• Korean Journal of Materials Research
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• v.11 no.11
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• pp.941-946
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• 2001

Conductive microspheres with a density of 0.2 g/cc were fabricated by electroless silver plating for application to the light-weighted microwave absorbers. The silver plating was conducted with the variation of plating conditions (sensitizing condition, $AgNO_3$, concentration, amount of reducing agent). Specimens have very low electro-resistivity. Under an optimum processing condition, conductive microspheres with uniform silver plating layer can be produced. Rubber-sphere composites were fabricated and their microwave absorbing properties were measured by HP8722D Network Analyzer. It was found that the lower the electrical resistance of microsphere, the better the microwave absorbing properties. Feasibility of microwave absorbers using this microspheres can be demonstrated with the result of microwave reflection loss of -15 dB and thickness of 1.44 mm.

• Journal of the Korean institute of surface engineering
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• v.37 no.6
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• pp.344-349
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• 2004

Emulsions were formed through putting small quantity of nickel electroplating solution into supercritical carbon dioxide, and then electroplating in the $sc-CO_2$ emulsions was conducted. It is an environmental-friendly technology that can solve the treatment of a large quantity of toxic plating wastewater, which is a big problem in the existing wet plating, and also can reduce secondary waste generation fundamentally. Supercritical carbon dioxide emulsions enhanced by ultrasonic horn were formed by non-ionic surfactant and nickel solution. Plating condition within emulsions was set up as 120bar and $55^{\circ}C$ through measurement of electrical conductivity following the pressure change. Experiments were conducted respectively against supercritical carbon dioxide emulsions electroplating and general chemical electroplating, and then their results were compared and analyzed. As the experiment result utilizing emulsions, plating surface was formed very evenly even with a small quantity of electroplating solution, and fine particles were plated compactly without any pinhole or crack due to hydrogenation, which occurs in general electroplating. Used electroplating solution can be reused through recovery process. Therefore, this technology will be able to be applied as new clean technology in electro-plating.

• Korean Chemical Engineering Research
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• v.53 no.6
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• pp.814-817
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• 2015

A new ionic mass transfer correlation is derived for the fluid-saturated, horizontal porous layer. Darcy-Forchheimer model is used to explain characteristics of fluid motion. Based on the microscales of turbulence a backbone mass transfer relation is derived as a function of the Darcy-Rayleigh number, $Ra_D$ and the porous medium Schmidt number, $Sc_p$. For the Darcy's limit of $Sc_p{\gg}Ra_D$, the Sherwood number, Sh is a function of $Ra_D$ only. However, for the region of high $Ra_D$, Sh can be related with $Ra_DSc_p$. Based on the present backbone equation and the electrochemical mass transfer experiments which are electro plating or electroless plating, the new ionic mass transfer correlation is suggested in the porous media.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2002.05a
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• pp.36-36
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• 2002

Effects of pulse-plating on the wear and corrosion resistance of chrome-carbon layers were studied. The plating were carried out at $06A/\textrm{cm}^2$ in modified Sargent bath containing formic acid at $53^{\circ}C$. The chrome layer were super-saturated with carbon up to 2.0wt. %, which precipitated as chrome carbide such as $Cr_{23}C_6$ after vacuum aging above $200^{\circ}C$ for 1 hour. This resulted in improvement of hardness and wear resistance of the chrome layer. Considering the reduction of corrosion resistance due to the thermal effect, optimum vacuum aging condition of the chrome layer in this study was I-hour at $200^{\circ}C$.

• Journal of the Korean institute of surface engineering
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• v.28 no.1
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• pp.23-33
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• 1995

AISI 304 stainless steel has high resistance to corrosion due to the presence of a self-healing chromium oxide film on the surface, which also accounts for the difficulty in plating. Surface cleaning of this alloy is of fundamental importance in gold plating since its effectiveness puts an upper limit on the quality of the final coating. The cleaning of AISI 304 stainless steel was investigated with elimination of artificial passive oxide film and degreasing of remaining buffing wax as stearic acid. The familiar cleaning methods i.e. ultrasonic cleaning, electro-cleaning and activation treatment were fabricated in this study. Activation treatment showed best cleaning efficiency for elimination of passive oxide film among these methods, which was also confirmed by AES (Auger electron spectrometer) analysis. However, the best condition of cleaning was obtained by combining these methods. Electrocleaning time, for degreasing the stearic acid layer, was decreased with increasing amount of added KCN.

