• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.768-771
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• 2003

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, electronic equipment (KOMPSAT 2, RDU : Remote Drive Unit) of a satellite consists of aluminum case containing PCB (Printed circuit boards). Each PCB has resistors and IC (Integrated circuits). Noise and vibration of wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation. random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when tile frequency of random vibration meets with natural frequency of PCB. fatigue fracture nay occur in the part of solder joint. The launching environment, thus. needs to be carefully considered when designing the electronic equipment of a satellite. In general. the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM(Finite Element Method) or vibration test. In this study. the natural frequency and dynamic deflection of PCB are measured by FEM, aud the safety of the electronic components of PCB is being evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs from the electronic equipments of a satellite to home electronics.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.5
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• pp.74-82
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• 2015

As the complexity of an electronic device and the reduction of its operating voltage is progressing, susceptibility test of the chip and module for internal or external noises is essential. Although the immunity compliance of the chip was served with IEC 62132-4 Direct Power Injection method as an industry standard, in fact, EM immunity of the chip is influenced by their Power Domain Network (PDN). This paper evaluates the EM noise tolerance of a PLL and compares their noise transfer characteristics to the PLL on various PCB boards. To make differences of the PDNs of PCBs, various PCBs with or without LDO and with several types of capacitors are tested. For evaluation of discrepancies between EM characteristics of an IC only and the IC on real boards, the analysis of the noise transfer characteristics according to the PDNs shows that it gives important information for the design having robust EM characteristics. DPI measurement results show that greatly improved immunity of the PLL in the low-frequency region according to using the LDO and a frequency change of the PLL according to the DPI could also check with TEM cell measurement spectrum.

• Journal of the Korea Furniture Society
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• v.22 no.1
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• pp.72-81
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• 2011

These days, beds have been developed not as furniture to sleep in but Healthcare Furniture. The function of heating, non-electronic-waves and far-infrared rays have been added. Also, eco-friendly materials such as stone, mud, rubber and wood are combined to them together with the radiation-heating method using heat conduction through electronic coil and hot water circulation. Modern people suffer from stress and fatigue. The hot issue is "health." Focused on the health, the development of design for beds considering the influence electronic waves, anions, deep sleep and the density of toxic materials have on human bodies has become urgent. In this study, the trend, specification and efficiency of the functional health-related electronic coil technology are analyzed. Through the analysis, the environmental standards are set. According to them, technology, eco-friendly materials and additional functions for the development of the design are considered. Also, the government is promoting the IEC international standardization for the Korean traditional floor heating style beds. In preparation for that, we adopted new HPT method technology. It enables non-electronic-waves, low electricity and stable temperature maintenance control for the warm top and the cool bottom. Also, the head boards and the frames of the beds can be separated. Through this separation, the beds can be easily moved or installed. Eco-friendly materials such as Hinoki cypress wood and red clay and the existing tables function are combined to the head boards so they can be used as drawers and display shelves. If they are used as separate items, they can be used as covers. This is how we suggest the design for the heating beds.

• Transactions of the Korean Society of Mechanical Engineers
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• v.13 no.4
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• pp.771-779
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• 1989

Numerical analysis by SIMPLE algorithm has been performed to predict the characteristics of flow and heat transfer in channels between the printed circuit boards of an electronic cabinet. It is assumed that the electronic parts release uniform heat flux per unit axial length to the cooling air. The air flow between channels is assumed fully developed laminar, incompressible, and mixed convective. In this study, the electronic parts are mounted on both sides of the prinked circuit boards by two kinds of configuration such as the zig-zag and the symmetric one. The Rayleigh numbers ranging from 0 to 10$^{6}$ are considered to predict the characteristics of the main flow and the secondary flow occurred by natural convection, the temperature distribution in channel, the heat transfer rate from heated electronic parts and the increase of friction factor by natural convection. As the results of numerical calculation, several conclusions are drawn as follows. The influence of natural convection on the flow characteristics appears strong when the Rayleigh number is above 10$^{4}$. The main axial flow rate decreases by a half or more at the Rayleigh number of 10$^{6}$ . Although the friction factor increases as Rayleigh number increases, the increasing rate of heat transfer is higher than that of the friction factor. The cooling efficiency of the zig-zig-configuration is superior to that of the symmetric configuration at same Rayleigh number.

