• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.708-711
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• 1999

The Cu/Ni/Au lamellar structure is extensively used as an under bump metallization on silicon file, and on printed circuit board(PCB) pads. Ni is plated Cu by either electroless Ni plating, or electrolytic Ni plating. Unlike the electrolytic Ni plating, the electroless Ni plating does not deposit pure Ni, but a mixture of Ni and phosphorous, because hypophosphite Is used in the chemical reaction for reducing Ni ions. The fracture crack extended at the interface between solder balls of plastic ball grid (PBGA) package and conducting pads of PCB. The fracture is duets to segregation at the interface between Ni$_3$Sn$_4$intermetallic and Ni-P layer. The XPS diffraction results of Cu/Ni/Au results of CU/Ni/AU finishs showed that the Ni was amorphous with supersaturated P. The XPS and EDXA results of the fracture surface indicated that both of the fracture occurred on the transition lesion where Sn, P and Ni concentrations changed.

• Corrosion Science and Technology
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• v.18 no.4
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• pp.148-153
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• 2019

Pure nickel with a thickness of 1 mm was plated on type 304 stainless steels and low alloy steels (JIS G3131 SPHC) by electrolytic plating method in a circulating plating bath. Plating performance, mechanical properties, and surface characteristics were evaluated in terms of pretreatment process, anode material, pH, current density, and flow rate of the plating solution. Addition of hydrochloric acid during pre-treatment process improved the adhesion performance of plating. To improve plating efficiency, it is desirable to use S-nickel rather than electrolytic nickel. The use of S-nickel was also confirmed to be desirable for maintaining the pH and concentration of the plated solution. The defect of the plating using S-nickel anode produced pit on the surface. However, it is believed that proper control can be obtained by increasing the flow rate. Internal stress and hardness values of electrolytic nickel plating according to current density need to be carried out with further studies.

• Polymer(Korea)
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• v.24 no.5
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• pp.721-727
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• 2000

The electrolytic plating of a metallic nickel on carbon fiber surfaces was carried out to improve mechanical interfacial properties of carbon fiber/epoxy resin composites. The surface characteristics of carbon fibers and the mechanical interfacial properties of final composites were characterized by X-ray photoelectron spectroscopy (XPS) and interlaminar shear strength (ILSS), respectively. It was found that the electrolytic Ni-plating conditions significantly affected the degree of adhesion at interfaces between carbon fibers and epoxy resin matrix in a composite system. Especially, the increase of O,$_{1s}$/$C_{1s}$ ratio, production of NiO groups, and formation of metallic nickel on the nickel-plated carbon fiber surfaces led to an increase of the ILSS of the composites. Also, the ILSS of the composites was greatly correlated with the $O_{1s}$/$C_{1s}$ ratio of the carbon fibers treated in this work.is work.

• 한국태양에너지학회:학술대회논문집
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• 2009.11a
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• pp.350-355
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• 2009

The crysralline silicon solar cell where the solar cell market grows rapidly is occupying of about 85% or more high efficiency and low cost endeavors many crystalline solar cells. The fabricaion process of high efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/AG contact, This metal contacts have only been used in limited areas in spite of their good srability and low contact resistance because of expensive materials and process. Commercial solar cells with screen-printed solar cells formed by using Ag paste suffer from loe fill factor and high contact resistance and low aspect ratio. Ni and Cu metal contacts have been formed by using electroless plating and light-induced electro plating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on 0.2~0.6${\Omega}$ cm, $20{\times}20mm^2$, CZ(Czochralski) wafer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.444-445
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• 2009

The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on $0.2\sim0.6\;{\Omega}{\cdot}cm$, $20\;\times\;20\;mm^2$, CZ(Czochralski) wafer.

