• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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• pp.72-75
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• 2000

The effect of $Al_2O_3+Y_2O_3$ additives on fracture toughness of ${\beta}-SiC-TiB_2$ composites by hot-pressed sintering were investigated, The ${\beta}-SiC-TiB_2$ ceramic composites were hot-presse sintered and annealed by adding 4, 8, 12wt% $Al_2O_3+Y_2O_3$(6 : 4wt%) powder as a liquid forming additives at low temperature($1800^{\circ}C$) for 4h. In this microstructures, the relative density is over 97% of the theoretical density and the porosity increased with increasing $Al_2O_3+Y_2O_3$ contents because of the increasing tendency of pore formation. But the fracture toughness showed the highest of $7.0MPa{\cdot}m^{1/2}$ for composites added with 12wt% $Al_2O_3+Y_2O_3$ additives at room temperature. The electrical resistivity showed the lowest of $1.59\times10^{-3}\Omega{\cdot}cm$ for composite added with 8wt% $Al_2O_3+Y_2O_3$ additives at room temperature and is all positive temperature coefficient resistance(PTCR} against temperature up to $700^{\circ}C$.

• Composites Research
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• 제14권5호
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• pp.1-11
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• 2001

본 논문은 금속복합재료를 반용융상태로 재가열하여 Thixoforming을 하는데 필요한 소재를 제공하기 위한 장비 설계와 제조방법 등에 관한 내용을 소개하고 있다. 장비 설계에서 기지재내에 강화재가 균일하게 분산되도록 하기 위하여 강화재의 연속주입 방법과 강화재의 온도를 제어하는 방법을 소개하고 있다. 일정한 양의 강화재를 기지재료 내에 분산시키는 것은 균일 혼합을 위하여 필요한 기술이다. 또한 분산시 강화재의 수분제거를 위하여 강화재의 온도를 제어하면서 연속적으로 강제분산시키는 것은 균일분산을 위하여 필요하다. 기지재의 초정 $\alpha$의 크기가 강화재의 분산성에 크게 영향을 미치기 때문에 기지재의 초기 온도가 초정$\alpha$의 크기에 미치는 영향 등을 검토하여 복합재료 빌렛트의 제조조건에 이용하였다.

• 전기화학회지
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• 제10권2호
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• pp.94-103
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• 2007

반도체 소자의 고속화, 고집적화, 고신뢰성화에 대한 요구는 알루미늄 합금으로부터 구리로의 배선 물질의 변화를 유도하였다. 낮은 비저항과 높은 내열화성을 특징으로 하는 구리는 그 전기적, 재료적 특성이 알루미늄과 상이하여 배선 형성에 있어 새로운 주변 재료와 공법을 필요로 한다. 본 총설에서는 상감공정(damascene process)을 사용하는 다층 구리 배선 공정에 있어 핵심이 되는 구리 전해 도금(electrodeposition) 공정을 중심으로 확산 방지막(diffusion barrier) 및 도전층(seed layer), 바닥 차오름(bottom-up filling)을 위한 전해/무전해 도금용 유기 첨가제, 화학적 기계적 평탄화(chemical mechanical polishing) 및 표면 보호막(capping layer) 기술 등의 금속화 공정에 대한 개요와 개발 이슈를 소개하고 최근의 연구 결과를 통해 구리 배선 공정의 최신 연구 동향을 소개하였다.

• 대한기계학회논문집B
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• 제36권5호
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• pp.517-521
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• 2012

탄소나노튜브는 유연 전도체로서 투명전극, 유연 히터, 투명 스피커 분야에 활발히 응용되고 있다. 본 연구에서는 PET 유연 모재의 전면적에 다중벽 탄소나노튜브(MWCNT)를 도포하는 스프레이법 이용하여, 투명하고 전도성 있는 MWCNT/PET 복합 박막을 제조하였다. 분산제로 사용된 SDS (sodium dodecyl sulfate)의 농도를 조절함으로써 MWCNT 의 분산도를 조절하였으며, 분산도가 조절된 시험편의 인장실험을 통해 기계적인 변형 하에서 MWCNT/PET 전도성 박막의 전기-기계적인 거동과 분산제의 효과를 평가하였다.

• 한국응용곤충학회지
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• 제32권3호
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• pp.265-270
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• 1993

바퀴(Blattella germanica L.)의 살충제 저항성 기구를 구명하고자 chlorpyrifos와 permethrin 살충제로 누대선ㅂㄹ하여 얻어진 저항성 바퀴를 대상으로 저항성 기작에 관여하는 esterase 활성변화에 관하여 실험한 결과는 다음과 같다. Filter paper test 방법을 통한 esterase-$\alpha$의 활성은 chlorpyrifos와 permethrin 도태계통에서 각각 2.65배, 1.82배로 감수성계통보다 증가하였다. Spectrophotometer 방법을 통한 esterase의 활성은 감수성계통보다 chlorpyrifos 도태계통에서 $\alpha$- 및 $\beta$-Naphthyl acetate에 대하여 각각 2.34배, 5.28배, permethrin 도태계통에서는 1.48배, 2.2배 증가하였다. 전기영동 실험을 통한 esterase isozyme pattern은 모두 5개의 band가 분리 검출되었다. Rc와 Rp계통에서는 감수성계통에서 뚜렷하게 검출되지 않은 Est-2와 Est-3 band가 검출되었으며, Rp계통에서는 감수성과 Rc계통에서 검출된 Est-5 band가 검출되지 않았다.

