• Proceedings of the Technology Innovation Conference
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• 2002.02a
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• pp.133-149
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• 2002

This study aims to investigate the impact of wide use of digital technology, in particular, the Internet, on innovation process and corporate strategy in electronics industry. The introduction of digital technology has changed innovation process, business model and organizational structure of the electronics companies. With the introduction of digital technology, the entire value chain of electronics industry from procurement, sales, and marketing to R&D and manufacturing has been restructured. E-commerce has been a major agenda for e-business. Recently, collaboration among electronics companies through e-marketplace has emerged as an important issue. A web-based e-commerce standard, so called RosettaNet, has been developed for facilitating e-transactions of electronics firms. The development of digital technology has dramatically increased the processing speed and sophisticated the virtual reality technology. As simulation becomes easier and more effective, the uncertainty and risk involved in R&D has decreased significantly. Another positive impact is closer cooperation between R&D and manufacturing functions. Taking advantage of automated and flexible production technology, has a new type of firm, so called, EMS (Electronics Manufacturing Services) emerged, whose strategic focus is on manufacturing only. The EMS can be seen as a kind of innovative organization, that is, a modular organization for production function. Digital technology has made convergence of computer and communication possible at early years but right now the convergence has been accelerated in extensive areas of communication, broadcasting, information appliances, software, contents, and services. Firms' effort for an innovative product and service has been intensified and the competition for a new standard product and service has become severe in electronics industry. Business activities are always realized in a specific organizational context. Accordingly building up innovation-friendly organization has emerged as a critical concern. Due to the striking decrease of transaction cost, a network type of organization has proliferated, and a business function turns into a modular organization. As a whole, digital technology has pushed electronics firms into developing their own business model, which takes consideration of standardization of business platform and their core competency.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.481-484
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• 2004

To make production and equipment investment plans in semiconductor Line, implementation of many variables is needed. But these factors could bring many changes and the result is hard to predict. Because prediction is hard, it is hard to make a standard. So this project established Semiconductor production plans using LP Algorithm to satisfy all the conditions from the factors and came up with thesis on reasonable and standardized process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.125-128
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• 2004

Chemical Mechanical Polishing(CMP) in semiconductor production is characterized its output property by Removal Rate(RR) and Non-Uniformity(NU). Some Previous works shows that RR is determined by production of pressure and velocity and NC is also largely affected by velocity of flow-field during CMP. This study is about the direct measurement of velocity of slurry during CMP and reconstruction whole flow-field by Particle Image Velocimetry(PIV) Techniques. Typical PIV system is tuned adequately for inspecting CMP and Slurry Flow-field is measured by changing both Pad RPM and Carrier RPM. The results show that velocity is majorly determined not by Carrier RPM, but by Pad RPM.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.4
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• pp.328-332
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surface. One of the front metal contacts is Ni/Cu plating that it is available to simply and inexpensive production to apply mass production. Ni is shown to be a suitable barrier to Cu diffusion into the silicon. The process of Ni electroless plating on front silicon surface is performed using a chemical bath. Additives and buffer agents such as ammonium chloride is added to maintain the stability and pH control of the bath. Ni deposition rate is found to vary with temperature, time, utilization of bath. The experimental result shown that Ni layer by SEM (scanning electron microscopy) and EDX analysis. Finally, plated Ni/Cu contact solar cell result in an efficiency of 17.69% on $2{\times}2\;cm^2$, Cz wafer.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.30 no.1
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• pp.53-62
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• 2024

Molded pulp products has become more attractive than traditional materials such as expanded polystyrene foam (EPS) owing to low-priced recycled paper, environmental benefits such as biodegradability, and low production cost. In this study, various design factors regarding compression and cushioning characteristics of the molded pulp cushion with truncated pyramid-shaped structural units were analyzed using a test specimen with multiple structural units. The adopted structural factors were the geometric shape, wall thickness, and depth of the structural unit. The relative humidity was set at two levels. We derived the cushion curve model of the target molded pulp cushion using the stress-energy methodology. The coefficient of determination was approximately 0.8, which was lower than that for EPS (0.98). The cushioning performance of the molded pulp cushion was affected more by the structural factors of the structural unit than by the material characteristics. Repeated impacts, higher static stress, and drop height decreased the cushioning performance. Its compression behavior was investigated in four stages: elastic, first buckling, sub-buckling, and densification. It had greater rigidity during initial deformation stages; then, during plastic deformation, the rigidity was greatly reduced. The compression behavior was influenced by structural factors such as the geometric shape and depth of the structural unit and environmental conditions, rather than material properties. The biggest difference in the compression and cushioning characteristics of molded pulp cushion compared to EPS is that it is greatly affected by structural factors, and in addition, strength and resilience are expected to decrease due to humidity and repetitive loads, so future research is needed.

• Journal of Animal Environmental Science
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• v.1 no.1
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• pp.21-38
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• 1995

The objective of this study was to review and analyze the application technologies of electronics and microprocessor for environment control and automated management systems of livestock production of the advanced countries, and to select the appropriate and applicable technologies for our systems among the analyzed. In this study, the environment control systems were analyzed mainly on the poultry production systems and the automated management systems on swine and dairy production systems. According to the results, the advanced technologies reviewed and analyzed could be applicable for designing our animal production systems, if those were modified and remodeled for our situation.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.811-812
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• 2006

This study is study about implementation of the production work management system that used RFID. A RFID Card system is used, and a collection totalizes and all data by real time, and, in production planning and work indication, work process time analyzes production present situation information by line by process automatically, and it is solution to be able to do an inquiry. The production related time that was hard to be measured are produced in the existing production management system exactly, and a grafting with solution of ERP, SCM, CMMS, etc is the study that is going to establish the possible most suitable system.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.28 no.1
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• pp.64-71
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• 2005

The purpose of this study is to propose guidelines for introducing the Just-In-Time (JIT) production system to enhance the competitiveness of Korean manufacturing companies. This study employed an extensive survey on the use of the JIT production systems among different korean manufacturing companies to understand the current status of the JIT production system in use and to identify the benefits from implementing JIT production system. The survey has covered 170 manufacturing companies of different sizes from various sectors of Korean industries including electronics, automobiles, machineries, and textiles. In conclusion, our research results support that the JIT production system would contribute to increase the manufacturing performances of Korean manufacturing companies through lower inventory level and increased quality level.

• The Magazine of the IEIE
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• v.38 no.12
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• pp.36-41
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• 2011

• Journal of the Economic Geographical Society of Korea
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• v.8 no.2
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• pp.217-236
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• 2005

This paper aims to analysis the production linkage relationships between large firm and its subcontracting firms, especially focus on the spatial network and collaboration network. For the purpose of it, the division of semiconductor in Samsung Electronics and its most important subcontracting firms are picked up for the case study. The empirical study show that the location distribution pattern of Samsung Electronic's subcontracting firms is concentrated very highly on the Kyeong-Ki Province and Chung-Nam Province in Korea, which is the location sites of Samsung Electronic's key plants as well as the best environment for business in Korea. And the major subcontracting firms seems to be in the hierarchic and vertical relationship with Samsung Electronics rather than horizontal and good collaboration network in this case.