• Title/Summary/Keyword: electro-migration

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Electrochemical Acceletated Test for Evaluation of Chloride Diffusion in Concrete (콘크리트 중의 염화물 확산평가를 위한 전기화학적 촉진시험법)

  • 문한영;김홍삼;이승태;정호섭;최두선
    • Proceedings of the Korea Concrete Institute Conference
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    • 2000.10a
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    • pp.409-412
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    • 2000
  • Many researchers have been trying to evaluate the diffusion coefficient of chloride ion in concrete by using qualitative and quantitative electro-migration tests. Up to now, however, there has been no sufficient method to closely determine the diffusion coefficient of chloride ion through electro-migration test. In this paper, the diffusion coefficient of chloride ion in concrete was investigated through an electro-migration test, that is, AASHTO T 277, Dhir's method, Tang's method and Andrade's method. And the results of these test were compared with each other.

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Thermally Stimulated Depolarization Current Test for Reliability of X5R MLCC (TSDC 방법을 이용한 X5R MLCC의 신뢰성 평가)

  • Park, Ji-Young;Park, Jae-Sung;Kim, Young-Tae;Hur, Kang-Heon
    • Journal of the Korean Ceramic Society
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    • v.46 no.2
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    • pp.155-160
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    • 2009
  • The reliability could be one of the essential properties for multilayer ceramic capacitor (MLCC) using in various electronic devices and the concentration and mobility of oxygen vacancy would play important role in the reliability. To investigate the migration behavior of oxygen vacancies, thermally stimulated depolarization current (TSDC) is adopted. In dielectric material of X5R MLCC, the TSD-Current peak observed around 150$^{\circ}C$ and 200$^{\circ}C$ which represented the migration of oxygen vacancy. Substituting Yttrium for Dysprosium in X5R MLCC showed higher migration activation energy and lower TSD current density.

Change in Molecular Weight Distribution of Diffusible Species on RTV Silicone Rubber Using Solvent Extraction and Recovery Rate of Hydrophobicity (용매추출에 의한 옥외용 RTV 실리콘고무의 분자량 변화와 발수성 회복속도)

  • Lee, Chang-R.;Kim, Dong-H.;Choi, Yong-C.;Kim, Jong-G.;Homma, H.;Izumi, K.
    • Proceedings of the KIEE Conference
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    • 2001.07c
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    • pp.1337-1339
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    • 2001
  • We have investigated the relation between the molecular weight distribution (MWD) of diffusible species and the recovery rate of hydrophobicity of room-temperature vulcanizing (RTV) silicone rubber (SIR) using solvent extraction at various temperatures. It was observed that the extract had a MWD ranging from a few hundreds g/mol to hundreds of thousands g/mol. By measuring the migration of siloxane to the extracted SIR surface through a thin carbon coating, the aspect of migration of diffusible species was observed as a real time plot, and the time constant of the migration was also calculated. According to the time dependence of IR-absorbance, the time constant was increased with the increase of MW of the extracts.

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Strain Sensor Application using Cellulose Electro-Active Paper (EAPap) (셀룰로오스 기반 Electro-Active Paper (EAPap)를 이용한 변형률 센서 응용)

  • Jang, Sang-Dong;Lee, Sang-Woo;Kim, Joo-Hyung;Kim, Jae-Hwan
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2009.04a
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    • pp.462-465
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    • 2009
  • Cellulose based electro-active paper (EAPap) is a new smart material that has a potential to be used in biomimetic actuator and sensor. Beside of the natural abundance, cellulose EAPap is fascinating with its biodegradability, lightweight, high mechanical strength and low actuation voltage. An actuating mechanism of EAPap is revealed to be the combination of ion migration effect and piezoelectricity. EAPap can generate the electrical current and voltage when the mechanical stress applied due to its electro-mechanical characteristics. In this paper, we investigated the feasibility of EAPap as a mechanical strain sensor.

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Ti/Al/Ti 전극의 Electro-Migration신뢰성 평가

  • Hyeon, Yeong-Hwan;Choe, Byeong-Deok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.339.2-339.2
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    • 2016
  • 본 연구에서는 Ti/Al/Ti 금속 배선의 Electro-Migration(EM) 현상을 분석했다. Van der Pauw, Greek Cross bridge, Straight line linear line bridge를 결합한 패턴을 제작하여, 온도 변화에 따른 EM의 발생 시간(Failure Time)을 측정했다. 측정 조건은 W/L=3.5/300 um 소자에 전류 밀도(current density)를 $J=10^4A/cm^2$로 고정하고, 온도를 300 K, 350 K, 400 K로 가변 시켰다. 측정된 Cumulative Failure의 50 % 되는 지점(Median Time To Failure; MTTF)은 각각 22.3시간, 18.46시간, 15.4시간으로 온도가 300 K에서 400 K로 증가함에 따라 MTTF가 6.9시간 감소했다. 이 결과를 통해 Black방정식에서 온도 변수가 $t_{50}$에 영향을 주는 것을 확인했다. 온도가 증가함에 따라 더 많은 전자들이 원자에 충돌하면서 운동량을 전달하고, 더 많은 원자들이 이주되면서 EM 발생 시간이 감소했다.

