• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.767-770
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• 2000

A novel process is newly developed for building RP(Rapid Prototyping) parts using a sheet lamination technique. The build process of existing sheet lamination type RP machines consists of the following steps : feeding, lamination and cutting. In this process, the laminated part of an object is often scratched by a cutter or damaged by a laser beam due to the cutting operation preceded by lamination, In addition, decubing of the unused portion from the laminated block is difficult. In the new process, cutting operation is performed before lamination. The cutting operation takes place while a paper sheet is firmly attached on the plate using electrostatic force. Then liquid glue is applied to the calculated region of the given contour for lamination. The process aims to manufacture a $2k RP machine, what we call the Freeform Mater I, that can use A4 or latter-size used papers. A prototype machine that demonstrates the design concept is built and further research issues are discussed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1995.10a
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• pp.30-36
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• 1995

Conventionally design for multi-stage cold forging depends on the designer's experience and decision-making. Due to such non-deterministic nature of the process sequence design, a flexible inference engine is needed for process design expert system. In this study, A* searching algorithm was introduced to arrive at the vetter process sequence design considering the number of forming stages and levels of effective strain, effective stress, and forming load during the porcess. In order to optimize the process sequence in producing the final part, cost function was defined and minimized using the proposed A* searching algorithm. For verification of the designed forming sequences, forming experiments and finite element analyses were carried out in the present investigation. The developed expert system using A* searching algorithm can produce a flexible design system based on changes in the number of forming stages and weights.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.189-192
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• 2001

Recently, STI process is getting attention as a necessary technology for making high density of semiconductor by devices isolation method. However, it does have various problems caused by CMP nprocess, such as torn oxide defects, nitride residues on oxide, damages of si active region, contaminations due to post-CMP cleaning, difficulty of accurate end point detection in CMP process, etc. In this work, the various defects induced by CMP process was introduced and the above mentioned problems of CMP process was examined in detail. Finally, the guideline of future CMP process was presented to reduce the effects of these defects.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.49-53
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• 2013

Recently, studies about application of magnesium alloy sheet to automotive bodies are on the increase. For application to automotive bodies, researches about characteristics of resistance spot welding of magnesium alloy sheet are essential. Electrode life of resistance spot welding of magnesium alloy is very short due to sticking of magnesium alloy to copper alloy electrode. To increase electrode life, most effective method is inserting cover plate between electrode and magnesium sheet. But application of cover plate to actual process is difficult and decreases welding productivity. Process tape supplied automatically as cover plate can minimize lose of productivity and increase welding quality. In this study, resistance spot welding of magnesium alloy is carried out with applying process tape. Acceptable welding current region according to electrode force and welding time is determined.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2016.05a
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• pp.245-246
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• 2016

The condensation performance evaluation is required for improved living environment of apartment housings. In the current condensation performance evaluation process, high demand of manual works and repetitive process cause unexpected risks due to uncertainty and inefficiency by applying 2D CAD drawings in simulation tool. Furthermore, the evaluation requires taking in action responding to the expanding use of BIM. In this study, the analysis of current evaluation process and required functions for the process improvement based on BIM modeling were deducted from interviews with experts. It is expected that the results of this study can be employed to develop of process automation module for condensation simulation evaluation.

• Journal of The Korean Digital Architecture Interior Association
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• v.12 no.4
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• pp.125-132
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• 2012

In this study based on BIM(Building Information Modeling) apply for performing efficient remodeling project and utilized. And this study will examine a real project where a BIM based process was used in the remodeling of an single-family homes. In the remodeling design phase of the planning process was conducted for the BIM process modeling, BIM in the remodeling stage while performing the required range and level of the remodeling process were studied. Based on this, communication between client and remodeling designer, participants more expect that smooth and speeds up in remodeling. For client decision support, troubleshooting of remodeling of the design process to be effective in the BIM have been identified. The BIM model and deliverables data used for the remodeling design process of building remodeling is the most effective way, due to the increased efficiency gained in many areas.

• Proceedings of the Korea Society for Simulation Conference
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• 1998.10a
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• pp.204-208
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• 1998

The fundamental issues to evaluate machine tool's performance through simulation pertain to the physical models of the machine tool itself and of process while the practical problems are related to the development of the modular software structure. It allows the composition of arbitrary machine/process models along with the development of programs to evaluate each state of machining process. Surface roughness is one of the fundamental factors to evaluate machining process and performance of machine tool, but it is not easy to evaluate surface roughness due to its tribological complexity. This paper presents an algorithm to calculate surface roughness considering cutting geometry, cutting parameters, and contact dynamics of cutting between tool and workpiece as well as tool wear in turning process. The designed virtual machining system can be used to evaluate the surface integrity of a turned surface during the design and process planning phase for the design for manufacturability analysis of the concurrent engineering.

• Journal of the Korea Society for Simulation
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• v.8 no.1
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• pp.19-33
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• 1999

The fundamental issues to evaluate machine tools performance through simulation pertain to the physical models of the machine tool itself and of process while the practical problems are related to the development of the modular software structure. It allows the composition of arbitrary machine/process models along with the development of programs to evaluate each state of machining process. Surface roughness is one of the fundamental factors to evaluate machining process and performance of machine tool, but it is not easy to evaluate surface roughness due to its tribological complexity. This paper presents an algorithm to calculate surface roughness considering cutting geometry, cutting parameters, and contact dynamics of cutting between tool and workpiece as well as tool wear in turning process. This proposed algorithm could be used in the designed virtual machining system. The system can be used to evaluate the surface integrity of a turned surface during the design and process planning phase for the design for manufacturability analysis of the concurrent engineering.

• Korean Journal of Computational Design and Engineering
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• v.19 no.4
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• pp.402-409
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• 2014

Presented in this paper is a scheduling method for semiconductor backend process considering the backward pegging. It is known that the pegging for frontend is a process of labeling WIP lots for target order which is specified by due date, quantity, and product specifications including customer information. As a result, it gives the release plan to meet the out target considering current WIP. However, the semiconductor backend process includes the multichip package and test operation for the product bin portion. Therefore, backward pegging method for frontend can't give the release plan for backend process in semiconductor. In this paper, we suggest backward pegging method considering the characteristics of multichip package and test operation in backend process. And we describe the backward pegging problem using the examples.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.251-254
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• 1999

A new multi-seeding process for the growth of YBa$_2$Cu$_3$Oxx single crystals was developed. This process introduces an additional heating step to peritectic temperature and a subsequent slow cooling step to the growth temperature following the point when the crystals contacted. The crystal growth was resumed thereafter. The results obtained with this new process were compared with those of the conventional growth process, in which materials were only kept at the growth temperature. It was observed that the liquid phase between crystals were almost completely eliminated, but that Y2ll grains were grown during this new process. There was no significant improvement in trapped magnetic field over the conventional process, which is believed to be due to the cracks generated during the oxygen heat treatment or to the growth of YBa$_2$Cu$_3$Ox grains.