• Title/Summary/Keyword: electronic parts

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A study of guaranteeing reliability for IC of electronic instruments according temperature

  • Yoon, Geon;Park, Yong-Oon;Kwon, Soon-Chang
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.320-323
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    • 2005
  • This paper discusses heat problem of IC, which composes the electronic instruments, to guarantee reliability of electronic instruments. And also proposes the unified equivalent model for various electronic instrument products to guarantee reliability and life of its parts. Because electronic instruments are down sizing and operated with high frequency, the internal temperature of electronic instruments is rising steadily. The internal temperature of the electronic instruments gives a big effect to electronic instrument's reliability and life. The semiconductor parts are the representative heat generation parts because of its complicated function, high frequency and high density. Consequently, guaranteeing reliability and life of electronic semiconductor is the important start point in securing the reliability and life of the electronic instrument product. Unfortunately, there are many factors, which affect heat dissipation efficiency. The heat dissipation efficiency follows the environment where the electronic instrument products are used. Therefore it is very difficult to define reliability and life of the electronic manufactures. Electronic instrument products are composed of printed circuit board (PCB), integrated circuit (IC), resistance, and capacitor and so on. And there are superposed thermal resistances, because the parts are arrayed on the printed circuit board (PCB), Therefore the total thermal resistance is variable. Consequently it cannot have same thermal model for each electronic instrument products. In the next part, we propose the unified equivalent model for various electronic instruments. And using the proposed equivalent model proofs the method for analysis reliability of electronic parts.

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A Study on Counterfeit Electronic Parts Identification and Verification Methods to Improve the Reliability of Weapons Systems in Mass Production Phase (양산단계 무기체계 신뢰성 향상을 위한 위조 전자부품 식별 및 검증 방안에 대한 연구)

  • Kim, Byung-Jun
    • The Journal of the Korea institute of electronic communication sciences
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    • v.15 no.4
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    • pp.617-624
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    • 2020
  • Due to the rapid development of science technology and the main characteristics of the defense industry, such as long development period, design complexity, high possibility of discontinuing parts due to long life cycle, and small quantity production, it can cause increasing of the inflow possibility of counterfeit electronic parts and deteriorating the reliability of weapons systems. This paper presents the specific criteria for the identification of electronic parts to be verified for mass produced weapons systems after the development is completed, and the identification and verification methods for the inflow of counterfeit electronic components.

THE APPLICATION OF PRECISION FORMING TECHNOLOGY FOR AIRBAG GENERATOR IN CHINA

  • Xiaoguang Zhang;Zhe Wei;Zhiping Zhong;Yi Bian
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.10b
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    • pp.86-89
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    • 2003
  • Airbag is important part for ensuring the driver and passenger's safety. The generator parts are typical parts difficult to be formed. BRIMET developed precision forming technologies for these parts and the technology has been applied in batch production. The parts produced by these technologies have been installed in some domestic trade mark cars. The technologies all have applied for patent.

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Parts-Based Feature Extraction of Spectrum of Speech Signal Using Non-Negative Matrix Factorization

  • Park, Jeong-Won;Kim, Chang-Keun;Lee, Kwang-Seok;Koh, Si-Young;Hur, Kang-In
    • Journal of information and communication convergence engineering
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    • v.1 no.4
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    • pp.209-212
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    • 2003
  • In this paper, we proposed new speech feature parameter through parts-based feature extraction of speech spectrum using Non-Negative Matrix Factorization (NMF). NMF can effectively reduce dimension for multi-dimensional data through matrix factorization under the non-negativity constraints, and dimensionally reduced data should be presented parts-based features of input data. For speech feature extraction, we applied Mel-scaled filter bank outputs to inputs of NMF, than used outputs of NMF for inputs of speech recognizer. From recognition experiment result, we could confirm that proposed feature parameter is superior in recognition performance than mel frequency cepstral coefficient (MFCC) that is used generally.

Thermal Analysis of APD Electronics for Activation of a Spaceborne X-band 2-axis Antenna (위성 데이터 전송용 2축 짐벌식 X-band 안테나 구동용 전장품 APD 열 해석)

  • Ha, Heon-Woo;Kang, Soo-Jin;Kim, Tae-Hong;Oh, Hyun-Ung
    • Journal of Aerospace System Engineering
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    • v.10 no.2
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    • pp.1-6
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    • 2016
  • The thermal analysis of electronic equipment is required to predict the reliability of electronic equipment being loaded on a satellite. The transient heat transfer of electronic equipment that was developed recently has been generated using a large-scale integration circuit. If there is a transient heat transfer between EEE(Electric, Electronic and Electro mechanical) parts, it may lead to failure the satellite mission. In this study, we performed the thermal design and analysis for reliability of APD(Antenna Pointing Driver) electronics for activation of a spaceborne X-band 2-axis antenna. The EEE parts were designed using a thermal mathematical model without the thermal mitigation element. In addition, thermal analysis was performed based on the worst case for verifying the reliability of EEE parts. For the thermal analysis results, the thermal stability of electronic equipment has been demonstrated by satisfying the de-rating junction temperature.