• 한국재료학회지
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• 제11권10호
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• pp.851-858
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• 2001

One of the important phase of black titanium oxide is $Ti_4O_7$ which has the excellent properties such as the greatest electrical conductivity among the titanium oxides, chemical resistance against acidic and alkalic conditions and electro-wave absorption etc., so it has been considered as a promising material to be used widely all over the parts of industries. In this study, $Ti_4O_7$ phase was successfully synthesized by the reaction of TiO$_2$/ Mg system. With the change of the mole of TiO$_2$to Mg, the most excellent blackness was appeared in the 3.5 mole which was the smaller amount than the stoichiometric 4.0 mole. In addition, we found that the blackness decreased as the mole ratio of reactent increased. With decreasing particle size of magnesium, blackness of titanium oxide increased. The reaction property was changed with the compaction pressure, and optimum pressure was found to be 10 MPa. At 55$0^{\circ}C$ of reduction temperature, the blackness increased as the reaction time increased. The blackness of synthesized black titanium oxide was 14 to 18, and the average particle size was 0.2 $\mu\textrm{m}$.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.32-32
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• 2009

Electric Resistance Welding (ERW) process is the most efficient process to manufacture the linepipe. To develop the high performance ERW linepipe using the high strength and the high alloy steels, the modulation of input power waveform such as sinusoidal waveform is introduced because the conventional ERW technology is not sufficient enough to produce the high quality linepipe due to its strength and high alloy contents (high Ceq). In this article, the material used for the experiment was API X60 with 8.2mm thickness, and ERW simulator at POSCO was used to develop a waveform control system for the power modulation. The frequency of power modulation was varied from 50Hz to 150Hz with the fixed amplitude of ${\pm}2%$ power. The non-modulated power input and the modulated power input cases are conducted to demonstrate the variation of the narrow gap length and the arcing frequency due to power modulation. From results of the non-modulated power input case, the excessive power causes the longer narrow gap length and the low arcing frequency due to the large heat input and the strong electro magnetic force that increase the weld defect. On the contrary, the small narrow gap length and the high arcing frequency reduce the weld defect. After modulating the power input with 50Hz and 100Hz at the fixed power, the arcing frequency increases, but the narrow gap length does not change much. The high arcing frequency prevents the formation of weld defect because the sweeping frequently cleans the oxides on the narrow gap edges. As a result, the manufacturing window can be expanded by the power modulation that provides the stable ERW process for the quality improvement of the linepipe made from the high strength/high alloy steels.

• Smart Structures and Systems
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• 제6권3호
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• pp.225-238
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• 2010

We report on the development of a new technology for the fabrication of Micro-Electro-Mechanical-System (MEMS) strain sensors to realize a novel type of crackmeter for health monitoring of ageing civil infrastructures. The fabrication of micromachined silicon MEMS sensors based on a Silicon On Insulator (SOI) technology, designed according to a Double Ended Tuning Fork (DETF) geometry is presented, using a novel process which includes a gap narrowing procedure suitable to fabricate sensors with low motional resistance. In order to employ these sensors for crack monitoring, techniques suited for bonding the MEMS sensors on a steel surface ensuring good strain transfer from steel to silicon and a packaging technique for the bonded sensors are proposed, conceived for realizing a low-power crackmeter for ageing infrastructure monitoring. Moreover, the design of a possible crackmeter geometry suited for detection of crack contraction and expansion with a resolution of $10{\mu}m$ and very low power consumption requirements (potentially suitable for wireless operation) is presented. In these sensors, the small crackmeter range for the first field use is related to long-term observation on existing cracks in underground tunnel test sections.

• 대한안전경영과학회지
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• 제15권1호
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• pp.109-120
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• 2013

As information-oriented industry has been developed and electronic devices has come to be smaller, lighter, multifunctional, and high speed, the components used to the devices need to be much high density and should have find pattern due to high integration. Also, diverse reliability problems happen as user environment is getting harsher. For this reasons, establishing and securing products and components reliability comes to key factor in company's competitiveness. It makes accelerated test important to check product reliability in fast way. Out of fine pattern failure modes, failure of Electrochemical Migration(ECM) is kind of degradation of insulation resistance by electro-chemical reaction, which it comes to be accelerated by biased voltage in high temperature and high humidity environment. In this thesis, the accelerated life test for failure caused by ECM on fine pattern substrate, $20/20{\mu}m$ pattern width/space applied by Semi Additive Process, was performed, and through this test, the investigation of failure mechanism and the life-time prediction evaluation under actual user environment was implemented. The result of accelerated test has been compared and estimated with life distribution and life stress relatively by using Minitab software and its acceleration rate was also tested. Through estimated weibull distribution, B10 life has been estimated under 95% confidence level of failure data happened in each test conditions. And the life in actual usage environment has been predicted by using generalized Eyring model considering temperature and humidity by developing Arrhenius reaction rate theory, and acceleration factors by test conditions have been calculated.

• 한국재료학회지
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• 제24권2호
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• pp.105-110
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• 2014

The aim of this work was to investigate the effects of electrodeposition conditions on the microstructural characteristics of copper thin films. The microstructure of electroplated Cu films was found to be highly dependent on electrodeposition conditions such as system current and current density, as well as the bath solution itself. The current density significantly changed the preferred orientation of electroplated Cu films in a DC system, while the solution itself had very significant effects on microstructural characteristics in a pulse-reverse pulse current system. In the DC system, polarization at high current above 30 mA, changed the preferred orientation of Cu films from (220) to (111). However, Cu films showed (220) preferred orientation for all ranges of current density in the pulse-reverse pulse current system. The grain size decreased with increasing current density in the DC system while it remained relatively constant in the pulse-reverse pulse current system. The sheet resistance increased with increasing current density in the DC system due to the decreased grain size.