• Title/Summary/Keyword: electronic parts

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An Outstanding Issues fey a New Practical Model of Korean Library Statistics (관종별 한국도서관통계 실용안개발 현안 및 개발방향)

  • Ahn, In-Ja;Hoang, Gum-Sook;Oh, Se-Hoon;Chang, Hye-Young
    • Journal of the Korean Society for Library and Information Science
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    • v.41 no.1
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    • pp.431-451
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    • 2007
  • As a new practical model of Korean Library statistics, It suggests 6 parts, fifty-four items for 4 types of libraries. In comparison with last version, 'library use and users', 'electronic services' parts are increased which are occupied as more than hair of the whole statistical items. Budget parts are increased also. The new model which is developed based on the international standards like ISO2789 and NISO/ANSI Z39.7 is advised by professionals in the fields.

Development of a Scenario-based WBT System of Electronic Commerce (전자상거래 교육을 위한 시나리오 WBT (Web-Based Training)형 프로그램 개발에 관한 연구)

  • 임춘성;김훈태;최석현;신범일
    • The Journal of Society for e-Business Studies
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    • v.3 no.2
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    • pp.37-55
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    • 1998
  • This study describes the works on development of a scenario-based WBT system of electronic commerce to introduce and activate electronic commerce in our society because it is mostly required to correctly understand electronic commerce and timely educate its users and technicians for entering into global electronic commerce that binds every commercial area regardless of the borders and nationalities. This system, WBT(Web - Based Training of Electronic commerce), consists of two parts. The one part provides a general concept of EC. This is developed to meet the needs of beginner for EC. The other is a simulator for cyber shopping mall. It is designed for teaching how to shop at cyber shopping mall based on various scenarios. In addition, we can simulate ourselves for EDI, which enables trading partners to conduct routine business transaction, such as purchase orders, invoices and shopping notices with it. Our commitment to the development of this application is consistent with the objectives of being easy to learn electronic commerce and its applications in real world.

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3-DOF automatic printed board positioning system using impact drive mechanism

  • Mendes, J.;Nishimura, M.;Yamagata, Y.;Higuchi, T.
    • 제어로봇시스템학회:학술대회논문집
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    • 1996.10a
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    • pp.129-132
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    • 1996
  • There is a tendency nowadays to produce increasingly miniaturized electronic equipment which incorporate parts that have to be precisely positioned, like lenses, heads and CCD's in scanners, printers, copiers, VCR's, optical fiber modules, etc. In contrast to the production process of precision parts, which is currently being carried out automatically, the assemblage process is still being performed by specially skilled technicians. The assemblage process comprises normally the following steps: firstly, the parts are roughly positioned and partially fixed, secondly, the parts are manually nudged towards the target position and finally glued, screwed or welded. This paper presents a system that uses six piezo Impact Drive Mechanisms for accurate micro positioning within three degrees of freedom (lateral and longitudinal translation and rotation). The system is designed to positioning a printed circuit board with an accuracy better than 3 .mu.m (for translations), 5 mrad (for rotation).

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PIV Measurement on the Flows of PDP(Plasma Display Panel) (PDP 유동장 PIV 계측)

  • Doh, D.H.;Cho, G.R.;Pyun, Y.B.;Song, J.S.;Baek, T.S.;Jung, W.M.
    • Proceedings of the KSME Conference
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    • 2001.06e
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    • pp.733-737
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    • 2001
  • Heat generated from the electronic parts in PDP is undesirable physical properties. To attain optimal arrangement of the electronic parts in PDP, thermal flows in PDP should be analyzed. PIV measurement has been made to quantify the characteristics of the inner flows and outer flows of an actual PDP. The quantity of heat flux from PDP has been estimated using the PIV results. Measurement system consists of Ar-ion laser, CCD camera and an image grabber installed on a host computer.

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Failure Rates of Electronic Parts through 217PlusTM (217PlusTM을 통한 전자 부품들의 고장률 산출)

  • Jeon, Tae-Bo
    • Journal of Industrial Technology
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    • v.28 no.B
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    • pp.227-234
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    • 2008
  • Reliability predictions for selected electronic parts using 217-Plus have been performed in this study. 217-Plus has recently developed and may be applied for electronics failure prediction as a surrogate of MIL-HDBK-217. We first briefly reviewed 217-Plus component models. Based on three selected components, predictions using both MIL-HDBK-217 and 217-Plus have been made and the results were compared. Even though the comprehensive conclusion may be drawn from extensive component and system level analyses, the results in this study may provide general insights towards reliability through two specifications.