• Proceedings of the KIPE Conference
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• 1998.10a
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• pp.458-463
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• 1998

The paper describes the methods and means of measurement and study of vibrations, stresses and shocks affecting electronic equipment during its use and in the testing stage as well as original units to determine shapes and frequencies of vibrations of functional boards. Particular attention has been given to the development of methods and means to protect sturctures against vibrations and shocks.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.10 no.6
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• pp.506-511
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• 2017

LED lighting, which many companies are pursuing commercialization, is a representative green energy technology. However, the LED lighting for broadcasting image should have high output and easy portability compared with general LED lighting devices for street lamps, advertisement or transportation devices. Therefore, while shooting a broadcast image if you use LEDs as a substitute light source for halogen lamps and fluorescent lamps that are large in size and uncomfortable to handle it is expected that the lightening of the equipment will activate the broadcasting image lighting equipment industry. After considering the mass production of the LED module board and the SMT production size of the chip mounter, the board size was determined considering the overall size of the product by model. In this paper, four 20W LED boards are arranged vertically in order to produce an 80W board. In other words, by sharing LED module board size by model, high power LED lighting equipments of 120W and 200W can be selected as an increase in the number of boards.

• Journal of Welding and Joining
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• v.21 no.6
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• pp.46-54
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• 2003

The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.60-60
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• 2008

We manufactured Liquid Crystal Polymer (LCP) and (1-x)$BaTiO_3-xSrTiO_3$(BST) ceramic composites and investigated dielectric properties to use as embedded capacitor in printed circuit boards and replace LTCC substrates. The dielectric properties of these composites are varied with volume fraction of BST and ratios of BT/ST. Dielectric constants are in the range of 3~28. In addition, we could get low TCC and High Q value that could not achieve in other ceramic-polymer composites. Especially, in composite with x=0.4 and 50vol% BST, the dieletric constant and Q-value are 27 and 300, respectively. And more TCC is -116~145ppm/$^{\circ}C$ in the temperature range of -55~$125^{\circ}C$. We think that this composites can be used high-Q substrate material like LTCC and embedded temperature compensation capacitor in printed circuit boards.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.232-233
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• 2007

We manufactured Liquid Crystal Polymer (LCP) and (1-x)CaTiO3-xLaAlO3 (CT-LA) ceramic composites and investigated dielectric properties to use as embedded capacitor in printed circuit boards and replace LTCC substrate. The dielectric properties of these composites are varied with volume fraction of CT-LA and ratios of CT/LA. Dielectric constants are in the range of 3~15. In addition, we could get low TCC and High Q value that could not achieve in other ceramic-polymer composites. Especially, in composite with x=0.01 and 30 vol% CT-LA, the dieletric constant and Q-value are 10 and 200, respectively. And more TCC is $-28{\sim}300ppm/^{\circ}C$ in the temperature range of $-55{\sim}125^{\circ}C$. We think that this composites can be used high-Q substrate material like LTCC and embedded temperature compensation capacitor in printed circuit boards.

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.410-413
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• 2004

In this paper, a simulator system for Fuel Cell Hybrid Electric Vehicles(FCHEV) is implemented using DSP boards with CAN bus. The subsystems of a FCHEV i.e., the fuel cell system, the battery system, the vehicle dynamics with the transmission mechanism are coded into 3 DSP boards. The power distribution control algorithm and battery SOC control are also coded into a DSP board. The real-time monitoring program is also developed to examine the control performance of power control and SOC control algorithms.