• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.320-323
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• 2005

This paper discusses heat problem of IC, which composes the electronic instruments, to guarantee reliability of electronic instruments. And also proposes the unified equivalent model for various electronic instrument products to guarantee reliability and life of its parts. Because electronic instruments are down sizing and operated with high frequency, the internal temperature of electronic instruments is rising steadily. The internal temperature of the electronic instruments gives a big effect to electronic instrument's reliability and life. The semiconductor parts are the representative heat generation parts because of its complicated function, high frequency and high density. Consequently, guaranteeing reliability and life of electronic semiconductor is the important start point in securing the reliability and life of the electronic instrument product. Unfortunately, there are many factors, which affect heat dissipation efficiency. The heat dissipation efficiency follows the environment where the electronic instrument products are used. Therefore it is very difficult to define reliability and life of the electronic manufactures. Electronic instrument products are composed of printed circuit board (PCB), integrated circuit (IC), resistance, and capacitor and so on. And there are superposed thermal resistances, because the parts are arrayed on the printed circuit board (PCB), Therefore the total thermal resistance is variable. Consequently it cannot have same thermal model for each electronic instrument products. In the next part, we propose the unified equivalent model for various electronic instruments. And using the proposed equivalent model proofs the method for analysis reliability of electronic parts.

• 한국전자통신학회논문지
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• 제15권4호
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• pp.617-624
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• 2020

급속한 속도로 과학기술이 나날이 발전하고 있는 현 추세와 더불어 방위산업의 주요특성인 개발기간의 장기화, 설계의 복잡성, 긴 수명주기로 인한 높은 부품단종 가능성, 소량생산 등으로 인해 위조 전자부품이 유입되어 무기체계의 신뢰성 저하를 유발시킬 가능성이 가중되고 있다. 본 논문은 개발이 완료되어 양산중인 무기 체계를 대상으로 위조 전자부품 검증을 위한 구체적인 식별기준을 도출하고, 다양한 식별 및 검증방안을 제시한다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 The 8th Asian Symposium on Precision Forging ASPF
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• pp.86-89
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• 2003

Airbag is important part for ensuring the driver and passenger's safety. The generator parts are typical parts difficult to be formed. BRIMET developed precision forming technologies for these parts and the technology has been applied in batch production. The parts produced by these technologies have been installed in some domestic trade mark cars. The technologies all have applied for patent.

• Journal of information and communication convergence engineering
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• 제1권4호
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• pp.209-212
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• 2003

In this paper, we proposed new speech feature parameter through parts-based feature extraction of speech spectrum using Non-Negative Matrix Factorization (NMF). NMF can effectively reduce dimension for multi-dimensional data through matrix factorization under the non-negativity constraints, and dimensionally reduced data should be presented parts-based features of input data. For speech feature extraction, we applied Mel-scaled filter bank outputs to inputs of NMF, than used outputs of NMF for inputs of speech recognizer. From recognition experiment result, we could confirm that proposed feature parameter is superior in recognition performance than mel frequency cepstral coefficient (MFCC) that is used generally.

• 항공우주시스템공학회지
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• 제10권2호
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• pp.1-6
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• 2016

The thermal analysis of electronic equipment is required to predict the reliability of electronic equipment being loaded on a satellite. The transient heat transfer of electronic equipment that was developed recently has been generated using a large-scale integration circuit. If there is a transient heat transfer between EEE(Electric, Electronic and Electro mechanical) parts, it may lead to failure the satellite mission. In this study, we performed the thermal design and analysis for reliability of APD(Antenna Pointing Driver) electronics for activation of a spaceborne X-band 2-axis antenna. The EEE parts were designed using a thermal mathematical model without the thermal mitigation element. In addition, thermal analysis was performed based on the worst case for verifying the reliability of EEE parts. For the thermal analysis results, the thermal stability of electronic equipment has been demonstrated by satisfying the de-rating junction temperature.

• 한국산업융합학회 논문집
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• 제26권3호
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• pp.463-470
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• 2023

In this study, an electronic parts assembly training system using Leap Motion was developed in consideration of the processes actually operated in the assembly process of electronic products. Based on Leap Motion and Oculus VR equipment, the system was developed to transfer user's hand movement data in real time and convert it into hand movement in virtual space so that electronic parts assembly simulation can be performed step by step. Through this, it was confirmed that the user can obtain an experience similar to the actual electronic parts assembly work, prevent errors that may occur during the assembly process, and improve proficiency. It is expected that this thesis will provide directions for the quality improvement and development of various education and training programs for virtual reality-based manufacturing processes.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.817-820
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• 2001

This machine is a high-vacuum exhaust sealing device which makes the inside of PDP element in high vacuum state, blows inactive gases into it and finally seals it. This machine consists of vacuuming parts, heating parts and exhausting parts. Applying the energy saving technology, this machine improves the temperature uniformity of vacuuming and heating parts.

• 한국재료학회지
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• 제20권4호
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• pp.204-209
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• 2010

Recent high efficiency electronic devices have been found to have heat emission problems. As for LEDs, an excessive increase in the device temperature causes a drop of the luminous efficiency and circuit lifetime. Therefore, heat release in the limited space of such electronic parts is very important. This is a study of the possibility of using a coating of carbon materials as a solution for the thermal emission problem of electronic devices. Powdered carbon materials, cokes, carbon blacks, amorphous graphite, and natural flakes were coated with an organic binder on an aluminum sheet and the subsequent thermal emissivity was measured with an FT-IR spectrometer and was found to be in the range of $5{\sim}20\;{\mu}m$ at $50^{\circ}C$. The emissivity of the carbon materials coated on the aluminum sheet was shown to be over 0.8 and varied according to carbon type. The maximum thermal emissivity on the carbon black coated-aluminum surface was shown to be 0.877. The emissivity of the anodized aluminum sheets that were used as heat releasing materials of the electronic parts was reported to be in the range of 0.7~0.8. Therefore, the use of a coating of carbon material can be a potential solution that facillitates heat dissipation for electronic parts.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 학술대회 논문집 정보 및 제어부문
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• pp.114-116
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• 2004

The temperature profile control issue in the resistive welder for the electronic parts is discussed. The average current of the welder tip depends on the phase(on-time) of the AC power and the tip temperature maintains or increases/decreases depending on the integral of the current square and heat loss, The basic PID control algorithm with thermo-couple feedback is difficult to track the temperature profile for various parts and optimal gain changes much. So constant gain PID algorithm is not enough to cover various electronic parts welding and a Fuzzy-PID automatic gain tuning algorithm is devised and added to conventional PID algorithm and this hybrid control architecture is implemented and the experimental results are shown.

• 한국군사과학기술학회지
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• 제11권3호
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• pp.58-66
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• 2008

In this paper, we have proposed a method and procedure which can find out the unknown network protocol. Although it seems to be difficult to identify the protocol, we can find out the rule in the packet according to the method we have proposed. We have to recognize functions of the system and make the list of events first. Then we capture the network packet whenever the event are occurred. The captured packets are examined by means of the method that is finding repeated parts, changed parts according to the input value, fixed parts and changed parts according to regular rules. Finally we make the test program to verify the protocol. We applied this method and procedure to upgrade Electronic Warfare Test System which is operated by ADD. We have briefly described the redesign of control and analysis software for Electronic Warfare Test System