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The Analysis of Welding Deformation in Arc-spot Welded Structure (I) - Temperature Monitoring and Heat Transfer Analysis - (아크 점용접 구조물의 정밀 용접 열변형 해석에 관한 연구 (I) -온도 모니터링 및 열전달 모델 정립-)

  • 이원근;장경복;강성수;조상명
    • Journal of Welding and Joining
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    • v.20 no.4
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    • pp.544-550
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    • 2002
  • Arc-spot welding is generally used in joining of precise parts such as case and core in electronic compressor. It is important to control joining deformation in electronic compressor because clearance control in micrometer order is needed for excellent airtightness and anti-nose. The countermeasures far this deformation in field have mainly been dependent on the rule of try and error by operator's experience because of productivities. For control this deformation problem without influence on productivities, development of exact simulation model should be needed. In this study, to solve this deformation problem in arc-spot welded structure with case and core, we intend to make a simulation model that is able to predict deformation in precise order by tuning and feedback between sensing data and simulation results. This paper include development of heat input model for arc-spot welding, temperature monitoring and make a heat transfer model using sensing data in product.

Analysis on Properties of Porcelain Insulators with Alumina Composition (알루미나 조성에 따른 송전용 자기애자의 특성 분석)

  • Cho, H.G.;Lee, Y.J.;Yoon, H.S.;Han, S.W.;Choi, I.H.;Choi, Y.K.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.11a
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    • pp.317-318
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    • 2005
  • This paper presents the analysis on the properties of porcelain insulators with the manufactured year. The domestic porcelain insulators manufactured in 1995, 1997, and 2002 and the imported one are prepared. The content of alumina was increased with the manufactured year, and the hardness of ceramic parts showed the same trend. Moreover, the distribution and the size of pore were more decreased and reduced on the junction parts between the glaze and the ceramic. Therefore, we concluded that the domestic porcelain insulators have been improved with the lapse of time.

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Gold Alloy Plating on Electronic Parts(II) (전자 부품상의 금도금에 관한 연구 (제 2 보))

  • 염희택
    • Journal of the Korean institute of surface engineering
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    • v.9 no.3
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    • pp.1-4
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    • 1976
  • In order to get high wear-resistant gold alloy plating on electronic parts, on attempt has been made, in which Cu, Ni, and Zn EDTA salts were added in gold palting solution. The results obtained on the wear resistance are as follows: 1. The addition of 0.5g/ι or over Cu in plating solution, showed 1.5 times more wear resistance than in case of no addition. 2. The addition of 1.5g/ι or over Ni, showed 3.5 times more wear-resistance . 3. The addition of 1.5g/ι and 4.0g/ι Zn , showed 3.5 times and 6.8 times more wear resistance , respectively. 4. The addition of 1.5g/ι Ni and 1.0g/ι Zn simultaneously , showed about 10 times more wear resistance than in case of no addition.

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INTERFIRM RELATIONSHIPS IN KOREAN ELECTRIC/ELECTRONIC PARTS INDUSTRY

  • Sejo Oh;F. Robert Dwyer;Kim, Sungil;Park, Jin-Yong
    • Journal of Distribution Research
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    • v.2 no.2
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    • pp.135-151
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    • 1997
  • This study of interfirm relationships is tested on a sample of Korean electric and electronic parts industry. The hypotheses present that (1) buyer's power affects administrative structure and relational norms, (2) communications are affected prior three antecedents, and (3) buyer's power, administrative structure, relational norms, and communication affects relational performances. The results indicate that buyer's power plays important roles in administrative structure and relational norms but communications are not explained three constructs. The result also indicates performances are partially affected by antecedents.

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A Study on Measurement of Crack Length by using Laser Speckle Interferometry (레이저 스페클 간섭을 이용한 균열 길이 측정에 관한 연구)

  • Kang, Young-June;Bae, Jin-Kil;Ryu, Weon-Jae;Park, Nan-Kyu
    • Journal of the Korean Society for Precision Engineering
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    • v.18 no.5
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    • pp.34-41
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    • 2001
  • More accurate and fast inspection method for mechanical parts and structure is required to guarantee the safety. Conventional methods using compliance method, eddy current method, ultrasonic wave, acoustic emission for non-destructive testing in mechanical parts and structure have been performed as the method of contact with objects to be inspected. With this reason these methods have been taken relatively much time, money, and manpower. In this study, in order to overcome these shortcomings, we used In-plane Electronic Speckle pattern Interferometry(In-plane ESPI) that was full-field measurement and noncontact method. We detected the cracks of the specimen at a real time and measured the length of the crack by using In-place ESPI system. Finally, we compared this results with conventional microscope method.

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