• Title/Summary/Keyword: electronic paper

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Temperature Dependence Characteristics of Double Cylindrical Type Ozonizer (2중 원통형 오존발생기의 온도의존특성)

  • Chun, Byung-Joon;Lee, Sang-Keun;Song, Hyun-Jik;Lee, Kwang-Sik;Lee, Dong-In
    • Proceedings of the KIEE Conference
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    • 1998.11c
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    • pp.953-955
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    • 1998
  • In this paper, a double cylindrical type ozonizer has been designed and manufactured to improve ozone yield by cooling external electrode. The ozonizer equipped with three electrodes( central, internal and external electrodes ) and two gaps. Discharge and ozone characteristics are described in this paper by varying flux( Q ) of oxygen supplied gas, temperature of cooling gas and supplied voltage.

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Design and Implementation of Web-based Electronic Bidding System using XML (웹 기반의 XML을 활용한 전자 입찰 시스템의 설계 및 구현)

  • 윤선희
    • The Journal of Information Systems
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    • v.10 no.1
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    • pp.127-146
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    • 2001
  • The area of business applications in the internet are extended enormously in result of fast development of computing and communication technologies, increase of internet use, and use of intranet/extranet in enterprise information system. Widely spread the use of the internet, there are various applications for Business to Business (B to B) or Business to Customer(B to C) model that are based on the intranet or extranet. This paper designed and implemented the Web-based Electronic Bidding System for Business to Business (B to B) model. The technical issues of electronic bidding system in the internet are involved in the connection between web client and server, electronic data interchange for the contract document, and security solution during the bidding and contracting processes. The web-based electronic bidding system in this paper is implemented using Java applet and servlet as a connection interface for web client and server, XML/EDI-based documents for a bid and a contract, and bidding server and notary server for enhancing the security using PKI(Public Key Infrastructure)-based public key cryptography, digital signature and Certification Authority(CA).

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Effect of aging toner type particles using pulse waveform (Pulse waveform을 이용한 Toner type particles의 Aging 효과)

  • Oh, Yoo-Mi;Kim, Kyung-Soo;Kim, Sung-Woon;Youn, Hae-Sang;Park, Sun-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.142-142
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    • 2010
  • This research proposed an advanced Electronic bead (EB) using MMA (Methy methacrylate) and CCA (Charge Control Agent). In the first, this paper presents about measurement method and characterization analysis of EB and nano-silica with pulse waveform in aging. Furthermore; this work presents the positive and negative EB fabrication procedure. As the experimental results, the proposed EB with square waveform is very attractive to Electronic paper driving characterization.

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A Design of Charge Pump with Up/Down Current Mismatch Compensation for PHS Application (Up/Down Current Mismatch 보상 기능을 추가한 Charge Pump 회로의 설계)

  • Kim, Sang-Woo;Park, Joon-Sung;Ko, Dong-Hyun;Pu, Young-Gun;Lee, Kang-Yoon
    • Proceedings of the IEEK Conference
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    • 2008.06a
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    • pp.472-473
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    • 2008
  • This paper presents a charge pump used in frequency synthesizer for PHS application. The up/down current mismatch of charge pump has a critical effect on the phase noise and spur performance in frequency synthesizer. Therefore, the mismatch compensation scheme is proposed in this paper. And, the measurement results show that the mismatch can be reduced below 5 %.

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The Object 3D Pose Recognition Using Stereo Camera (스테레오 카메라를 이용한 물체의 3D 포즈 인식)

  • Yoo, Sung-Hoon;Kang, Hyo-Seok;Cho, Young-Wan;Kim, Eun-Tai;Park, Mig-Non
    • Proceedings of the IEEK Conference
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    • 2008.06a
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    • pp.1123-1124
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    • 2008
  • In this paper, we develop a program that recognition of the object 3D pose using stereo camera. In order to detect the object, this paper is applied to canny edge detection algorithm and also used stereo camera to get the 3D point about the object and applied to recognize the pose of the object using iterative closest point(ICP) algorithm.

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Chemical and Mechanical Balance in Polishing of Electronic Materials for Defect-Free Surfaces (전자재료 표면의 무결함 연마를 위한 화학기계적 균형)

  • Jeong, Hae-Do;Lee, Chang-Suk;Kim, Ji-Yoon
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.1
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    • pp.7-12
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    • 2012
  • Chemical mechanical polishing(CMP) technology is faced with the challenge of processing new electronic materials. This paper focuses on the balance between chemical and mechanical reactions in the CMP process that is required to cope with a variety of electronic materials. The material properties were classified into the following categories: easy to abrade(ETA), difficult to abrade(DTA), easy to react(ETR) and difficult to react(DTR). The chemical and mechanical balance for the representative ETA-ETR, DTA-ETR, ETA-DTR and DTA-DTR materials was considered for defect-free surfaces. This paper suggests the suitable polishing methods and examples for each electronic material.

Implementation of HTML Filter with structured Decks (계층 구조의 Deck를 갖는 HTML Filter 구현 방안)

  • Kim, Dae-Geon;Lee, Seung-Jin;Kang, Kyung-Young;Choi, Lynn;Kang, Chul-Hee
    • Proceedings of the IEEK Conference
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    • 2001.06a
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    • pp.141-144
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    • 2001
  • This paper has been studied a implementation of HTML Filter with structured decks. In wireless environment, conventional HTML Filter converts HTML document to WML by once. However, it is more efficient to access a WEB site by transmitting the minimal capacity of core data in WAP environment. Therefore this paper suggests new HTML Filter that automatically analyze the contents of HTML WEB and transmits it by selecting the one of many Decks that have the structured architecture. Also the protocol between wireless terminal and WAP Gateway is considered. Finally, We test the proposed HTML Filter with structured Decks for some particular web site.

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Processing Study for the Piezoelectric Energy Harvest of Composit Structure (복합구조의 압전 에너지 하베스터를 위한 공정연구)

  • Lee, Kyoung-Soo;Shin, Dong-Jin;Koh, Jung-Hyuk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.4
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    • pp.286-289
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    • 2012
  • In this paper, we have proposed piezoelectric energy harvester employing the pillar structure with the diameter size of 500 um. So we have selected the Su-8 photo-resist and modified lithography process to manufacture the pillar structure with height above the $500{\mu}m$. Simultaneously, we tried to make a comparative study to use ceramic bulk - polymer structure In this paper, we will report the process and properties of micro pillar structure based on the PMN-PZT ($Pb(Mg_{1/3}Nb_{2/3})O_3-PbZrTiO_3$) materials. Finally, We will propose a method for generating electrical energy with a piezoelectric element using vibration, an energy source can be obtained from the "clean" energy.

Information Security Market Analysis (국내 전자화폐시장 전망)

  • 박성욱;이현우
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2003.10a
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    • pp.652-655
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    • 2003
  • This paper represents the electronic money market forecast. The cash, check and traditional settlement means transfer the electronic money with information technique. This paper forecasts not only the use of electronic money markets but also the scale of electronic money. So, the purpose of this study is to forecast and analyze the present situation of electronic money market.

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Bondability of Different Electronic Materials by Micro Heat source (마이크로 열원에 의한 이종전자재료의 접합성)

  • 이철인;서용진;신영의;장의구
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1994.11a
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    • pp.206-209
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    • 1994
  • This paper has been researched bondability of electronic devices, such as lead frame and thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to control both the thermal distribution of the bonds and it stability, because electronics components is consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realzed fluxless bonding process with filler metal such as plating layers.