• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.4
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• pp.1-5
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• 2002

A 110 m diameter aspheric metal secondary mirror for a test model of an earth observation satellite camera was fsbricated by ultra-precision single point diamond turning (SPDT). Aluminum alloy for mirror substrates is known to be easily machinable, but not polishable due to its ductility. A harder material, Ni, is usually electrolessly coated on an A1 substrate to increase the surface hardness for optical polishing. Aspheric metal secondary mirror without a conventional polishing process, the surface roughness of Ra=10nm, and the form error of Ra=λ/12(λ=632.8nm) has been required. The purpose of this research is to find the optimum machining conditions for reflector cutting of electroless-Ni coated A1 alloy and apply the SPDT technique to the manufacturing of ultra precision optical components of metal aspheric reflector.

• Composites Research
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• v.20 no.5
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• pp.43-48
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• 2007

The absorption and the interference shielding of electromagnetic wave have been very important issues for commercial and military purposes. The stealth technique is one of the most typical applications of electromagnetic wave absorption technology. This study has started for the development of composite fillers containing dielectric and magnetic lossy materials. To improve the electromagnetic characteristics of conductive nano fillers, carbon nanofibers (CNFs) with nickel-phosphorous (Ni-P) or nickel-iron (Ni-Fe) have been fabricated by the electroless plating process. Observations by the electron microscopy (SEM/TEM) and element analyzer (EDS/ELLS) showed the uniform Ni-P and Ni-Fe coated CNFs. The compositions of the plating layers were about Ni-6wt%P and Ni-70wt%Fe, respectively. The average thicknesses of the plating layers were about $50\;{\sim}\;100\;nm$.

• Journal of the Korean institute of surface engineering
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• v.48 no.5
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• pp.199-204
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• 2015

Recently, fuel cell is a good alternative for energy source. Separator is a important component for fuel cell. In this study, The surface of separator was modified for corrosion resistance and electric conductivity. Reduced graphene oxide (rGO) was made by Staudenmaier's method. Nickel, phosphorus and rGO were coated on 6061 aluminum alloy as a separator of proton exchange membrane fuel cell by composite electroless plating. Scanning electron microscope, energy-dispersive X-ray spectroscopy and X-ray photoelectron spectroscopy were used to examine the morphology of Ni-P-rGO. Surface images were shown that the rGO was dispersed on the surface of Ni-P electroless plating, and nickel was combined with the un-reduced oxygen functional group of rGO.

• Proceedings of the KSME Conference
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• 2001.06c
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• pp.83-87
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• 2001

A 110 mm diameter aspheric metal secondary mirror for a test model of an earth observation satellite camera was fabricated by ultra-precision single point diamond turning (SPDT). Aluminum alloy for mirror substrates is known to be easily machinable, but not polishable due to its ductility. A harder material, Ni, is usually electrolessly coated on an Al substrate to increase the surface hardness for optical polishing. Aspheric metal secondary mirror without a conventional polishing process, the surface roughness of Ra=10nm, and the form error of $Ra={\lambda}/12({\lambda}=632nm)$ has been required. The purpose of this research is to find the optimum machining conditions for reflector cutting of electroless-Ni coated Al alloy and apply the SPDT technique to the manufacturing of ultra precision optical components of metal aspheric reflector.

• Journal of the Korean institute of surface engineering
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• v.41 no.6
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• pp.312-324
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• 2008

In this study, the functional property as a super abrasive material was secured for CBN powder by the electroless Ni-P plating on the surface of the particle. The plating solution has been prepared to control the surface morphology by regulating surfactants and process conditions. The effects of processing parameters on the surface morphology of CBN powder was discussed. The results are summarized as follows; A stable plating tendency was achieved from 1 hour after quantitatively dropping reducing agent. It was observed that more than 50% of the weight gain was obtained by Ni-P coating on the surface of CBN super abrasive powder. The morphology of the Ni-P coating layer is consisted of botryoidal and spiky type and it could be controlled by regulating processing parameters. Superior characteristic in terms of surface morphology was found in the nonionic surfactant XL-80N. It was found that XL-80N considerably decreased surface tension of CBN powder and Ni-P alloy surface then enhance wettability as well as plating rate. Metal coated CBN powder as a raw material of resin bond wheel has been developed through this investigation.

• Proceedings of the Korean Magnestics Society Conference
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• 2001.04a
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• pp.146-147
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• 2001

• Korean Journal of Materials Research
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• v.15 no.12
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• pp.765-772
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• 2005

PAS(Plasma Activated Sintering) process was tried to apply for the fabrication of BMG(Bulk Metallic Glasses) of $Ni_{57}Zr_{20}Ti_{18}Si_5}\;and\;Ni_{57}Zr_{20}Ti_{18}Si_3Sn_2$ from the as-atomized amorphous powder. Compressive strength for the BMG(bulk Metallic Glasses) of $Ni_{57}Zr_{20}Ti_{18}Si_5$ were lower than those of BMG rods produced by warm extrusion ,or copper mold casting method. Microstructural examination by optical microcope, SEM ana EDS showed that oxidation had occurred during PASintering. In order to prevent the powder from the oxidation during PASintering, Ni coating for $Ni_{57}Zr_{20}Ti_{18}Si_5$ amorphous powder by electroless-plating method was performed. Microstructural examination for Ni coated layers after PASintering indicated that the Ni coating had been so effective to prevent powder from oxidation during PASintering. Sintering behaviors of $Ni_{57}Zr_{20}Ti_{18}Si_3Sn_2$ represent the same as those of $Ni_{57}Zr_{20}Ti_{18}Si_5$.

• The Korean Journal of Ceramics
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• v.7 no.2
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• pp.74-79
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• 2001

Alumina composite reinforced by chopped alumina fiber was fabricated by filter-pressing the fiber slurry followed by the infiltration of alumina slurry. The chopped fiber was coated with nickel by electroless plating method. The green samples were densified by hot-pressing. Microstructures were studied by SEM and the mechanical properties such as bending strength and fracture toughness were measured. The resulting mechanical properties were analyzed in relation with processing parameters such as preform density and resulting microstructures. The load-displacement curve of the specimen with Ni interlayer but without Ni inclusion showed brittle fracture mode due to the direct contact between matrix and fiber. The load-displacement curve of the specimen with Ni interlayer and Ni inclusion in the matrix which is introduced by high applied pressure during specimen preparation showed non-brittle fracture mode due to the fiber pull-out and dutile phases in the matrix.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

• Korean Journal of Materials Research
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• v.23 no.11
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• pp.661-665
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• 2013

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.