• Transactions of Materials Processing
• /
• v.25 no.5
• /
• pp.332-337
• /
• 2016

The automobile cowl cross bar which is a backbone frame part holding electrical and air conditioning components inside the cockpit module has been designed with more complex geometries recently due to demands of its enhanced functions and reduced weight of frame parts. The traditional manufacturing process using welding between tubes with different diameters shows several problems such as poor mechanical characteristics and appearance, etc. Therefore, in this study, one-piece manufacturing processes which can eliminate the welding process were developed by applying the rotary swaging process. CAE analyses were conducted to examine the feasibility of the process and prototypes were manufactured by using a rotary swaging machine with 4 split rotating dies and 12 head rollers. Bending tests of the manufactured prototypes confirmed that the rotary swaging process gives better mechanical properties comparing with the conventional processes.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2002.05a
• /
• pp.279-282
• /
• 2002

In this paper, we discuss influence of process condition on contact resistance in WSix deposition process. In the WSix deposition process, we confirmed that word line to bit line contact resistance(WBCR) due to temperature of word line WSix deposition among various process condition split experiment. RTP treatment, d-poly ion implantation dose and thickness was estimated a little bit influence on contact resistance. Also, life time of shower head in the process chamber for WSix deposition related to contact resistance. The results obtained in this study are applicable to process control and electrical characteristics for high reliability and high density DRAM's.

• IE interfaces
• /
• v.10 no.3
• /
• pp.167-177
• /
• 1997

This paper deals with an application of process value analysis method for a manufacturing process in order to redesign facility layout in a paper company. We have used the value analysis method which permits an overall and rigorous study of process by a functional approach. Firstly, customer's expectations for the future process are clearly and precisely expressed with specifications of the Functional Extern Analysis. The existing process is analyzed using various tool of the Functional Internal Analysis in the second part. From the results of these analysis, we find out that the main problems of current facility are due to scheduling and facility layout. This paper is devoted to resolve the second problem. We suggest an ideal solution in order to have a reference solution. Nextly, We give realistic choices and the final solution for the facility layout.

• International Journal of Advanced Culture Technology
• /
• v.8 no.2
• /
• pp.260-269
• /
• 2020

The Steam Assisted Gravity Drainage (SAGD) process is an enhanced method to extract oil from bitumen which involves surface and central process facilities. This paper describes the Central Process Facilities (CPF) of SAGD and proposes several retrofit plans to the Heat Exchanger Network (HEN). In this approach, the process integration scheme is applied to estimate the energy saving in HENs, and various cases are modeled in favor of a commercial simulator. Throughout this work, a minimum approach temperature of 10℃ is assumed. The results reveal that, due to the HEN optimization using process integration, the heating and cooling duties can be reduced to 29.68MW and 1.886MW, respectively. Compared with the Husky case, all cases considered in this study indicate a potential reduction of at least 6% in total cost, including investment and operation costs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.11a
• /
• pp.189-192
• /
• 2001

Recently, STI process is getting attention as a necessary technology for making high density of semiconductor by devices isolation method. However, it does have various problems caused by CMP process, such as torn oxide defects, nitride residues on oxide, damages of si active region, contaminations due to post-CMP cleaning, difficulty of accurate end point detection in CMP process, etc. In this work, the various defects induced by CMP process was introduced and the above mentioned Problems of CMP process was examined in detail. Finally, the guideline of future CMP process was presented to reduce the effects of these defects.

• Journal of the Semiconductor & Display Technology
• /
• v.16 no.4
• /
• pp.68-74
• /
• 2017

Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Up to now there have been a lot of researches on thermal NIL, but most of them have been focused on polymer deformation in the molding process and there are very few studies on the cooling and demolding process. In this paper a cooling process of the polymer resist in thermal NIL is analyzed with finite element method. The modeling of cooling process for mold, polymer resist and substrate is developed. And the cooling process is numerically investigated with the effects of imprinting temperature and residual layer thickness of polymer resist on stress distribution of the polymer resist. The results show that the lower imprinting temperature, the higher the maximum von Mises stress and that the thicker the residual layer, the greater maximum von Mises stress.

