• Title/Summary/Keyword: dynamic DSC

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Study on the Thermal Decomposition Characteristics of the Tert-butylperoxymaleate using the DSC (DSC를 이용한 터셔리부틸퍼옥시말레이트의 열분해특성에 관한 연구)

  • Lee, Jung-Suk;Choi, Yi-Rac;Han, Ou-Sup
    • Journal of the Korean Institute of Gas
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    • v.24 no.3
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    • pp.40-46
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    • 2020
  • Tertbutylperoxymaleate is the one of the organic peroxides used as a raw material of initiator formulations of artificial marble manufacturing. In this study, the thermal decomposition characteristic of TBPM was evaluated using the differential scanning calorimeter in the air and nitrogen circumstance. Regardless of the reaction atmosphere, TBPM showed the exothermic peak due to the drastic decomposition reaction below 130 ℃. The activation energy estimated by dynamic methods had a range of 203~217 kJ/mol and that estimated by model-free analysis method had a range of 118~232 kJ/mol with a thermal conversion. And the ADT24, the temperature that lead to the maximum heating rate within 24 hours, was evaluated as (80~95) ℃ using the estimated activation energy.

Curing of Epoxy Resin with Natural Cashew Nut Shell Liquids (천연 캐슈너트 외피유를 이용한 에폭시 수지의 가교)

  • Nah, Chang-Woon;Go, Jin-Hwan;Byun, Joon-Hyung;Hwang, Byung-Sun
    • Composites Research
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    • v.21 no.1
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    • pp.16-21
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    • 2008
  • The cure behavior of epoxy resin with a conventional amide-type hardener(HD) was investigated in the presence of castor oil(CO), cashew nut shell liquid(CNSL) and CNSL-formaldehyde resin(CFR) by using a dynamic differential scanning calorimetry(DSC). The activation energy of curing reaction was also calculated based on the non-isothermal DSC thermograms at various heating rates. An one-stage curing was noted in the case of epoxy resin filled with CO, while the epoxy resin with CNSL and CFR showed a two-stage curing process. A competitive cure reaction was noted for the epoxy resin/CNSL(or CFR)/HD blends. In the absence of HD, the CFR showed lower values of curing enthalpy than that of CNSL. The activation energy of epoxy resin curing increased with increasing the CNSL and CFR loading.

Effects os Stoichiometric Ratio on Dynamic Mechanical Behavior for an Epoxy/Anhydride System (에폭시/산무수물계에서 동역학적 거동에 미치는 화학양론비의 효과)

  • Kim, Deuk-Su;Lee, Jong-Geun
    • Korean Journal of Materials Research
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    • v.7 no.12
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    • pp.1089-1096
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    • 1997
  • 본 연구에서는 에폭시/산무수물계에 화학양론비(r=산무수물/에폭시)를 0.5, 0.7,0.9,1.1로 변화시켜 서로 다른 두종류의 경화촉진제 1-cyanoethy1-2-ethy1-4-methy1 imidazole(2E4MZ-CN)과 N,N-dimethy1 benzy1 amine(BDMZ)을 첨가한 시료에 대한 경화거동과 경화 후 물성을 관찰하였다. 이 시료의 등온 경화거동은 동역학 측정기(dynamic mechanical analyzer, DMA)와 시차주사 열량분석기(differential scanning calorimeter, DSC)를 이용하여 조사하였다. DMA로부터 구해진 결과를 보면 경화시 상대저장강성을 (relative storage rigidity, RSR)과 상대손실강성율(relative loss rigidity, RSR)과 상대손실강성율(relative loss rigidity, RLR)의 변화가 r값과 경화촉진제의 종류에 영향을 받았다. 그리고 DSC결과는 r값이 감소함에 따라 경화가 촉진되는 것으로 나타났다. 경화물의 성질을 조사하기 위하여 사용된 DMA로부터 얻어진 유리전이온도(glass transition temperature, T$_{g}$)와 가교결합간의 평균분자량(average molecular weigh between crosslinks, M$_{c}$은 사용한 두 경화촉진제에 대하여 r값의 영향이 다르게 나타났다. BDMA의 경우는 T$_{g}$가 1:1화학양론비인 r=0.9에서 최고치를 보였으나, 2E4MZ-CN은 r이 감소함에 따라 계속 증가하는 양상을 보였다. 이와 같은 경향은 2E4MZ-CN을 경화촉진제로 사용하였을 때 에폭시가 과량으로 될수록 잔류 에폭시기들간의 에케르반응이 추가적으로 일어나 M$_{c}$가 감소하기 때문이다.

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Decentralized Dynamic Surface Control for Large-Scale Interconnected Systems (연결식 대형시스템을 위한 분산 동적 표면 제어)

  • Song Bong-Sob
    • Journal of Institute of Control, Robotics and Systems
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    • v.12 no.4
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    • pp.339-345
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    • 2006
  • An analysis methodology of Decentralized Dynamic Surface Control (DDSC) for the large-scale interconnected nonlinear systems is presented in this paper. While the centralized DSC approach proposed in [14] has a difficulty to check the quadratic stability for the large-scale systems numerically due to dramatic increases of the order of overall augmented error dynamics, DDSC is relatively easy to check the quadratic stability since lower order error dynamics of individual subsystems are used. Then, a systematic procedure for designing DDSC will be developed. Furthermore, after a quadratic function containing a reachable set is defined, it will be calculated numerically to indicate the performance of DDSC in the framework of convex optimization. Finally an illustrative example will be given for showing the advantages of DDSC compared with other decentralized nonlinear control techniques.

