• Geomechanics and Engineering
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• 제11권2호
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• pp.197-209
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• 2016

Clayey rock has large clay mineral content. When in contact with water, this expands considerably and may present a significant hazard to the stability of the rock in geotechnical engineering applications. This is particularly important in the present work, which focused on mitigating some unwelcomed properties of clayey rock. Changes in its physical properties were simulated by subjecting the rock to a low voltage direct current (DC) using copper, steel and aluminum electrodes. The modified mechanism of the coupled electrical and chemical fields acting on the clayey rock was analyzed. It was concluded that the essence of clayey rock electrochemical modification is the electrokinetic effect of the DC field, together with the coupled hydraulic and electrical potential gradients in fine-grained clayey rock, including ion migration, electrophoresis and electro-osmosis. The aluminum cathodes were corroded and generated gibbsite at the anode; the steel and copper cathodes showed no obvious change. The electrical resistivity and uniaxial compressive strength (UCS) of the modified specimens from the anode, intermediate and cathode zones tended to decrease. Samples taken from these zones showed a positive correlation between electric resistivity and UCS.

• Membrane and Water Treatment
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• 제11권3호
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• pp.201-206
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• 2020

Electrodialysis (ED) is used in wastewater treatment, during the processing and recovery of beneficial materials, to produce usable water. In this study, sulfate and chlorine ions, which are the anions majorly used for electroplating, were studied as factors affecting the recovery of copper, nickel and water from wastewater by electrodialysis. Although the removal rates of copper and nickel ions were slightly higher with the use of chlorine ions than of sulfate ions, the removal efficiencies were above 99.9% under all experimental conditions. The metal ions of the plating wastewater flowed through the ion exchange membrane of the diluate tank and the concentrate tank while all the water moved together due to electro-osmosis. The migration of water from the diluate tank to the concentrate tank was higher in the presence of a monovalent chloride ion compared to that of a divalent sulfate ion. When sulfate was the anion used, the recoveries of copper and nickel increased by about 25% and 30%, respectively, as compared to the chloride ion. Therefore, when divalent ions such as sulfate are present in the electrodialysis, it is possible to reduce the movement amount of water and highly concentrate the copper and nickel in the plating wastewater.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.163-163
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• 2008

반도체 소자가 고집적화 되고 고속화를 필요로 하게 됨에 따라, 기존에 사용되었던 알루미늄이나 텅스텐보다 낮은 전기저항, 높은 electro-migration resistance으로 미세한 금속배선 처리가 가능한 Cu가 주목받게 되었다. 하지만 과잉 디싱 현상과 에로젼을 유도하여 메탈라인 브리징과 단락을 초래할 있고 Cu의 단락인 islands를 남김으로서 표면 결함을 제거하는데 효과적이지 못다는 단점을 가지고 있었다. 특히 평탄화 공정시 높은 압력으로 인하여 Cu막의 하부인 ILD막의 다공성의 low-k 물질의 손상을 초래 할 수 있는 문제점을 해결하기 위하여 기존의 CMP에 전기화학을 결합시킴으로서 낮은 하력에서의 Cu 평탄화를 달성 할 수 있는 기존의 CMP 기술에 전기화학을 접목한 새로운 개념의 ECMP (electrochemical-mechanical polishing) 기술이 생겨나게 되었다. 따라서 본 논문에서는 최적화된 ECMP 공정을 위하여 I-V곡선과 CV법을 이용하여 active. passive. trans-passive 영역의 전기화학적 특징을 알아보았고. Cu막의 표면 형상을 알아보기 위해 Scanning Electron Microscopy (SEM) 측정과 Energy Dispersive Spectroscopy (EDS) 분석을 통해 금속 화학적 조성을 조사하였다.

