• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1648-1650
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• 1996

In present paper, Cu films $4{\mu}m$, thick were fabricated by dual deposition methods using RF magnetron sputtering on Si wafer. The dependence of the electrical resistivity, adherence, and reflection in Cu films [$Cu_{4-x}$(low resistivity) / $Cu_x$(high adherence) / Si- wafer] on the x thickness have been investigated. Cu films of $4{\mu}m$ thickness formed with dual deposition methods had the low electrical resistivity of about $2.6{\mu}{\Omega}{\cdot}cm$ and high adherence of about 700g/cm. In conclusion, it is possible for these films to be used for micro-devices.

• 전기학회논문지
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• 제60권9호
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• pp.1733-1740
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• 2011

In this research, a MEMS vibratory gyroscope with dual-mass system in the sensing mode has been proposed to increase the stability of the device using wide bandwidth. A wide flat region between the two resonance peaks of the dual-mass system removes the need for a frequency matching typically required for single mass vibratory gyroscopes. Bandwidth, mass ratio, spring constant, and frequency response of the dual-mass system have been analyzed with MATLAB and ANSYS simulation. Designed first and second peaks of sensing mode are 5,917 and 8,210Hz, respectively. Driving mode resonance frequency of 7,180Hz was located in the flat region between the two resonance peaks of the sensing mode. The device is fabricated with anodically bonded silicon-on-glass substrate. The chip size is 6mm x 6mm and the thickness of the silicon device layer is $50{\mu}m$. Despite the driving mode resonance frequency decrease of 2.8kHz and frequency shift of 176Hz from the sensing mode due to fabrication imperfections, measured driving frequency was located within the bandwidth of sensing part, which validates the utilized dual-mass concept. Measured bandwidth was 768Hz. Sensitivity calculated with measured displacement of driving and sensing parts was 22.4aF/deg/sec. Measured slope of the sensing point was 0.008dB/Hz.

• 통합자연과학논문집
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• 제3권2호
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• pp.78-83
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• 2010

DBR/Host dual porous silicons containing DBR and host structure were prepared and their optical properties were characterized using Ocean Optics spectrometer. In this dual porous silicon, single porous silicon layer was used as host layer for possible biomolecule and drug materials and DBR porous silicon layer was used for signal transduction due to the recognition of molecules. Optical reflection spectrum of dual porous silicon displayed only DBR reflection but Fabry-Perot fringe pattern. DBR reflection band of dual porous silicon shifted to the shorter wavelength as the etching time of host layer increased. Cross-sectional FE-SEM image of dual porous silicon displayed a thickness of about 20 micrometer for DBR porous silicon layer. Developed etching technology could be useful to prepare DBR porous silicon which exhibited specific reflection resonance at the required wavelength and to provide an label-free biosensors and drug delivery materials.

• Restorative Dentistry and Endodontics
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• 제24권2호
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• pp.265-285
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• 1999

