• Title/Summary/Keyword: drop weight test

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Weight Drop Impact Tests of Earthquake-Proof Table (내진테이블의 중량물 낙하 충격실험)

  • Eom, Tae Sung;Huh, Seok Jae;Park, Tae Won;Lee, Sang Hyun
    • Journal of the Earthquake Engineering Society of Korea
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    • v.22 no.7
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    • pp.369-378
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    • 2018
  • Full-scale seismic retrofit of old and deteriorated masonry buildings requires a lot of cost and time. In such buildings, installing an emergency evacuation space can be considered as an alternative. In this study, requirements of the earthquake-proof table used as an emergency evacuation space for buildings hit by earthquake are investigated. Load conditions required for the table, including the impact effects due to building debris drop, are explained. To investigate the impact effects in more detail, weight drop test is performed for an prototype earthquake-proof table. In the test, the weight of the falling object and free fall height were considered as the main test parameters. The results showed that the duration of impact is very short (0.0226~0.0779sec), and thus the impact forces increase to 15.8~45.2 times the weight of the falling object. Based on these results, design considerations and performance verification criteria of the earthquake-proof table as an emergency evacuation space are given.

A Comparison of Static and Dynamic Deformation Modulus by Dynamic Plate Test (동평판 재하시험을 이용한 정적 및 동적 변형계수 비교)

  • 박용부;정형식
    • Journal of the Korean Geotechnical Society
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    • v.19 no.5
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    • pp.335-342
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    • 2003
  • The method of measuring ground deformation modulus, in situ-testing has the disadvantage where the exam number is limited because it needs counter weight and a lot of measurement times. Recently, it has supplemented this problem and the equipments by which measurement can be made quickly are developed and applied in field., That is Falling Weight Deflectometer(FWD), Light Drop Weight Tester(LDWT), Geogauge. Light Drop Weight Teste.(LDWT) is introduced firstly in the name of ‘a lightweight fall circuit tester for a railroad public corporation’ by KTX. Since KTX introduced LDWT, a number of research organizations have used LDWT to find out domestic standard for quality management of base ground. In this study we used ZFG 02 which was manufactured by Stendal in Germany and measured the dynamic deformation modulus in soil box and in-situ. And we analyzed the correlation of the dynamic deformation modulus with static deformation modulus based on plate test in the same ground.

Inter- and Intra- Rater Reliability of Navicular Drop Tests Position

  • Kim, So-yeon;Yoo, Jung-eun;Woo, Da-hyun;Jung, Bo-young;Choi, Bo-ram
    • Journal of Korean Physical Therapy Science
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    • v.26 no.1
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    • pp.9-14
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    • 2019
  • Background: Pes planus, or flat foot, causes lower limb malalignment and foot pain during walking or exercise. Therefore, a highly reliable evaluation method to accurately diagnose flat feet is necessary. This study investigated the intra-and inter-rater reliability of the navicular drop test in different postures. Design: Cross sectional study. Methods: Forty healthy volunteers performed the navicular drop test in three different combinations of non-weight-bearing and weight-bearing postures (standing/standing, sitting/sitting, and sitting/standing). Two examiners alternately performed the measurements five times in each subject, and in each posture. Significant differences in measurements were obtained among the three postures, with the highest navicular drop being observed in the sitting/standing posture. Results: Inter-rater reliability was high in the sitting/standing and sitting/sitting postures. Intra-rater reliability was high in all three postures. In the sitting/sitting and sitting/standing postures, large navicular drop values and high inter- and intra-rater reliability were observed. Conclusion: Therefore, the sitting/standing and sitting/sitting postures are recommended for use in navicular drop tests to diagnose flat feet.

Drop Test for the UAV Landing Gear Performance Verification (무인정찰기 착륙장치 성능입증을 위한 낙하시험)

  • Shin, Jeong-Woo;Lee, Seung-Gyu;Yang, Jin-Yeol;Kim, Sung-Joon;Hwang, In-Hee;Chung, Sang-Joon
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2011.10a
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    • pp.250-254
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    • 2011
  • Main role of landing gear is to absorb the energy which is generated by aircraft lanidng and ground maneuvering. Generally, in order to absorb the impact energy during landing, oleo-pneumatic type shock absorber is used for aircraft landing gear. Oleo-pneumatic type shock absorber has a good energy absorbing efficiency and is light in weight because its structure is relatively simple. For the landing gear development, it is necessary to conduct drop test in order to verify shock absorbing performance. In the drop test, first, gas spring curve verification tests are conducted. Then, limit and reserve energy absorption drop tests are performed based on the STANAG 4671. The drop tests results with performance analysis results are presented.