• Journal of the Korea Convergence Society
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• v.8 no.11
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• pp.307-312
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• 2017

In the industry, galvanizing using the principle of sacrificial anode is used Zn-Ni alloy plating was developed as one of the measures to increase the corrosion resistance rather than pure zinc plating. The alloy plating layer has a corrosion resistance of 4-5 times that of the pure zinc plating layer, so that it is applied to automotive parts requiring high corrosion resistance even though the plating cost is high. The amount of Zn-Ni alloy plating solution is a sulfuric acid bath, a chlorinated bath, an alkali bath, and an ammonia bath. Here, the influence of the electrolytic conditions on the composition of the alloy plating in the chloride bath was investigated. The results are explained by the cathode overvoltage and the diffusion coefficient. In general, as the overvoltage of the cathode increases, the concentration polarization becomes more important than the activation polarization. The concentration polarization is determined by element diffusion in the diffusion layer. That is, as the overvoltage of the cathode increases, the Zn content having a large diffusion coefficient increases.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.214-219
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• 2009

In high-efficiency crystalline silicon solar cells, If high-efficiency solar cells are to be commercialized. It is need to develop superior contact formation method and material that can be inexpensive and simple without degradation of the solar cells ability. For reason of plated metallic contact is not only high metallic purity but also inexpensive manufacture. It is available to apply mass production. Especially, Nickel, Copper and Silver are applied widely in various electronic manufactures as easily formation is available by plating. The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposite the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 14.68 % on $0.2{\sim}0.6{\Omega}{\cdot}cm,\;20{\times}20mm^2$, CZ(Czochralski) wafer.

• Journal of the Korean Society of Clothing and Textiles
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• v.23 no.5
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• pp.694-702
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• 1999

By using commercial available electromagnetic interference (EMI) shielding fabrics, EMI shielding effectiveness(SE) and the physical properties were investigated. Thirteen specimens were chosen six fabrics were non-electrolytic plated with Cu, six plated with Cu+Ni and one plated with Ni, SE was measured by RF Impedance Analyzer HP4291A(Hewlett Co, Ltd)at the frequency of 100MHz-1.8GHz. The results showed that the commercial EMI shielding fabrics provided SE values over 30dB at the frequency of 100MHz-1.8GHz. Fabrics plated with Cu showed more effective shielding than those plated with Ni. The thickness of coating and fabric count were also influential factors on SE. Tensile properties were acceptable for lining fabrics but water vapor transport properties indicated that the better treatment condition were suggested to improve comfort properties.

• Polymer(Korea)
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• v.27 no.1
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• pp.52-60
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• 2003

In this work, two types of Ni-plating, namely electrolytical and electroless Ni-platings on carbon fiber surfaces, were carried out to enhance the impact resistance of composites. And the comparison between electrolytical and electroless methods on their impact properties of composite system was studied. The surface properties of carbon fibers were characterized using XRD, SEM, and contact angle measurements. The impact behaviors were investigated using an Izod type impact tester. As experimental results, it was observed that electrolessly plated Ni layers had Ni-P alloys on carbon fiber surfaces as revealed by XRD, and electrolytically Ni-plated carbon fibers showed higher surface free energies than those of the electrolessly Ni-plated carbon fibers. In particular, the impact strengths of electrolessly Ni-plated carbon fibers-reinforced plastics were strongly increased. These results were probably due to the difference of wettabilities according to the different types of Ni-plating methods.

• Corrosion Science and Technology
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• v.7 no.1
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• pp.61-67
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• 2008

In this paper, electrochemical and microstructural characteristics of nickel-plated Alloy 600 were investigated in order to identify the performance of electroless Ni-plating on Alloy 600 in high-temperature aqueous condition with the comparison of electrolytic nickel-plating. For high temperature corrosion test of nickel-plated Alloy 600, specimens were exposed for 770 hours to typical PWR primary water condition. During the test, open circuit potentials (OCP's) of all specimens were measured using a reference electrode. Also, resistance to flow accelerated corrosion (FAC) test was examined in order to check the durability of plated layers in high-velocity flow environment at high temperature. After exposures to high flow rate aqueous condition, the integrity of surfaces was confirmed by using both scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). For the field application, a remote process for electroless nickel-plating was demonstrated using a plate specimen with narrow gap on a laboratory scale. Finally, a practical seal design was suggested for more convenient application.