• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.1
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• pp.1-5
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• 2001

P(VDF/TrFE) copolymer thin films with 70/30 and 80/20 mol% VDF (polyvinylidene fluoride) and TrFE (trifluoroethylene) rates were prepared by using a vapor deposition method, During thin films were prepared, the substrate temperatures were maintained at 30 $^{\circ}C$ and 120 $^{\circ}C$, and the heating source temperature was fixed at 350 $^{\circ}C$. Contary to PVDF homopolymer, P(VDF/TrFE) copolymers showed the Curie point(Tc) below the melting point. The Curie point (Tc) and the melting point of the P(VDF/TrFE) copolymers were changed as a function of substrate temperature and the VDF mol%. The Curie point and the melting point of P(VDF/TreFE) thin films decreased and increased with increasing substrate temperature, respectively. Also with increasing VDF mol%, the melting point decreased slightly, however the Curie point increased.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.6
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• pp.427-432
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• 2018

High-capacity secondary batteries can cause explosion hazards owing to microcurrent variations or current surges that occur in short circuits. Consequently, complete safety cannot be achieved with general protection that is limited to a mere current fuse. Hence, in the case of secondary batteries, it is necessary for the protector to limit the inrush current in a short circuit, and to detect the current during microcurrent variations. To serve this purpose, a fuse can be employed for the secondary battery protection circuit with current detection. This study aims at designing a protection device that can stably operate in the hazardous circumstances associated with high-capacity secondary batteries. To achieve the said objective, a detecting fuse was designed from an alloy of low melting point elements for securing stability in abnormal current states. Experimental results show that the operating I-T and V-T characteristic constraints can be satisfied by employing the proposed current detecting self-contained low melting point fuse, and through the resistance of the heating resistor. These results thus verify that the proposed protection device can prevent the hazards of short circuit current surges and microcurrent variations of secondary batteries.

• Transactions on Electrical and Electronic Materials
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• v.16 no.6
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• pp.342-345
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• 2015

The n -type Hf_0.25Zr_0.25Ti_0.5NiSn_0.998Sb_0.002 Half-Heusler (HH) alloy composition was prepared by using the induction melting method in addition to the mechanical grinding, annealing, and spark plasma sintering processes. Analysis of X-ray diffraction (XRD) results indicated the formation of a pure phase HH structured compound. The electrical and thermal properties at temperatures ranging from room temperature to 718 K were investigated. The electrical conductivity increased with increasing temperatures and demonstrated nondegenerate semiconducting behavior, and a large reduction in the thermal conductivity to the value of 2.5 W/mK at room temperature was observed. With the power factor and thermal conductivity, the dimensionless figure of merit was increased with temperature and measured at 0.94 at 718 K for the compound synthesized by the induction melting process.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.352-352
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• 2000

ESR(ElectroSlag Remelting) Process is secondary fine process and melts steels by electric resistance heat and fines the melting steels by an appropriate solidification process parameters which affects the melting and solidification processes to get the high quality products. This paper describes a method to derive the mathematical model and analysis the dynamic characteristics for designing a controller of the ESR processes. The ESR process consists of a melting and solidificating processes and electrical system include the contact resistance mechanism. In this paper, we consider only the static relationship between inputs and outputs of the electric system because the dynamics of the electric system is so fast compared with the melting and solidificating processes which are analysed by using finite difference method. As the results, the fine processing in ESR is analysed and the process controller could be designed based on the process dynamic analysis.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.76.4-76
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• 2001

ESR(ElectroSlag Remelting) Process is secondary fine process and melts steels by electric resistance heat and fines the melting steels by an approproate solidification process. The final products are determined through the velocity of melting and the course of solidification in the process that is achieved by way of proper course of solidification. Thus, it is very important to monitor and control the process parameters which affects the melting and solidification process to get the high quality products. This paper describes a method to derive the mathematical model and analysis the dynamic characteristics for designing a controller of the ESR processes. The process consists of a melting and solidifying process and electrical system include the contact resistance mechanism ...