• 한국전기전자재료학회논문지
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• 제18권1호
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• pp.24-29
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• 2005

Chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing. Copper has been the candidate metallization material for ultra-large scale integrated circuits (ULSIs), owing to its excellent electro-migration resistance and low electrical resistance. However, it still has various problems in copper CMP process. Thus, it is important to understand the effect of the process variables such as turntable speed, head speed, down force and back pressure are very important parameters that must be carefully formulated in order to achieve desired the removal rates and non-uniformity. Using a design of experiment (DOE) approach, this study was performed investigating the main effect of the variables and the interaction between the various parameters during CMP. A better understanding of the interaction behavior between the various parameters and the effect on removal rate, non-uniformity and ETC (edge to center) is achieved by using the statistical analysis techniques. In the experimental tests, the optimum parameters which were derived from the statistical analysis could be found for higher removal rate and lower non-uniformity through the above DOE results.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.370-370
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• 2012

Feature size of Cu interconnects keep shrinking into several tens of nanometer level. For this reason, the Cu interconnects face challenging issues such as increase of electro-migration, line-width dependent electrical resistivity increase, and gap-filling difficulty in high aspect ratio structures. As the thickness of the Cu film decreases below 30 nm, the electrical resistivity is not any more constant, but rather exponential. Research on alloying with other elements have been started to inhibit such escalation in the electrical resistivity. A faint trace of Al added in Cu film by sputtering was reported to contribute to suppression of the increase of the electrical resistivity. From an industrial point of view, we introduced cyclic metal organic chemical vapor deposition (MOCVD) in order to control Al concentration in the Cu film more easily by controlling the delivery time ratio of Cu and Al precursors. The amount of alloying element could be lowered at level of below 1 at%. Process of the alloy formation was applied into gap-filling to evaluate the performance of the gap-filling. Voidless gap-filling even into high aspect ratio trenches was achieved. In-depth analysis will be discussed in detail.

• Membrane and Water Treatment
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• 제3권1호
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• pp.63-76
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• 2012

Mother liquid discharged from a salt-manufacturing plant was electrodialyzed at 25 and $40^{\circ}C$ in a continuous process integrated with $SO_4{^{2-}}$ ion low-permeable anion-exchange membranes to remove $Na_2SO_4$ and recover NaCl in the mother liquid. Performance of electrodialysis was evaluated by measuring ion concentration in a concentrated solution, permselectivity coefficient of $SO_4{^{2-}}$ ions against $Cl^-$ ions, current efficiency, cell voltage, energy consumption to obtain one ton of NaCl and membrane pair characteristics. The permselectivity coefficient of $SO_4{^{2-}}$ ions against $Cl^-$ ions was low enough particularly at $40^{\circ}C$ and $SO_4{^{2-}}$ transport across anion-exchange membranes was prevented successfully. Applying the overall mass transport equation, $Cl^-$ ion and $SO_4{^{2-}}$ ion transport across anion-exchange membranes is evaluated. $SO_4{^{2-}}$ ion transport number is decreased due to the decrease of electro-migration of $SO_4{^{2-}}$ ions across the anion-exchange membranes. $SO_4{^{2-}}$ ion concentration in desalting cells becomes higher than that in concentration cells and $SO_4{^{2-}}$ ion diffusion is accelerated across the anion-exchange membranes from desalting cells toward concentrating cells.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.23.2-23.2
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• 2009

기존에 사용되었던 알루미늄 배선 공정은 공정의 배선 크기가 줄어들면서 한계에 다다르고 있다. 따라서 이를 대체하기 위해 여러 가지 새로운 방법들이 고안되고 있으며, 그중 알루미늄을 비저항이 낮고 EM(electro-migration) 저항성이 뛰어난 구리로 대체하려는 연구가 진행되고 있다. 구리 배선은 이미 electroplating 공정을 이용해 산업에 적용되고 있으며, seed layer로는 sputtering 법을 이용하고 있다. 하지만 sputtering 을 포함한 PVD 법은 대부분 종횡비나 단차 피복도가 좋지 않기 때문에 이를 CVD로 교체한다면 많은 장점을 가질 수 있다. 하지만 CVD 공정을 진행하기 위해서는 많은 문제점들이 있는데, 이중 전구체에 대한 문제도 빼놓을 수 없는 이슈이다. Cu(dmamb)2 는 기존에 사용하던 $\beta$-diketonate 계열의 전구체보다 화학적으로 많은 장점을 가지고 있어, CVD 공정에 적합하다. 이에 따라 구리 박막 증착의 공정 조건을 설계하고, 고품질의 박막을 증착하기 위한 다양한 처리법을 고안하여 증착 실험을 진행하였다. 기본적으로 구리는 확산력이 좋아 실리콘계열의 기판에서 확산력이 매우 좋아 기판 내로 확산되기 때문에 이를 방지하기 위하여 Ta, Ti 계열의 박막을 사용하여 확산을 방지하고 있다. 따라서 전이 금속 박막의 표면과 증착 분위기 등을 고려하여 구리를 증착하였으며, 표면의 미세구조 및 성분을 FESEM 등을 통해 분석하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.49-49
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• 2007