• Proceedings of the KIEE Conference
• /
• 1995.07c
• /
• pp.1085-1087
• /
• 1995

A large leakage current may be one of the critical issues for poly-silicon thin film transistors(poly-Si TFTs) for LCD applications. In order to reduce the leakage current of poly-Si TFTs, several offset gated structures have been reported. However, those devices, where the offset length in the source region is not same as that in the drain region, exhibit the asymmetric electrical performances such as the threshold voltage shift and the variation of the subthreshold slope. The different offset length is caused by the additional mask step for the conventional offset structures. Also the self-aligned implantation may not be applicable due to the mis-alignment problem. In this paper, we propose a new fabrication method for poly-Si TFTs with a self-aligned offset gated structure by employing a photo resistor reflow process. Compared with the conventional poly-Si TFTs, the device is consist of two gate electrodes, of which one is the entitled main gate where the gate bias is employed and the other is the entitled subgate which is separate from both sides of the main gate. The poly-Si channel layer below the offset oxide is protected from the injected ion impurities for the source/drain implantation and acts as an offset region of the proposed device. The key feature of our new device is the offset lesion due to the offset oxide. Our experimental results show that the offset region, due to the photo resistor reflow process, has been successfully obtained in order to fabricate the offset gated poly-Si TFTs. The advantages of the proposed device are that the offset length in the source region is the same as that in the drain region because of the self-aligned implantation and the proposed device does not require any additional mask process step.

• Proceedings of the KWS Conference
• /
• 2009.11a
• /
• pp.32-32
• /
• 2009

Electric Resistance Welding (ERW) process is the most efficient process to manufacture the linepipe. To develop the high performance ERW linepipe using the high strength and the high alloy steels, the modulation of input power waveform such as sinusoidal waveform is introduced because the conventional ERW technology is not sufficient enough to produce the high quality linepipe due to its strength and high alloy contents (high Ceq). In this article, the material used for the experiment was API X60 with 8.2mm thickness, and ERW simulator at POSCO was used to develop a waveform control system for the power modulation. The frequency of power modulation was varied from 50Hz to 150Hz with the fixed amplitude of ${\pm}2%$ power. The non-modulated power input and the modulated power input cases are conducted to demonstrate the variation of the narrow gap length and the arcing frequency due to power modulation. From results of the non-modulated power input case, the excessive power causes the longer narrow gap length and the low arcing frequency due to the large heat input and the strong electro magnetic force that increase the weld defect. On the contrary, the small narrow gap length and the high arcing frequency reduce the weld defect. After modulating the power input with 50Hz and 100Hz at the fixed power, the arcing frequency increases, but the narrow gap length does not change much. The high arcing frequency prevents the formation of weld defect because the sweeping frequently cleans the oxides on the narrow gap edges. As a result, the manufacturing window can be expanded by the power modulation that provides the stable ERW process for the quality improvement of the linepipe made from the high strength/high alloy steels.

• Design & Manufacturing
• /
• v.14 no.3
• /
• pp.50-56
• /
• 2020

Ceramic tile is widely used as a floor or interior decoration of buildings. The main processes are raw material blending, molding, drying, firing, etc., and since dimensional and quality stability are very important, they are generally molded by a dry press method. In ceramic tile molds, there is a liner that can be easily replaced in case of wear. The liner is constantly abrasion due to a continuous pressing process during tile forming, and it is required to be replaced every certain period. Even in the liner, use a wear-resistant fitting material only in areas where wear is concentrated. However, there was a risk that the fitting material was applied to large-sized tile molding due to problems such as damage to the molding machine and decrease in productivity when detached during the actual tile molding process due to weak fitting strength with the liner. Therefore, in this study, thermal-structural analysis for fitting tolerance analysis and structural analysis for fitting force analysis were performed for the shrink fit process of the fitting material.

• Journal of Korean Society of Industrial and Systems Engineering
• /
• v.38 no.4
• /
• pp.72-79
• /
• 2015

A number of plating companies have been exposed to the risk of fire due to unexpected temperature increasing of water in a plating bath. Since the companies are not able to forecast the unexpected temperature increasing of water and most of raw materials in the plating process have low ignition temperature, it is easy to be exposed to the risk of fire. Thus, the companies have to notice the changes immediately to prevent the risk of fire from plating process. Due to this reason, an agile and systematic temperature monitoring system is required for the plating companies. Unfortunately, in case of small size companies, it is hard to purchase a systematic solution and be offered consulting from one of the risk management consulting companies due to an expensive cost. In addition, most of the companies have insufficient research and development (R&D) experts to autonomously develop the risk management solution. In this article, we developed a real time remote temperature monitoring system which is easy to operate with a lower cost. The system is constructed by using Raspberry Pi single board computer and Android application to release an economic issue for the small sized plating manufacturing companies. The derived system is able to monitor the temperature continuously with tracking the temperature in the batch in a short time and transmit a push-alarm to a target-device located in a remoted area when the temperature exceeds a certain hazardous-temperature level. Therefore, the target small plating company achieves a risk management system with a small cost.