• Title/Summary/Keyword: direct cooing

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Development of a Small Radiant Sequential Production System for Aspheric Lens (소형 복사방식 순차제조 비구면 렌즈 제조시스템 개발)

  • Kuk, Kum-Hoan;Jeong, Jun-Hyo
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.12
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    • pp.67-74
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    • 2010
  • The fabrication method of aspheric lens is changed from machining to press molding so as to improve the productivity. In the case of the press molding method, the temperature control of the molding die is most impotent, because the temperature of each molding die determines the quality of lens. But any practical method for direct measuring of the lens temperature and the die internal temperature is yet unknown. Besides, in the case of the press molding system in which the heating and pressing and cooing of a die is done at one work station, the cycle time for the system is yet too long. The paper shows an improved structure of radiant sequential system in which the heating and pressing and cooing of dies is done at individual work station so as to cut down the cycle time. To know the die internal temperature, numerical results are given using ANSYS. An experimental radiant sequential system is developed and tested. Finally, the Taguchi method is applied in order to optimize the setting conditions of individual work station.

Comparison Between Direct- and Indirect-Cooling Core Catchers (직접냉각방식 및 간접냉각방식 Core Catcher의 성능비교)

  • Suh, Jung-Soo;Lee, Jong-Ho;Bae, Byung-Hwan
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.36 no.10
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    • pp.1043-1047
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    • 2012
  • The European nuclear design requirements, which should be satisfied by nuclear reactors in Europe, usually recommend a so-called core catcher, which is a molten core ex-vessel cooling facility, to manage a severe accident at a nuclear reactor. Two different types of core catcher concepts are compared to determine their abilities to manage severe accidents and cool core melts. The study reveals that direct cooling is better for cooling capacity and is convenient to construct, while indirect cooing is better for the management of a severe accident.

Development of a Convective Sequential Production System for Aspheric Lens (전도방식 순차제조 비구면 렌즈 제조시스템 개발)

  • Kuk, Kum-Hoan;Kim, Gab-Soon;Jung, Dong-Yean
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.2
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    • pp.202-210
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    • 2011
  • The fabrication method of aspheric lens is changed from machining to press molding so as to improve the productivity. In the case of the press molding method, the temperature control of the molding die is most important, because the temperature of each molding die determines the quality of lens. But any practical method for direct measuring of the lens temperature and the die internal temperature is yet unknown. Besides, in the case of the press molding system in which the heating and pressing and cooing of a die is done at separate work stations, the lens productivity of the system for small lens is yet too low. The paper shows an improved structure of convective sequential system, the lens productivity of which is three times as many as the conventional convective system. To know the die internal temperature, numerical results are given using ANSYS. A new convective sequential system is developed and tested. Finally, the Taguchi method is applied in order to optimize the setting conditions of individual work station of the system.

Study of On-chip Liquid Cooling in Relation to Micro-channel Design (마이크로 채널 디자인에 따른 온 칩 액체 냉각 연구)

  • Won, Yonghyun;Kim, Sungdong;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.4
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    • pp.31-36
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    • 2015
  • The demand for multi-functionality, high density, high performance, and miniaturization of IC devices has caused the technology paradigm shift for electronic packaging. So, thermal management of new packaged chips becomes a bottleneck for the performance of next generation devices. Among various thermal solutions such as heat sink, heat spreader, TIM, thermoelectric cooler, etc. on-chip liquid cooling module was investigated in this study. Micro-channel was fabricated on Si wafer using a deep reactive ion etching, and 3 different micro-channel designs (straight MC, serpentine MC, zigzag MC) were formed to evalute the effectiveness of liquid cooling. At the heating temperature of $200^{\circ}C$ and coolant flow rate of 150ml/min, straight MC showed the high temperature differential of ${\sim}44^{\circ}C$ after liquid cooling. The shape of liquid flowing through micro-channel was observed by fluorescence microscope, and the temperarue differential of liquid cooling module was measuremd by IR microscope.