• International Journal of Quality Innovation
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• v.2 no.2
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• pp.69-92
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• 2001

The laser-assisted seeding (LAS) process has potential to replace conventional electroless copper plating in Printed Circuit Board (PCB) manufacturing since it combines the steps of laser drilling and plating into one single process. In the LAS process, the single extra LAS step can metallize a microvia. Thus, the process steps can be greatly reduced and the productivity enhanced, but also the high aspect ratio microvias can be metallized. The objectives of this paper are to study the LAS copper thickness within PCB microvias and the thermal reliability of the microvias produced by this process. It was found that results were satisfactory in both the reliability test and also the LAS copper thickness which both comply with IPC standard, the copper thickness produced by the LAS process is sufficient for subsequent electro-plating process. The reliability of the microvias produced by LAS process is acceptable which are free from any voids, corner cracks, and distortion in the plated copper.

• Applied Chemistry for Engineering
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• v.19 no.2
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• pp.228-235
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• 2008

Nickel plating thickness increased with the electric current density, and the augmentation was more thick in $6{\sim}10A/dm^2$ than low current. Hull-cell analysis was tested to evaluate the current density. Optimum thickness was obtained at a temperature of $60^{\circ}C$, and the pH fluctuation of 3.5~4.0. Over the Nickel ion concentration of 300 g/L, plating thickness increased with the current density. The rate of decrease in nickel ion concentration was increased with the current density. The quantity of plating electro-deposition was increased at the anode surface, which was correlated with the increase of plating thickness. The plating thickness was increased because of the quick plating speed. However, the condition of the plating surface becomes irregular and the minuteness of nickel plating layer was reduced with the plating rate. After the corrosion test of 25 h, it was resulted in that maintaining low electric current density is desirable for the excellent corrosion resistance in lustered nickel plating. According to the program simulation, the thickness of diffusion layer was increased and the concentration of anode surface was lowered for the higher current densities. The concentration profile showed the regular distribution at low electric current density. The field plating process was controlled by the electric current density and the plating thickness instead of plating time for the productivity. The surface physical property of plating structure or corrosion resistance was excellent in the case of low electric current density.

• Proceedings of the Optical Society of Korea Conference
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• 2006.07a
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• pp.193-194
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• 2006

• Membrane and Water Treatment
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• v.11 no.3
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• pp.201-206
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• 2020

Electrodialysis (ED) is used in wastewater treatment, during the processing and recovery of beneficial materials, to produce usable water. In this study, sulfate and chlorine ions, which are the anions majorly used for electroplating, were studied as factors affecting the recovery of copper, nickel and water from wastewater by electrodialysis. Although the removal rates of copper and nickel ions were slightly higher with the use of chlorine ions than of sulfate ions, the removal efficiencies were above 99.9% under all experimental conditions. The metal ions of the plating wastewater flowed through the ion exchange membrane of the diluate tank and the concentrate tank while all the water moved together due to electro-osmosis. The migration of water from the diluate tank to the concentrate tank was higher in the presence of a monovalent chloride ion compared to that of a divalent sulfate ion. When sulfate was the anion used, the recoveries of copper and nickel increased by about 25% and 30%, respectively, as compared to the chloride ion. Therefore, when divalent ions such as sulfate are present in the electrodialysis, it is possible to reduce the movement amount of water and highly concentrate the copper and nickel in the plating wastewater.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1532-1536
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• 2007

A plastic substrate with tiny rectangular pillars less than 100nm is injection molded to study pattern replication in injection molding. The size of the substrate is 50mm ${\times}$ 50mm and 1mm thick. The substrate has 9 patterned areas of which size is 2mm ${\times}$ 2mm respectively. The lengths of the pillars are 50nm, 100nm, 150nm and 200nm and the width and height are 50nm and about 100nm respectively. A pattern master is fabricated by e-beam writing using positive PR(photo resist) and then a nickel stamper replicated from the PR master by nickel electro-plating. Cr is deposited on the PR pattern master before nickel electro-plating as a conducting layer. Using this nickel stamper, several injection molding experiments are done to investigate effects of the injection molding parameters such as mold temperature, injection rate, packing pressure or pattern location on the replication of the patterns under 100nm.