A Study on the Development of an Electronic Component Assembly Training System Using Leap Motion (Leap Motion을 이용한 전자부품 조립 훈련 시스템 개발에 관한 연구)

  • In-Chul Lee
    • Journal of the Korean Society of Industry Convergence
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    • v.26 no.3
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    • pp.463-470
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    • 2023
  • In this study, an electronic parts assembly training system using Leap Motion was developed in consideration of the processes actually operated in the assembly process of electronic products. Based on Leap Motion and Oculus VR equipment, the system was developed to transfer user's hand movement data in real time and convert it into hand movement in virtual space so that electronic parts assembly simulation can be performed step by step. Through this, it was confirmed that the user can obtain an experience similar to the actual electronic parts assembly work, prevent errors that may occur during the assembly process, and improve proficiency. It is expected that this thesis will provide directions for the quality improvement and development of various education and training programs for virtual reality-based manufacturing processes.

The manufacturing Process Improvement usung Display of high VacuumExhausted Sealing Equipment by Tipless Manner (Tipless 방식에 의한 디스플레이 고진공 배기 밀봉장치 개발에관한 공정개발연구)

  • 김수용;박승곤;정원채
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.817-820
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    • 2001
  • This machine is a high-vacuum exhaust sealing device which makes the inside of PDP element in high vacuum state, blows inactive gases into it and finally seals it. This machine consists of vacuuming parts, heating parts and exhausting parts. Applying the energy saving technology, this machine improves the temperature uniformity of vacuuming and heating parts.

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Thermal Emission Effect of Electronic Parts Using Carbon Materials (탄소물질을 이용한 전자부품의 열 방출효과)

  • Eom, Woon-Yong;Roh, Jae-Seung;Seo, Seung-Kuk;Ahn, Jai-Sang;Kang, Dong-Su;Kim, Suk-Hwan
    • Korean Journal of Materials Research
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    • v.20 no.4
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    • pp.204-209
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    • 2010
  • Recent high efficiency electronic devices have been found to have heat emission problems. As for LEDs, an excessive increase in the device temperature causes a drop of the luminous efficiency and circuit lifetime. Therefore, heat release in the limited space of such electronic parts is very important. This is a study of the possibility of using a coating of carbon materials as a solution for the thermal emission problem of electronic devices. Powdered carbon materials, cokes, carbon blacks, amorphous graphite, and natural flakes were coated with an organic binder on an aluminum sheet and the subsequent thermal emissivity was measured with an FT-IR spectrometer and was found to be in the range of $5{\sim}20\;{\mu}m$ at $50^{\circ}C$. The emissivity of the carbon materials coated on the aluminum sheet was shown to be over 0.8 and varied according to carbon type. The maximum thermal emissivity on the carbon black coated-aluminum surface was shown to be 0.877. The emissivity of the anodized aluminum sheets that were used as heat releasing materials of the electronic parts was reported to be in the range of 0.7~0.8. Therefore, the use of a coating of carbon material can be a potential solution that facillitates heat dissipation for electronic parts.

Fuzzy-PID Gain Scheduling Algorithm of Resistive Welder for Electronic Parts (전자부품용 저항용접기의 퍼지-PID 이득조정 알고리즘)

  • Park, Myung-Kwan;Lee, Jong-Woon
    • Proceedings of the KIEE Conference
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    • 2004.11c
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    • pp.114-116
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    • 2004
  • The temperature profile control issue in the resistive welder for the electronic parts is discussed. The average current of the welder tip depends on the phase(on-time) of the AC power and the tip temperature maintains or increases/decreases depending on the integral of the current square and heat loss, The basic PID control algorithm with thermo-couple feedback is difficult to track the temperature profile for various parts and optimal gain changes much. So constant gain PID algorithm is not enough to cover various electronic parts welding and a Fuzzy-PID automatic gain tuning algorithm is devised and added to conventional PID algorithm and this hybrid control architecture is implemented and the experimental results are shown.

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Development of Control and Analysis Software for Electronic Warfare Test System Using Reverse Engineering of Network Protocol (프로토콜 역설계를 이용한 전자전시험장비 제어 및 신호분석 소프트웨어 개발)

  • Jung, In-Hwa
    • Journal of the Korea Institute of Military Science and Technology
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    • v.11 no.3
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    • pp.58-66
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    • 2008
  • In this paper, we have proposed a method and procedure which can find out the unknown network protocol. Although it seems to be difficult to identify the protocol, we can find out the rule in the packet according to the method we have proposed. We have to recognize functions of the system and make the list of events first. Then we capture the network packet whenever the event are occurred. The captured packets are examined by means of the method that is finding repeated parts, changed parts according to the input value, fixed parts and changed parts according to regular rules. Finally we make the test program to verify the protocol. We applied this method and procedure to upgrade Electronic Warfare Test System which is operated by ADD. We have briefly described the redesign of control and analysis software for Electronic Warfare Test System