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Studies on Copper Pillar Bump with Trapezoidal Cross Section on the Top Surface for Reliability Improvement (사다리꼴 상부 단면을 갖는 구리기둥 범프의 신뢰성 향상에 대한 연구)

  • Cho, Il-Hwan
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.7
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    • pp.496-499
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    • 2012
  • Modified structure of copper pillar bump which has trapezoidal cross section on the top region is suggested with simulation results and concept of fabrication process. Due to the large surface area of joint region between bump and solder in suggested structure, electro-migration effect can be reduced. Reduction of electro-migration is related with current density and joule heating in bump and investigated with finite element methods with variation of dimensional parameters. Mechanical characteristics are also investigated with comparing modified copper pillar bump and conventional copper pillar bump.

The Effect of Dislocation Pipe Diffusion on Electro-Migration-Induced Breakdown in an FCC Structure (면심입방구조에서 Electro-Migration-Induced Breakdown에 대한 전위파이프 확산의 영향)

  • 이득용
    • Journal of the Korean Ceramic Society
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    • v.28 no.11
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    • pp.878-884
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    • 1991
  • The mobility and diffusivity in an edge dislocation in an FCC crystal formed by the removal of one half of a (100) plane were evaluated in an applied field by analyzing a vacancy tight binding model using Stark's matrix technique. A model of an edge dislocation in an FCC crystal was constructed for a [100] Burgers vector where vacancy transport along the edge dislocation in an FCC crystal was constructed for a [100] Burgers vector where vacancy transport along the edge of the extrac half plane of ions was considered. The model considered a tight binding approximation of the vacancy to the compressed region of the core and carried the calculation to the limit of an infinite length of dislocation. The diffusivity and the ratio of mobility to diffusivity were found to increase without bounds in the limit where the correlation factor becomes zero. In contrast, as the correlation factor became unity, the diffusivity became zero and the ratio of mobility to diffusivity became unity associated with the uncorrelated limit of 1/kT. This implied that the phenomenon was not unique to the crystal structure but was unique to edge dislocations with vacancy tight binding.

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Electromechanical Simulation of Cellulose Based Biomimetic Electro-Active Paper (생체모방종이작동기(Electro-Active Paper)의 전기기계적인 구동 시뮬레이션)

  • Jang, Sang-Dong;Kim, Heung-Soo;Kim, Jae-Hwan
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2007.11a
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    • pp.73-76
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    • 2007
  • Electro-Active paper (EAPap) is a new smart material that has a potential to be used in biomimetic actuator and sensor. It is made by cellulose that is abundant material in nature. EAPap is fascinating with its biodegradability, lightweight, large displacement, high mechanical strength and low actuation voltage. Actuating mechanism of EAPap is known to be the combined effects of ion migration and piezoelectricity. However, the electromechanical actuation mechanisms are not yet to be established. This paper presents the modeling of the actuation behavior of water infused cellulose samples and their composite dielectric constants calculated by Maxwell-Wagner theory. Electro-mechanical forces were calculated using Maxwell stress tensor method. Bending deflection was evaluated from simple beam model and compared with experimental observation, which result good correlation with each other.

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Electromechanical Simulation of Cellulose Based Biomimetic Electro-Active Paper (생체모방 종이작동기(electro-active paper)의 전기기계적인 구동 시뮬레이션)

  • Jang, Sang-Dong;Kim, Jae-Hwan;Kim, Heung-Soo
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.17 no.12
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    • pp.1179-1183
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    • 2007
  • Electro-Active paper(EAPap) is a new smart material that has a potential to be used in biomimetic actuator and sensor. It is made by cellulose that is abundant material in nature. EAPap is fascinating with its biodegradability, lightweight, large displacement, high mechanical strength and low actuation voltage. Actuating mechanism of EAPap is known to be the combined effects of ion migration and piezoelectricity. However, the electromechanical actuation mechanisms are not yet to be established. This paper presents the modeling of the actuation behavior of water infused cellulose samples and their composite dielectric constants calculated by Maxwell-Wagner theory. Electro-mechanical forces were calculated using Maxwell stress tensor method. Bending deflection was evaluated from simple beam model and compared with experimental observation, and which result in good correlation with each other.

Ion Migration Failure Mechanism for Organic PCB under Biased HAST (고온고습 전압인가(Biased HAST) 시험에서 인쇄회로기판의 이온 마이그레이션 불량 메커니즘)

  • Huh, Seok-Hwan;Shin, An-Seob;Ham, Suk-Jin
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.1
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    • pp.43-49
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    • 2015
  • By the trends of electronic package to be smaller, thinner and more integrative, organic printed circuit board is required to be finer Cu trace pitch. This paper reports on a study of failure mechanism for PCB with fine Cu trace pitch using biased HAST. In weibull analysis of the biased HAST lifetime, it is found that the acceleration factor (AF) of between $135^{\circ}C/90%RH/3.3V$ and $130^{\circ}C/85%RH/3.3V$ is 2.079. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that $Cu_xO/Cu(OH)_2$ colloids and Cu dendrites were formed at anode (+) and at cathode (-), respectively. Thus, this gives the evidence that Cu dendrites formed at cathode by $Cu^{2+}$ ion migration lead to a short failure between a pair of Cu nets.