The purposes of this investigation were to observe the reaction kinetics of five commercial dual cured resin cements (Bistite, Dual, Scotchbond, Duolink and Duo) when cured under varying thicknesses of porcelain inlays by chemical or light activation and to evaluate the effect of the porcelain disc on the rate of polymerization of dual cured resin cement during light exposure by using thermal analysis. Thermogravimetric analysis(TGA) was used to evaluate the weight change as a function of temperature during a thermal program from $25{\sim}800^{\circ}C$ at rate of $10^{\circ}C$/min and to measure inorganic filler weight %. Differential scanning calorimetry(DSC) was used to evaluate the heat of cure(${\Delta}H$), maximum rate of heat output and peak heat flow time in dual cured resin cement systems when the polymerization reaction occured by chemical cure only or by light exposure through 0mm, 1mm, 2mm and 4mm thickness of porcelain discs. In 4mm thickness of porcelain disc, the exposure time was varied from 40s to 60s to investigate the effect of the exposure time on polymerization reaction. To investigate the effect on the setting of dual cured resin cements of absorption of polymerizing light by porcelain materials used as inlays and onlays, the change of the intensity of the light attenuated by 1mm, 2mm and 4mm thickness of porcelain discs was measured using curing radiometer. The results were as follows 1. The heat of cure of resin cements was 34~60J/gm and significant differences were observed between brands (P<0.001). Inverse relationship was present between the heat of reaction and filler weight % the heat of cure decreased with increasing filler content (R=-0.967). The heat of reaction by light cure was greater than by chemical cure in Bistite, Scotchbond and Duolink(P<0.05), but there was no statistically significant difference in Dual and Duo(P>0.05). 2. The polymerization rate of chemical cure and light cure of five commercially available dual cured resin cements was found to vary greatly with brand. Setting time based on peak heat flow time was shortest in Duo during chemical cure, and shortest in Dual during light cure. Cure speed by light exposure was 5~20 times faster than by chemical cure in dual cured resin cements. The dual cured resin cements differed markedly in the ratio of light and chemical activated catalysts. 3. The peak heat flow time increased by 1.51, 1.87, and 3.24 times as light cure was done through 1mm, 2mm and 4mm thick porcelain discs. Exposure times recommended by the manufacturers were insufficient to compensate for the attenuation of light by the 4mm thick porcelain disc. 4. A strong inverse relationship was observed between peak heat flow and peak time in chemical cure(R=0.951), and a strong positive correlations hip was observed between peak heat flow and the heat of cure in light cure(R=0.928). There was no correlationship present between filler weight % or heat of cure and peak time. 5. The thermal decomposition of resin cements occured primarily between $300^{\circ}C$ and $480^{\circ}C$ with maximum decomposition rates at $335^{\circ}C$ and $440^{\circ}C$.

• 한국마린엔지니어링학회:학술대회논문집
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• 한국마린엔지니어링학회 2005년도 전기학술대회논문집
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• pp.714-721
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• 2005

• 정보저장시스템학회논문집
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• 제1권1호
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• pp.29-33
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• 2005

We have developed an optical pickup head for blu-ray disc. We have adopted a liquid crystal panel to compensate thickness difference of cover layer. By disposing DVD/CD compatible objective inside the BD objective in disc radial direction, we could realize a backward compatibility. Furthermore we have inserted a polarization diffractive optical element to reduce the influence from the other layer in BD dual layer.

• 대한전자공학회논문지
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• 제25권11호
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• pp.1350-1357
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• 1988

독립적인 nitridation step이 포함된 급속 열처리 공정을 이용하여 125-180A 두께의 이중 절연박막을 단결정 실리콘 상에 형성하였다. HCl 가스의 첨가량과 공정시간의 변화에 따른 박막 특성의 변화를 고찰하였고, 이에 따른 박막의 전기적 특성을 관찰하였다. HCl 가스의 첨가에 의해 초기의 산화막 두께의 성장은 현저하게 나타났으나, nitridation 후의 박막두께의 변화는 10A 이하로 매우 저조하였다. 이중 절연박막의 항복전압은 HCl 가스의 첨가량에 비례하여 점차 증가하였고, 절연강도는 furnace나 독립적인 nitridation step이 포함되지 않은 급속 열처리 공정으로 형성한 같은 두께의 박막에 비해 높은 것으로 분석되었다.

• 전자공학회논문지
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• 제51권3호
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• pp.177-184
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• 2014

화학기상증착의 텅스텐 실리사이드 듀얼 폴리 게이트 구조에서 플로린이 게이트 산화막에 미치는 영향을 전기적 물리적 측정 방법을 사용하여 연구하였다. 플로린을 많이 함유한 텅스텐 실리사이드 NMOS 트랜지스터에서 채널길이가 감소함에 따라 게이트 산화막 두께는 감소하여 트랜지스터의 롤업(roll-off) 특성이 심화된다. 이는 게이트 재 산화막 열처리 공정에 의해 수직방향으로의 플로린 확산과 더불어 수평방향인 게이트 측면 산화막으로의 플로린 확산에 기인한다. 채널길이가 짧아질수록 플로린의 측면방향 확산거리가 작아져 수평방향 플로린 확산이 증가하고 그 결과 게이트 산화막의 두께는 감소하게 된다. 반면에 PMOS 트랜지스터에서는 P형 폴리를 만들기 위한 높은 농도의 붕소가 플로린의 게이트 산화막으로의 확산을 억제하여 채널길이에 따른 산화막 두께 변화 특성이 보이지 않는다.

