/Summary/Keyword: electrostatic scan device

Search Result 3, Processing Time 0.014 seconds

Operating System Design of Multi Beam Control System with Miniaturized Electron Beam Columns (초소형 전자빔을 이용한 멀티 전자빔 운영 시스템 설계)

  • Lim, Sun Jong;Kim, Ho Seob
    • Laser Solutions
    • /
    • v.18 no.4
    • /
    • pp.12-16
    • /
    • 2015
  • The research on multi electron beam systems is being carried out by various methods. We are studying multi electron beam system using miniaturized electron beam columns. The column consists of electrostatic lenses, electrostatic deflector and tip emitter. Our operating system controls 4 column array, captures images of each column and maintains the instrument. We present the usefulness of our operating system for multi columns by capturing images of each column.

A Study on Electrostatic Powder Coating for 3D Scanning of Diffused Surfaces (난반사 표면의 3D 스캐닝을 위한 정전분말코팅 연구)

  • Maeng, Heeyoung;Lee, Myoung Sang
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.24 no.1
    • /
    • pp.56-62
    • /
    • 2015
  • Using an optical 3D scanning device to collect data from a diffused reflection surface is very difficult. To solve this problem, there are many applications including a spray-type developer and silicon molds. However, using a developer can cause chemical reactions between objects and particles of the developer and uneven surfaces on the object. To overcome these problems, we suggest an electrostatic powder coating method for even coating of particles onto surfaces for collecting 3D shape data. We have developed an automatic, electrostatic powder-coating machine and performed three different experiments to compare this system with a laser interferometer and a T-scan 3D scanner. As a result, we could ascertain the various characteristics of this new method, including good sensitivity for the various surface states of the bare surface, developer, and electrostatic powder coating. Finally, we verified the outstanding scanning performance and were able to demonstrate that this method achieves quality than traditional methods.

Wafer-Level Fabrication of a Two-Axis Micromirror Driven by the Vertical Comb Drive (웨이퍼 레벨 공정이 가능한 2축 수직 콤 구동 방식 마이크로미러)

  • Kim, Min-Soo;Yoo, Byung-Wook;Jin, Joo-Young;Jeon, Jin-A;Park, Il-Heung;Park, Jae-Hyoung;Kim, Yong-Kweon
    • Proceedings of the KIEE Conference
    • /
    • 2007.11a
    • /
    • pp.148-149
    • /
    • 2007
  • We present the design and fabrication prcoess of a two-axis tilting micromirror device driven by the electrostatic vertical comb actuator. A high aspect-ratio comb actuator is fabricated by multiple DRIE process in order to achieve large scan angle. The proposed fabrication process enables a mirror to be fabricated on the wafer-scale. By bonding a double-side polished (DSP) wafer and a silicon-on-insulator (SOI) wafer together, all actuators on the wafer are completely hidden under the reflectors. Nickel lines are embedded on a Pyrex wafer for the electrical access to numerous electrodes of mirrors. An anodic bonding step is implemented to contact electrical lines with ail electrodes on the wafer at a time. The mechanical angle of a fabricated mirror has been measured to be 1.9 degree and 1.6 degree, respectively, in the two orthogonal axes under driving voltages of 100 V. Also, a $8{\times}8$ array of micromirrors with high fill-factor of 70 % is fabricated by the same fabrication process.

  • PDF