• Journal of Hydrogen and New Energy
• /
• v.26 no.2
• /
• pp.184-191
• /
• 2015

As the power electronics system increases the frequency, the power loss and thermal management are paid more attention. This research presents a real time model of dissipation power with junction temperature response for 120kw IGBT inverter which is applied to the thermal management of high power IGBT inverter. Since the computational time is critical for real time simulation, look-up tables of IGBT module characteristic curve are implemented. The power loss from IGBT provides a clue to calculate the temperature of each module of IGBT. In this study, temperature of each layer in IGBT is predicted by lumped capacitance analysis of layers with convective heat transfer. The power loss and temperature of layers in IGBT is then communicated due to mutual dependence. In the dynamic model, PWM pulses are employed to calculation real time IGBT and diode power loss. Under Matlab/Simulink$^{(R)}$ environment, the dynamic model is validated with experiment. Results showed that the dynamic response of power loss is closely coupled with effective thermal management. The convective heat transfer is enough to achieve proper thermal management under guideline temperature.

• Korean Journal of Metals and Materials
• /
• v.46 no.9
• /
• pp.585-592
• /
• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.10a
• /
• pp.1286-1289
• /
• 2004

A new thermal bimorph actuator for large out-of-plane displacement is designed, fabricated and tested. The deflecting beam is composed of polyimide, heater, and polyvinyl difluorides with tetrafluoroethylene(PVDF-TrFE). The large difference of coefficient of thermal expansion(CTE) of two polymer layers (polyimide and PVDF-TrFE) can generate a large deflection with relatively small temperature rising. Compared to the most conventional micro actuators based on MEMS(micro-electro mechanical system) technology, a large displacement, over 1 mm at 20 mW, could be achieved. The proposed actuator can find applications where a large vertical displacement is needed while keeping compact overall device size, such as a micro zooming lens.

• The Journal of Information Technology
• /
• v.10 no.3
• /
• pp.47-58
• /
• 2007

In this paper, we designed and manufactured the distortion-cancellation module which is able to compensate thermal-noise distortion by software. The distortion-cancellation algorithm not only bring forth system non-linear distortion by input level but also bring compensate component of distortion by thermal to get rid off distortion from now on. After TMS 320C6711 DSP to recognize our algorithm, we manufactured the module for every kinds of system. To evaluate efficiency of the distortion-cancellation module, we designed and manufactured communication system. By measured result, if system output power is -3dBm equally, 12dB of ACLR has improved in 1MHz away from a center frequency, and also gain has increased up to 0.5dB.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.17 no.1
• /
• pp.65-69
• /
• 2004

We synthesized photoalignment material of high thermal resistance with hydroxyl aromatic polyimide, and studied the liquid crystal (LC) aligning capabilities on the photopolymer layers. Also, electro-optical (EO) performances for the twisted-nematic (TN)-liquid crystal display (LCD) photoaligned with linearly polarized UV exposure were investigated. A good LC alignment with UV exposure on the photopolymer surface can be obtained. However, the low pretilt angles were obtained below 1$^{\circ}$. The Voltage-transmittance (V-T) curve without backflow bounce in the photoaligned TN cell with UV exposure was observed. The response time of photoaligned TN cell was measured about 24 ms. Finally, The photoaligned TN cell has few hysteresis, and shows the residual DC voltage that is less.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.29 no.4 s.235
• /
• pp.526-533
• /
• 2005

Reliability problem in inkjet printhead, one of MEMS devices, is also very important. To eject an ink drop, the temperature of heater must be high so that ink contacting with surface reaches above $280^{o}C$ on the instant. Its heater is embedded in the thin multi-layer in which several materials are deposited. MEMS processes are the main sources of residual stresses development. Residual stress is one of the factors reducing the reliability of MEMS devices. We measured residual stresses of single layers that consist of multilayer. FE analysis is performed using design of experiment(DOE). Transient analysis for heat transfer is performed to get a temperature distribution. And then static analysis is performed with the temperature distribution obtained by heat transfer analysis and the measured residual stresses to get a stress distribution in the structure. Although the residual stress is bigger than thermal stress, thermal stress is more influential on fatigue life.

• Proceedings of the KIEE Conference
• /
• 1998.07e
• /
• pp.1644-1646
• /
• 1998

High-Smokestacks have been the symbol of the thermal power plant. Those cause the thermal power plant to be damaged by lightening for reaching several hundreds meter. In this paper, we investigated the accident of low-voltage source circuit due to grounding potential rise by lightening via high-smokestack in practically driving power plant, described examination into the cause and the impulse analysis. We analysed the transient voltage by EMTP(ElectroMagnetic Transient Program) via modeling the grounding system of power plant. This theoretical results coincided with practical accidental state. Therefore, it was verified that we could apply the grounding system of power plant and substation with the distribution-circuit analysis(EMTP).

• Journal of the Korea Society of Computer and Information
• /
• v.22 no.11
• /
• pp.31-37
• /
• 2017

In this paper, we propose efficient design and construction of an infrared wide angle optical system with low distortion utilizing a high resolution detector for automobile application. The operational convenience and the recognition ability have been improved significantly by applying the high resolution uncooled thermal detector with wide angle optical design. The active ahtermalization mechanism is implemented so that the adjustment of the optical component of the system is to be made automatically according to the temperature change by motorized control. The modulation transfer function (MTF) is about 50% at the Nyquist frequency close the diffraction limit. The distortion is less than 5% at the edge field. As a result, a high-resolution uncooled thermal optical system with wide field of view (FOV) is assembled, aligned and its performance is tested successfully.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.58 no.11
• /
• pp.2155-2161
• /
• 2009

In this paper, we dealt with the electro-thermal coupling analysis for temperature prediction of power transformer. Heat transfer coefficient are calculated using Nusselt number in accordance with heat source generated from transformer windings and core materials. The calculated temperatures in power transformer were compared to those of measured ones and showed good agreement. This coupling method using heat transfer coefficient can be used at the design stage of power transformer efficiently.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.11a
• /
• pp.502-505
• /
• 2003

We synthesized high thermal photoalignment material with hydroxyl aromatic polyimide, and studied the liquid crystal (LC) aligning capabilities on the photopolymer layers. Also, electro-optical (EO) performances for the twisted-nematic (TN)-liquid crystal display (LCD) photoaligned with linearly polarized UV exposure were investigated. A good LC alignment with UV exposure on the photopolymer surface can be obtained. However, the low pretilt angles were obtained below $1^{\circ}$. The Voltage-transmittance (V-T) curve without backflow bounce in the photoaligned TN cell with UV exposure was observed. The response time of photoaligned TN cell was measured about 24 ms.