최근 반도체 소자의 고집적화와 나노 (nano) 크기의 회로 선폭으로 인해 기존에 사용되었던 텅스텐이나 알루미늄 금속배선보다, 낮은 전기저항과 높은 electro-migration resistance가 필요한 Cu 금속배선이 주목받게 되었다. 하지만, Cu CMP 공정 시 높은 압력으로 인하여 low-k 유전체막의 손상과 디싱과 에로젼 현상으로 인한 문제점이 발생하게 되었다. 본 논문에서는, $KNO_3$ 전해액의 농도가 Cu 표면에 미치는 영향을 알아보기 위해 Tafel Curve와 CV (cyclic voltammograms)법을 사용하여 전기화학적 특징을 알아보았고 scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), X-ray Diffraction (XRD) 분석을 통해 금속표면을 비교 분석하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.65-65
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• 2000

반도체 소자의 고집적화는 배선에서 많은 문제점을 야기 시킨다. 이러한 문제점들 중에서 대표적인 것이 과도한 전류밀도에 의한 electro-migration(EM)이다. 이는 앞으로 배선의 선폭이 0.25$mu extrm{m}$미만일 경우 더욱 심화될 전망이다. 이에 대안으로 Al-합금에서 Cu로 대체하여 이러한 문제를 해결하려 하고 있다. 그런데, Cu는 Si 및 SiO2와 높은 반응성과 빠른 확산속도를 가지기 때문에 확산방지막이 필요로 되어진다. 현재에는 TiN, TaN 등의 확산방지막이 사용되어지고 있으나, TiN 박막의 경우 표면에 Ti와 oxide와의 결합에 의해 Ti-O 성분이 존재하는데, 이럴 경우 Cu 증착을 하는데 있어 부정적인 요인이 된다. 또한, 이러한 화합물은 Cu와 TiN 계면사이에 밀착성을 나쁘게 하여 고전류 인가시 EM에 있어 높은 저항성을 가질 수가 없다. 따라서, 본 연구는 MOCVD방식으로 Cu 박막을 증착하기에 앞서 수소플라즈마를 이용하여 TiN 표면에 형성된 산소 화합물을 제거한 후 Cu를 증착하여 동일한 조건에서 EM 가속화 실험을 하였다. 그림 1은 Cu/TiN 구조에 있어 수소 전처리를 한 배선의 구조의 MTF(mean time to failure)가 65분이고 전처리를 하지 않은 배선구조는 40분으로 약 50% 긴 MTF를 가지는 것으로 나왔다. 결론적으로 Cu와 TiN 계면에 좋은 밀착성은 EM에 있어 우수한 저항성을 가지는 것으로 나왔다.

• Environmental Engineering Research
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• 제24권3호
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• pp.456-462
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• 2019

Hydrocarbon contamination is among the most challenging problems in soil remediation. Electrokinetic method can be a promising method to remediate hydrocarbon-contaminated soils. Electrokinetic method consists of different transport phenomena including electro-migration, electrophoresis, and electroosmotic flow. Electroosmotic flow is the main transport phenomenon for hydrocarbon removal in soil porous media. However, the main component of hydrocarbons is the hydrophobic organic which indicates low water solubility; therefore, it makes the electroosmotic flow less effective. The objective of the present study is to enhance electrokinetic remediation of diesel-contaminated silty sand by increasing the solubility of the hydrocarbons in the soil and then increase the efficiency. For this purpose, sodium dodecyl sulfate (SDS) was used as a catholyte. In this content, SDS 0.05 M was used as catholyte and $Na_2SO_4$ 0.1 M was used as an anolyte. Low (1 V/cm) and high (2 V/cm) voltage gradients were used in periodic and continuous forms. The best removal efficiency was observed for high voltage gradient (2 V/cm) in a periodic form, which was 63.86. This result showed that a combination of periodic voltage application in addition to the employment of SDS is an effective method for hydrocarbon removal from low permeable sand.