• Transactions on Electrical and Electronic Materials
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• v.3 no.3
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• pp.21-24
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• 2002

Two kinds of $Nd_{1+X}Ba_{2-X}Cu_3O_{7-{\delta}}$, the sintering samples and zone melting samples, were heat-treated under pure Ar at 950$^{circ}C$. The substitution of Nd ion for Ba ion in the $Nd_{1+X}Ba_{2-X}Cu_3O_{7-{\delta}}$ before and after the heat treatment was investigated by XRD. In order to confirm the effects of the heat treatment, the Tc and Jc of samples with/without the heat treatment under Ar were comparatively studied. $Nd_{1+X}Ba_{2-X}Cu_3O_{7-{\delta}}$ samples were oxygenated under pure oxygen at $300^{circ}C$. From the XRD pattern it was found that the sample with x<0.4 was transferred from tetragonal phase to orthorhombic phase after the oxygenation, while the sample with x>0.4 did not show the phase transition even after a long time oxygenation. Therefore, the low oxygen partial pressure (Ar+1 % O$_2$) was used for the ambient atmosphere of the zone-melting samples, which could reduce the melting temperature and depress the substitution of Nd for Ba. After the improvement in the zone-melting process, the Jc value was increased to 2 x $10^4$A/$cm^2$ (0 T, 78 K). The particle orientation and the structure of zone-melted NdBaCuO were studied by the XRD and SEM analysis.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.1
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• pp.74-78
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• 2024

We have studied the effects of Ag on the characteristics of Sn₄₈In₅₂Ag_x (wt%) low-melting solders for photovoltaic ribbons. The Sn₄₈In₅₂ (wt%) solder coexisted in the InSn₄ and In₃Sn alloys. Ag atoms added in the solder formed an AgIn₂ alloy by reacting with some part of In atoms, while they did not react with Sn atoms. The addition of Ag atoms in the Sn₄₈In₅₂Ag_x (wt%) solders showed useful results; an increase in peel strength and a decrease in melting temperature. The peel strength of the ribbon plated with the Sn₄₈In₅₂ (wt%) solder was 53.6 N/mm², and that of the Sn₄₈In₅₂Ag₁ (wt%) solder largely increased to 125.1 N/mm². In the meanwhile, the melting temperature of the Sn₄₈In₅₂ (wt%) solder was 119.2℃, and that of the Sn₄₈In₅₂Ag₁ (wt%) solder decreased to 114.0℃.

• 전기의세계
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• v.37 no.6
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• pp.48-52
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• 1988

본고에서는 고온열원으로써 열 플라즈마를 금속의 melting/remelting이나 extractive metallurgy에 이용할 때 얻을 수 있는 에너지 절약효과와 경제적인 이득 및 공정상의 장점등을 소개하고자 한다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.12
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• pp.1326-1331
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• 2004

In this paper, we have investigated thermal properties and Impurities content of specimens showing by changing the content of carbon black that is semiconductive materials for underground power transmission. Specimens were made of sheet form with the three of existing resins and the nine of specimens for measurement. Impurities content of specimens was measured by ICPAES(Inductively Coupled Plasma Atomic Emission Spectrometer). Heat capacity(ΔH) and melting temperature(Tm) were measured by DSC(Differential Scanning Calorimetry). The ranges of measurement temperature were from $0^{\circ}C$ to 20$0^{\circ}C$, and heating temperature was 4$^{\circ}C$/min. And then thermal diffusivity was measured by LFA 447. The measurement temperature was $25^{\circ}C$. Impurities content was highly measured according to increasing the content of carbon black from ICPAES results. And heat capacity and melting temperature from the DSC results were simultaneously decreased according to increasing the content of carbon black, while thermal diffusivity was increased according to increasing the content of carbon black. Because ionic impurities of carbon black containg Fe, Co, Mn, Al, and Zn were rapidly increasing kinetic energy by vibration of ionic impurities through the applied heat energy.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.8
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• pp.893-897
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• 2004

In this paper, we studied the mechanical and thermal properties on slice XLPE sheet from 22 kV and 154 kV power cables. Interface structures are XLPE/semiconductor and XLPE/water/semiconductor. We evaluated mechanical property, thermal analysis, moisture analysis. Based on mechanical and thermal properties of the 22 kV XLPE sheet, elongation, mechanical strength, and melting point were evaluated to be 485.48 %, 1.74 kgf/$\textrm{mm}^2$ and $102.48^{\circ}C$, respectively. It was also evaluated from the mechanical and thermal properties of 154 kV XLPE sheet that elongation, mechanical strength, and melting point are 507.81 %, 1.8 kgf/$\textrm{mm}^2$, $106.9^{\circ}C$, respectively. A region shows a rapid increase in tension strength, and B region only shows increase in elongation under 1.0 kgf/$\textrm{mm}^2$, C region shows increase in both elongation and tension strength. Difference of melting point came from the chain of XLPE polymer and the difference of crystallization. Moisture density of semiconductor showed 800 ∼ 1200 ppm before extrude, 14000 ∼24000 ppm after extrude. These values were higher than the moisture density of XLPE (300∼560) ppm.