• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.918-921
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• 2002

Some investigators who have tried to achieve the highly smooth surface finish using electrochemical processes have reported that high current density produced lustrous surfaces while the opposite conditions produced a passive layer and had a tendency to produce a black surface. However, processing at a low current density may produce a non-lustrous surface but the improvement of dimensional accuracy of the surface is significant. The surface with pulse process was a bit more lustrous than with continuous current but the black passive layer still could be found at grooved surface. There are two ways to achieve highly smooth surface finish. One is brushing it with a brush the other is electrochemical machining (ECM) with high current. The former method is the most common polishing practice, but not only may the surface obtained differ from operator to operator, but precision smooth surface on micro grooves are difficult to obtain. The latter one recently has been used to produce a highly smooth surface after EDM process. However, the material removal rate in ECM with high current is relatively high. Hence the original shape of the micro grooves, which was formed by electrochemical micro-machining (EMM) process, may be destroyed. In this study, an electrochemical polishing process using pulse current is adopted as a possible alternative process when micro grooves formed by EMM process should be polished. Mirror-like micro grooves with lustrous and smooth surface can be produced electrochemically with pulse current because the voltage and current used can be lower than the case of continuous current. This study will discuss the accurate control of physical and electrical conditions so as to achieve mirror-like micro grooves with lustrous and smooth surface without destroying the original shape of micro grooves.

• 한국정밀공학회지
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• 제30권2호
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• pp.148-153
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• 2013

This study demonstrates a novel hybrid surface polishing process combining non-traditional electrochemical polishing(ECP) with external artificial ultrasonic vibration. ECP, typical noncontact surface polishing process, has been used to improve surface quality without leaving any mechanical scratch marks formed by previous mechanical processes, which can polish work material by electrochemical dissolution between two electrodes surfaces. This research suggests vibration electrochemical polishing(VECP) assisted by ultrasonic vibration for enhancing electrochemical reaction and surface quality compared to the conventional ECP. The localized roughness of work material is measured by atomic force microscopy(AFM) for detailed information on surface. Besides roughness, overall surface quality, material removal rate(MRR), and productivity etc. are compared with conventional ECP.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.942-945
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• 2001

Pulse electrochemical micromachining offers significant improvements in dimensional accuracy as compared with conventional electrochemical machining. One primary issue in pulse electrochemical micromachining is to identify and control machining depth as well as interelectrode gap size. This paper presents an identification method for the machining depth by in-process analysis of machining current and interelectrode gap size. The inter electrode gap characteristics, including pulse current, effective volumetric electrochemical equivalent and electrolyte conductivity variations, are analysed based on the model and experiments.

• 소성∙가공
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• 제13권3호
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• pp.279-284
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• 2004

Electroforming is the highly specialized use of electrodeposition for the manufacture of metal parts and basically a specialized form of electroplating. So, we can apply electrochemical system analysis for electroforming process. Electrochemical systems are concerned with the interplay between electricity and chemistry, namely the measurements of electrical quantities, such as current density, potential, and charge, and their relationship to chemical parameters. This paper based on the basic equations of electrics and electrochemical kinetics, was employed for a theoretical explanation of the current density distribution on electroforming process. We calculated current density distribution and potential distribution on cathode. Also, calculated current density distribution of vertical direction. It was shown that current density is related with distance of between anode and cathode and mass transfer process.

• 한국생산제조학회지
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• 제22권5호
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• pp.795-799
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• 2013

This paper describes a novel hybrid surface polishing process combining non-traditional electrochemical polishing (ECP) with external artificial ultrasonic vibration. The purpose of this study is to develop an easier method for improving stainless steel surfaces. To this end, vibration electrochemical polishing (VECP), a novel ultrasonic manufacturing process, for enhancing electrochemical reaction and surface quality compared with that achieved using conventional ECP is suggested. In addition, for finding the optimized experimental conditions, the two methods are compared under various current densities. Localized roughness of the work material is measured with atomic force microscopy (AFM) and scanning electron microscopy (SEM) for obtaining detailed surface information.