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An Experimental Study on the Failure Characteristics of Sn-xAg-0.5Cu Lead-free Solder (Sn-xAg-0.5Cu 무연 솔더의 파손특성에 관한 실험적 연구)

  • Jeong, Jong-Seol;Lee, Yong-Sung;Shin, Ki-Hoon;Cheong, Seong-Kyun;Kim, Jong-Hyeong;Jang, Dong-Young
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.18 no.5
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    • pp.449-454
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    • 2009
  • This paper presents an experimental study on the failure characteristics of SnAgCu lead-free solder balls. To estimate the effect of Ag, three types of SnAgCu balls are first prepared by varying the weight percent of Ag(1.0, 3.0, 4.0 wt%) and then analyzed by reliability tests such as thermal shock, high speed ball shear, and drop tests. Thermal shock test reveals that the higher the weight percent of Ag is, the longer the fatigue lift becomes. To the contrary, high speed ball-shear test and drop test show that the shear strength and the fracture toughness of solder balls are inversely proportional to the weight percent of Ag, respectively, Reasons for these observations will be further investigated In the future work.

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A Study on the Strength Assessment of CFRP Laminate Plates by Drop-Weight Impact Test (낙추식 충격시험에 의한 CFRP 적층판의 강도평가에 관한 연구)

  • 이정주;박노식;양인영
    • Journal of the Korean Society of Safety
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    • v.14 no.3
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    • pp.12-17
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    • 1999
  • In this study, a drop-weight impact tester was manufactured to assess the strength of CFRP laminate plates. The tests were conducted on several laminates of different ply orientation. A system for the impact strength of CFRP laminates was made considering stress wave propagation theory using drop-weight impact tester as one of impact test. Results indicate that absorbed energy of quasi-isotropic specimen, haying four interfaces is higher than that of orthotropic laminates with two interfaces. Absorbed energy in the specimen that ply number, interface number and fiber stacking sequences is same but having hybrid is higher than that of orthotropic laminates without hybrid.

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Drop and Damping Characteristics of the CEDM for the Integral Reactor (일체형원자로 제어봉구동장치의 낙하 및 완충특성)

  • Choi, M.H.;Kim, J.H.;Huh, H.;Yu, J.Y.
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.20 no.7
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    • pp.658-664
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    • 2010
  • A control element drive mechanism(CEDM) is a reactor regulating system, which inserts, withdraws or maintains a control rod containing a neutron absorbing material within a reactor core to control the reactivity of the core. The ball-screw type CEDM for the integral reactor has a spring-damper system to reduce the impact force due to the scram of the CEDM. This paper describes the experimental results to obtain the drop and damping characteristics of the CEDM. The drop tests are performed by using a drop test rig and a facility. A drop time and a displacement after an impact are measured using a LVDT. The influences of the rod weight, the drop height and the flow area of hydraulic damper on the drop and damping behavior are also estimated on the basis of test results. The drop time of the control element is within 4.5s to meet the design requirement, and the maximum displacement is measured as 15.6 mm. It is also found that the damping system using a spring-hydraulic damper plays a good damper role in the CEDM.

Low-velocity Impact Behavior of Aluminum Honeycomb Sandwich Panel (알루미늄 하니컴 샌드위치 판넬의 저속충격거동)

  • 이현석;배성인;함경춘;한경섭;송정일
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2001.05a
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    • pp.78-82
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    • 2001
  • Impact behaviors of Aluminum Honeycombs Sandwich Panel(AHSP) by drop weight test were investigated. Two types of specimens with 1/2" and 1/4" cell size were tested by two impactors which are weight of $5.25\textrm{kg}_{\textrm{f}}$ and $11.9\textrm{kg}_{\textrm{f}}$. Parametric studies were achieved including the impactor weight and impact sites which consist face, long-edge, short-edge, and point of the specimen. Face one of impact sites was the strongest and short-edge one of impact sites was the weakest. The damaged area of AHSP was enlarged with the increase of impactor weight that is equal to impact energy. After 3 point bending test, fracture modes of AHSP were analyzed with AE counts. Lower facesheet was fractured in the long-edge direction and then separated between facesheet and core. In the short-edge direction after core wrinkled, lower facesheet tear occurred. Impact behavior by FE analysis were increased localized damage in fast velocity because the faster velocity of the impact was, the smaller the stress of core was. Consequently, impactor weight had an effect on widely damaged area, while the impact velocity was caused on the localized damaged area.aged area.

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A Study on the/ Correlation Between Board Level Drop Test Experiment and Simulation

  • Kang, Tae-Min;Lee, Dae-Woong;Hwang, You-Kyung;Chung, Qwan-Ho;Yoo, Byun-Kwang
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.2
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    • pp.35-41
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    • 2011
  • Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

A Study on the shape deformation of ball projectile(5.56mm) under the low velocity impact (저속충격시 Ball 탄(5.56mm)의 형상변화에 관한 연구)

  • 손세원;이두성;홍성희;김영태
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.05a
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    • pp.865-868
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    • 2002
  • This study investigated the shape deformation of ball projectile(5.56mn) under the low energy impact by the use of the drop weight impact tester. ball projectile(5.56mm) consisted of the copper face with a lead core. The impact conditions were changed with the variations of the mass and the drop height of the impact tup. Shape deformation of ball projectile(5.56mm) after low velocity impact was measured using a video microscope and CCD camera. The test result showed that impact energy by changing of drop height of the impact tup affected shape deformation of ball projectile(5.56mm). So, it is important to study the relativity between shape deformation of ball projectile(5.56mm) and ballistic protection of plate(such as hybrid composite laminates) under the high velocity impact.

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