• 한국레이저가공학회지
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• 제18권4호
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• pp.12-16
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• 2015

The research on multi electron beam systems is being carried out by various methods. We are studying multi electron beam system using miniaturized electron beam columns. The column consists of electrostatic lenses, electrostatic deflector and tip emitter. Our operating system controls 4 column array, captures images of each column and maintains the instrument. We present the usefulness of our operating system for multi columns by capturing images of each column.

• 한국생산제조학회지
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• 제24권1호
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• pp.56-62
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• 2015

Using an optical 3D scanning device to collect data from a diffused reflection surface is very difficult. To solve this problem, there are many applications including a spray-type developer and silicon molds. However, using a developer can cause chemical reactions between objects and particles of the developer and uneven surfaces on the object. To overcome these problems, we suggest an electrostatic powder coating method for even coating of particles onto surfaces for collecting 3D shape data. We have developed an automatic, electrostatic powder-coating machine and performed three different experiments to compare this system with a laser interferometer and a T-scan 3D scanner. As a result, we could ascertain the various characteristics of this new method, including good sensitivity for the various surface states of the bare surface, developer, and electrostatic powder coating. Finally, we verified the outstanding scanning performance and were able to demonstrate that this method achieves quality than traditional methods.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 Techno-Fair 및 추계학술대회 논문집 전기물성,응용부문
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• pp.148-149
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• 2007

We present the design and fabrication prcoess of a two-axis tilting micromirror device driven by the electrostatic vertical comb actuator. A high aspect-ratio comb actuator is fabricated by multiple DRIE process in order to achieve large scan angle. The proposed fabrication process enables a mirror to be fabricated on the wafer-scale. By bonding a double-side polished (DSP) wafer and a silicon-on-insulator (SOI) wafer together, all actuators on the wafer are completely hidden under the reflectors. Nickel lines are embedded on a Pyrex wafer for the electrical access to numerous electrodes of mirrors. An anodic bonding step is implemented to contact electrical lines with ail electrodes on the wafer at a time. The mechanical angle of a fabricated mirror has been measured to be 1.9 degree and 1.6 degree, respectively, in the two orthogonal axes under driving voltages of 100 V. Also, a $8{\times}8$ array of micromirrors with high fill-factor of 70 % is fabricated by the same fabrication process.