Robust Stabilization of Decentralized Dynamic Surface Control for a Class of Interconnected Nonlinear Systems

  • Song, Bong-Sob
    • International Journal of Control, Automation, and Systems
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    • v.5 no.2
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    • pp.138-146
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    • 2007
  • The analysis and design method for achieving robust stabilization of Decentralized Dynamic Surface Control (DDSC) is presented for a class of interconnected nonlinear systems. While a centralized design approach of DSC was developed in [1], the decentralized approach to deal with large-scale interconnected systems is proposed under the assumption that interconnected functions among subsystems are unknown but bounded. To provide a closed-loop form with provable stability properties, augmented error dynamics for N nonlinear subsystems with DDSC are derived. Then, the reachable set for errors of the closed-loop systems will be approximated numerically in the form of an ellipsoid in the framework of convex optimization. Finally, a numerical algorithm to calculate the $L_2$ gain of the augmented error dynamics is presented.

Cure and Heat Transfer Analysis in LED Silicone Lens using a Dynamic Cure Kinetics Method (승온 반응속도식을 이용한 LED용 실리콘 렌즈의 경화 및 열전달해석)

  • Song, M.J.;Kim, K.H.;Hong, S.K.;Park, J.Y.;Lee, J.W.;Yoon, G. S.
    • Transactions of Materials Processing
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    • v.24 no.2
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    • pp.101-106
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    • 2015
  • Recently, silicone is being used for LED chip lens due to its good thermal stability and optical transmittance. In order to predict residual stresses, which cause optical birefringence and mechanical warpage of silicone, a finite element analysis was conducted for the curing of silicone during molding. For the analysis of the curing process, a dynamic cure kinetics model was derived based on the results of a differential scanning calorimetry (DSC) testing and applied to the material properties for finite element analysis. Finite element simulation results showed that a step cure cycle reduced abrupt reaction heat and showed a decrease in the residual stresses.

Toughnening of Dielectric Material by Thermoplastic Polymer

  • Lee, Jung-Woo;Cho, Jae-Choon;Ra, Seung-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.207-208
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    • 2007
  • Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. In this work, we synthesized dielectric composite materials based on epoxy resin, and investigated their thermal stabilities and dynamic mechanical properties for thermal imprint lithography. In order to enhance the mechanical properties and toughness of dielectric material, various modified polyetherimide(PEI) was applied in the resin system. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various conditions were studied using dynamic differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), and Universal Test Method (INSTRON).

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Effect of Non-Conducting Filler Additions on Anisotropic Conductive Adhesives(ACAs) Properties and the Reliability of ACAs Flip Chip on Organic Substrates (이방성 전도 접착제 물성과 유기 기판 플립 칩의 신뢰성에 미치는 비전도성 충진재의 영향)

  • Im, Myeong-Jin;Baek, Gyeong-Uk
    • Korean Journal of Materials Research
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    • v.10 no.3
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    • pp.184-190
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    • 2000
  • We investigated the effect of filler content on the thermo-mechanical properties of modified ACA composite materials by incorporation of non-conducting fillers and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACA s composites with different content of non-conducting fillers, differential scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechnical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

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폴리프로필렌의 친수화 개질 -Polypropylene-poly(vinyl alcohol-co-ethylene) 블렌드의 특성-

  • 임상규;손태원
    • Proceedings of the Korean Fiber Society Conference
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    • 1996.04a
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    • pp.64-68
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    • 1996
  • PP-EVOH(poly(vinyl alchol-co-ethylene)) blends were prepared by the mixing of polypropylene and poly(vinyl alcohol-co-ethylene) containing 38mol% of ethylene units (EVOH38) at melt state above PP melting temperature. The materials were characterized by using dynamic mechanical thermal analysis (DMTA), differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and contact angle measurement to detemine the glass transition, meltin, decomposition temperatures, and wettability respectively. From the results, PP-EVOH(poly(vinyl alcohol-co-ethylene)) blends exgibits partial miscibility.

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Chitosan-Iron casein succinylate nanoparticles as oral delivery systems: increasing the stability and enhancing the absorption of iron nanoparticles.

  • Cho, Jung-Hye;Oungbho Kwunchit;Park, Jeong-Sook;Kim, Chong-Kook
    • Proceedings of the PSK Conference
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    • 2003.10b
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    • pp.249.1-249.1
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    • 2003
  • The objective of the study was to develop an oral delivery system to increase the stability and efficacy of iron casein succinylate. Aqueous nanoparticles were prepared using complex coacervation of the oppositely charged chitosan and iron casein succinylate with polyethyleneglycol (PEG). The physicochemical properties of nanoparticles were investigated using dynamic light scattering, zeta potential and scanning electron microscopy. Chitosan-iron casein succinylate interactions were investigated in solid state by differential scanning calorimetry (DSC) and FT-IR spectrometry. (omitted)

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