• The Transactions of the Korea Information Processing Society
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• v.1 no.4
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• pp.438-451
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• 1994

A low complexity, fault detecting computer architecture for utilisation in programmable logic controllers is designed. The cyclic operating mode of PLCs and a specification level, graphical programming paradigm based on the interconnection of application oriented standard software function modules are architecturally supported. Thus, by design, there is no semantic gap between the programming and machine execution levels enabling the safety licensing of application software by an extremely simple, but rigorous method, viz, diverse back translation.

• Proceedings of the KIEE Conference
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• 2000.07b
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• pp.1065-1067
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• 2000

This paper describes performance analysis of ARCP Inverter, which can offer zero voltage switching at nominal voltage stress. The system consists of a voltage-source inverter with sort-switching module. Each main switch is connected in parallel with resonant capacitor and two auxiliary switches are placed in series with a resonant reactor for soft-switching capability. The described ARCP inverter could be effectively applied for active power filter reactive power compensator, and UPS.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.85-86
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables arc relatively high because of expensive slurry. In this paper, in order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, abrasives were added in the diluted silica slurry (DSS) in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry (MAS) for the oxide CMP application.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.81-82
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, so as to investigate the influence of mixed abrasive slurry (MAS), such as $ZrO_2$, $CeO_2$, and $MnO_2$ for Ti-CMP application.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.83-84
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• 2006

Chemical mechanical polishing (CMP) process has been attracted as an essential technology of multi-level interconnection. However, the COO (cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. Also, the addition effects of $MnO_2$ abrasives and the diluted silica slurry (DSS) on CMP performances were evaluated. Finally, we have investigated the possibility of new abrasive for the oxide CMP application.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.1-10
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• 2009

Carbon nanotube(CNT)s have been considered as one of the most unique materials due to the their superior mechanical, thermal and electrical properties. Therefore, numerous studies have been performed for the utilization of CNTs. This review article focuses on the recent research trends on the utilization of CNTs for new interconnect materials in electronics packaging. Major contents mentioned are the direct interconnection technology using CNTs and the main properties of polymer/CNTs composite materials. This article is aimed at the reviewing of important results from the recent studies and providing the straightforward understanding of the results through the mutual analysis and a industrial viewpoint.

• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.275-278
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• 1987

In this paper, a programming system for SCARA-type robots is designed, consisting of robot language, computational facilities and programming tools for handling interconnection environments. In designing the robot language, CLRC(C Library for Robot Control) is introduced, using the general-purpose language 'C' as base programming language. Also the motion primitives for Continuous Path control as well as Point-To-Point motion arc included. By means of frame and homogeneous transformations the system is capable of applying the SCARA-type robot efficiently and easily for any given task.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1727-1728
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by do-ionized water (DIW). And then, $ZrO_2$,$CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1731-1732
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• 2006

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, $ZrO_2$, $CeO_2$, and $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. We have investigate the possibility of new abrasive for the oxide CMP application.

• Proceedings of the KIEE Conference
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• 2005.07b
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• pp.1736-1738
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• 2005

This paper presents experimental operation with utility interactive 50kw photovoltaic generation system. And that describe configuration of utility interactive photovoltaic system which power supply for dormitory. The status of photovoltaic generation system components and interconnection and safety equipment will be summarized. This paper discusses property operation state which system endure division of power for dormitory.