• 한국생산제조학회지
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• 제21권2호
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• pp.246-251
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• 2012

Pulse electrochemical polishing process has been used to improve mechanical properties such as surface roughness and corrosion resistance on conductive metallic materials. In addition, pulse electrochemical polishing process with various frequency may produce a lustrous, smoother, deburred and cleaned surface on workpiece. The aim of this paper is to study surface characteristics of pulse electrochemical polishing for various frequency conditions using AFM to verify localized surface variation in nanometer scale.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.609-613
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• 2004

On this study, electrochemical polishing is adapted to ultra-fine surface for semiconductor large radius gas-tube. The system which buffing and electrochemical polishing can be performed simultaneously was constructed in connection with developing exclusive system. Based on existing papers and the research of background, electrode gap and electrolyte flow were fixed. Current density and electrochemical precision time were chosen as variables. On this study, it is objected to find optimal precision condition and precision variables on the in-process electrochemical polishing.

• 상하수도학회지
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• 제28권5호
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• pp.541-548
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• 2014

The pickling brine generated from the salting process of kimchi production is difficult to treat biologically due to very high content of salt. When pickling brine is treated and discharged, it cannot satisfy the criteria for effluent water quality in clean areas, while resources such as the salt to be recycled and the industrial water are wasted. However, sterilization by ozone, UV and photocatalyst is expensive installation costs and operating costs when considering the small kimchi manufacturers. Therefore there is a need to develop economical process. The study was conducted on the sterilization efficiency of the pickling brine using electrochemical processing. The electrochemical treatment of organic matters has advantages over conventional methods such as active carbon absorption process, chemical oxidation, and biological treatment because the response speed is faster and it does not require expensive, harmful oxidizing agents. This study were performed to examine the possibility of electrochemical treatment for the efficient processing of pickling brine and evaluated the performance of residual chlorine for the microbial sterilization.

• Transactions on Electrical and Electronic Materials
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• 제13권2호
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• pp.78-84
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• 2012

An in-situ optical monitoring method for real-time process monitoring of electrochemical copper deposition (CED) is presented. Process variables to be controlled in achieving desired process results are numerous in the CED process, and the importance of the chemical bath conditions cannot be overemphasized for a successful process. Conventional monitoring of the chemical solution for CED relies on the pH value of the solution, electrical voltage level for the reduction of metal cations, and gravity measurement by immersing sensors into a plating bath. We propose a nonintrusive optical monitoring technique using three types of optical sensors such as chromatic sensors and UV/VIS spectroscopy sensors as potential candidates as a feasible optical monitoring method. By monitoring the color of the plating solution in the bath, we revealed that optically acquired information is strongly related to the thickness of the deposited copper on the wafers, and that the chromatic information is inversely proportional to the ratio of $Cu$ (111) and {$Cu$ (111)+$Cu$ (200)}, which can used to measure the quality of the chemical solution for electrochemical copper deposition in advanced interconnection technology.

• Nuclear Engineering and Technology
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• 제47권7호
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• pp.849-858
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• 2015

This study set the pyroprocess facility at an engineering scale as a cost object, and presented the cost consumed during the unit processes of the pyroprocess. For the cost calculation, the activity based costing (ABC) method was used instead of the engineering cost estimation method, which calculates the cost based on the conceptual design of the pyroprocess facility. The calculation results demonstrate that the pyroprocess facility's unit process cost is $194/kgHM for pretreatment, $298/kgHM for electrochemical reduction, $226/kgHM for electrorefining, and $299/kgHM for electrowinning. An analysis demonstrated that the share of each unit process cost among the total pyroprocess cost is as follows: 19% for pretreatment, 29% for electrochemical reduction, 22% for electrorefining, and 30% for electrowinning. The total unit cost of the pyroprocess was calculated at $1,017/kgHM. In the end, electrochemical reduction and the electrowinning process took up most of the cost, and the individual costs for these two processes was found to be similar. This is because significant raw material cost is required for the electrochemical reduction process, which uses platinum as an anode electrode. In addition, significant raw material costs are required, such as for $Li_3PO_4$, which is used a lot during the salt purification process.