• Physical Therapy Rehabilitation Science
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• 제12권3호
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• pp.259-267
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• 2023

Objective: Rehabilitative ultrasound imaging is a safe and noninvasive technique for evaluating muscle thickness. A dual probe-fixing frame (DPF) can provide visual feedback during exercises targeting specific muscles. The purpose of this research was to verify the reliability and validity of the DPF for dual-probe ultrasound (DPU)-based visual feedback exercises, allowing users to use both hands freely. Design: This cross-sectional study used repeated measures to compare muscle thickness measurements obtained using the handheld device and DPF with DPU. Methods: Twenty healthy adults participated in the study. Measurements were taken over two sessions, with a two-day interval between the sessions. The thicknesses of the rectus abdominis (RA) and transverse abdominis (TrA) muscles were measured using DPU. The DPF with DPU developed by the research team, was used along with a laptop-based muscle viewer. Bland-Altman analysis and intraclass correlation coefficients (ICCs) calculations were used in statistical analyses to evaluate agreement and reliability, respectively. Results: The results of the Bland-Altman analysis showed small average differences between the handheld and DPF methods for both RA and TrA muscle thicknesses. Inter-rater reliability analysis showed high ICC values for DPF measurements of both RA (0.908-0.912) and TrA (0.892-741) muscle thicknesses. Intra-rater reliability analysis also showed good ICC values for measurements taken by a single examiner over two days. Conclusion: The findings of this study demonstrate that the DPF provides reliable and valid measurements of muscle thickness during visual feedback exercises using the DPU.

• 구강회복응용과학지
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• 제26권3호
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• pp.311-322
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• 2010

본 연구는 최근 심미수복에 흔히 사용되는 IPS e.max Press와 각종 레진 시멘트간의 결합강도를 알아보고자 하였다. 직경 12mm, 높이 3mm의 원반형 IPS e.max Press 시편을 제조사의 지시에 따라 만들어 초음파로 세척하여 자가중합 아크릴릭 레진에 포매하였다. 플라스틱 튜브를 사용하여 직경 4.5mm, 높이 3mm의 40개의 원주형 레진 시편을 제작하였다. 각각의 시편은 무작위로 4개의 실험군으로 나뉘고 4 종류의 서로 다른 레진 시멘트(Variolink II(light-cure), Variolink II(dual-cure), Calibra, Super-Bond C&B)를 이용하여 제조사의 지시에 따라 부착하였다. 부착된 시편은 강도 측정 전에 $37^{\circ}C$ 에서 24시간 동안 생리식염수에 보관하였다. 만능시험기를 사용하여 1mm/min 의 crosshead speed로 각 시편에 힘을 가하여 전단결합강도를 측정하였다. 측정된 결합강도는 SPSS V12.0을 사용하여 일원배치 분산분석으로 비교 분석하였으며, 사후 검증은 Tukey HSD test를 이용하여 분석하였다. Super-Bond C&B의 전단결합강도는 Calibra, Variolink II(light-cure), Variolink II(dual-cure)에 비해 유의하게 낮은 값을 나타내었다(P<.01). Calibra, Variolink II(light-cure), Variolink II(dual-cure)는 전단결합강도에서 서로 유의한 차이를 보이지 않았다. 광중합형과 이원 중합형 레진 시멘트의 전단결합강도는 자가 중합형 시멘트보다 높았다.