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http://dx.doi.org/10.7736/KSPE.2013.30.2.148

Vibration Electrochemical Polishing for Localized Surface Leveling  

Kim, Uksu (Department of Advanced Parts and Materials Engineering, Chosun Univ.)
Kim, Youngbin (Department of Advanced Parts and Materials Engineering, Chosun Univ.)
Park, Jeongwoo (Department of Mechanical Design Engineering, Chosun Univ.)
Publication Information
Journal of the Korean Society for Precision Engineering / v.30, no.2, 2013 , pp. 148-153 More about this Journal
Abstract
This study demonstrates a novel hybrid surface polishing process combining non-traditional electrochemical polishing(ECP) with external artificial ultrasonic vibration. ECP, typical noncontact surface polishing process, has been used to improve surface quality without leaving any mechanical scratch marks formed by previous mechanical processes, which can polish work material by electrochemical dissolution between two electrodes surfaces. This research suggests vibration electrochemical polishing(VECP) assisted by ultrasonic vibration for enhancing electrochemical reaction and surface quality compared to the conventional ECP. The localized roughness of work material is measured by atomic force microscopy(AFM) for detailed information on surface. Besides roughness, overall surface quality, material removal rate(MRR), and productivity etc. are compared with conventional ECP.
Keywords
Vibration Electrochemical Polishing; Electrochemical Machining; Ultrasonic Vibration; Atomic Force Microscope; Electrolyte;
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Times Cited By KSCI : 2  (Citation Analysis)
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