• Journal of the Korean Vacuum Society
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• v.4 no.2
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• pp.217-223
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• 1995

절연보호막에 따른 AI-1%Si 박막배선의 평균수명(MTF, Mean-Time-to-Failure) 및 electromigration에 대한 저항성, 즉 활성화에너지(Q)변화 등을 측정 비교하였다. 박막배선은 $5000\AA$두께로 열산화막 처리된 p-Si(100)기판위에 $7000\AA$의 AI-1%Si을 증착한 후 photolithography 공정으로 형성시켰다. Electromigration test를 위한 박막배선은 $3\mu$m의 폭과 $400\mu$m, $1600\mu$m의 두 가지 길이를 가지며 절연보호막 효과를 알아보기 위해 그 위에 $3000\AA$의 두께로 SiO2, PSG, Si3N4등 절연보호막을 APCVD 및 PECVD를 이용하여 각각 증착시켰다. 가속화 실험을 위해 인가된 전류밀도는 4.5X106A/cm2이었고 180, 210, $240^{\circ}C$온도에서 d.c. 인가 후의 저항변화를 측정하여 평균수명을 구한 후 Black 방정식을 이용하여 활성화에너지를 측정하였다. AI-1%Si 박막배선에서 electromigration에 대한 활성화에너지값은 $400\mu$m길이의 경우 0.44eV(nonpassivated), 0.45eV(Si3N4 passivated), 0.50 eV(PSG passivated), 그리고 0.66 eV(SiO2 passivated)로 각각 측정되었다. $1600\mu$m 길이의 AI-1%Si 박막배선 실험에서도 같은 절연보호막 효과가 관찰되었다. 따라서 SiO2, PSG, Si3N4등 절연보호막은 AI-1%Si 박막배선에서의 electromigration에 대한 저항력을 높여 결함방지효과를 보이며 수명을 향상시킨다. SiO2의 절연보호막의 경우가 AI-1%Si 박막배선의 electromigration에 대한 가장 강한 저항력을 보이며 평균수명도 높게 나타났다.

• Korean Journal of Materials Research
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• v.9 no.4
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• pp.355-361
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• 1999

We have synthesized the soluble polymide based side chain system with covalently attached NLO chromophore Disperse Red 1. The developed polymer is optically transparent in the range of optical communication wave-lengths. Its glass transition temperature$(T_g)$ and thermal decomposition temperature$(T_d)$ are $225^{\circ}C, 310^{\circ}C$ respectively. The poled film with the poling field of $100 V/\mu\textrm{m}$ shows that the dielectric constant is 3.37 at the 10-kHz frequency, the refractive indices of TM and TE modes are both 1.631 at $\lambda = 1300 nm$, and the Electro-optic coefficients are 4.6~9.2 pm/V at $\lambda = 1300 nm$. There are no decays of the EO coefficient in the poled polymer at $180^{\circ}C$ in one hour, and $90^{\circ}C$ in 500 hours.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.12
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• pp.1092-1098
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• 2006

The influence of the concentration of precursor solution and the number of solution coatings on the densification of the $Pb(Zr_xTi_{1-x})O_3$ (PZT) thick films was studied. PZT powder and PZT precursor solution were prepared by3 sol-gel method and PZT thick films were fabricated by the screen-printing method on the alumina substrates. The composition of powder and precursor solution were PZT(70/30) and PZT(30/70), respectively. The PZT precursor solution was spin-coated on the PZT thick films. A concentration of a coating solution was 0.5 to 2.0 mol/L[M] and the number of coating was repeated from 0 to 6. The XRD patterns of all PZT thick films shelved typical perovskite polycrystalline structure. The porosity of the thick films was decreased with increasing the number of coatings and 6-time coated films with 1.5 M showed the dense microstructure and thickness of about $60{\mu}m$. The relative dielectric constant of the PZT thick film was increased with increasing the number of solution coatings and the thick films with 1.5 M, 6-time coated showed the 698. The remanent polarization the 1.5 M and 6-time coated PZT thick films was $38.3{\mu}C/cm^2$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.2
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• pp.93-98
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• 2001

YMnO$_3$ films are excellent gate dielectric materials of ferroelectric random access memories (FRAMs) with MFSFET (metal -ferroelectric-semiconductor field effect transistor) structure because YMnO$_3$ films can be deposited directly on Si substrate and have a relatively low permittivity. Although the patterning of YMnO$_3$ thin films is the requisite for the fabrication of FRAMs, the etch mechanism of YMnO$_3$ thin films has not been reported. In this study, YMnO$_3$thin films were etched with Cl$_2$/Ar gas chemistries in inductively coupled plasma (ICP). The maximum etch rate of YMnO$_3$ film is 285$\AA$/min under Cl$_2$/(Cl$_2$+Ar) of 1.0, RF power of 600 W, dc-bias voltage of -200V, chamber pressure of 15 mTorr and substrate temperature of $25^{\circ}C$. The selectivities of YMnO$_3$ over CeO$_2$ and $Y_2$O$_3$ are 2.85, 1.72, respectively. The selectivities of YMnO$_3$ over PR and Pt are quite low. Chemical reaction in surface of the etched YMnO$_3$ thin films was investigated with X-ray photoelectron spectroscopy (XPS) surface of the selected YMnO$_3$ thin films was investigated with X-ray photoelectron spectroscopy(XPS) and secondary ion mass spectrometry (SIMS). The etch profile was also investigated by scaning electron microscopy(SEM)

• Journal of the Korean Ceramic Society
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• v.33 no.5
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• pp.572-582
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• 1996

The porous silicon was prepared in the condition of 70mA/cm2 and 5.10 sec and then oxidized at 800~110$0^{\circ}C$ MOS(Metal Oxide Semiconductor) structure was prepared by Al electrode deposition and analyzed by C-V (Capacitance-Voltage) characteristics. Dielectric constant of oxidized porous silicon was large in the case of low temperature (800, 90$0^{\circ}C$) and short time(20-30min) oxidation and was nearly the same as thermal SiO2 3.9 in the case of high temperature (110$0^{\circ}C$) and long time (above 60 min) It is though to be caused byunoxidized silicon in oxidized porous silicon film and capacitance increase due to surface area increment effect.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1352-1354
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• 1998

$LiNbO_3$ transistor showed relatively stable characteristic, low interface trap density, and large remanent polarization. This paper reports ferroelectric $LiNbO_3$ thin films grown directly on p-type Si(100) substrates by 13.56 MHz rf magnetron sputtering system for FRAM applications. To take advantage of low temperature requirement for growing films, we deposited $LiNbO_3$ films lower than $300 ^{\circ}C$. RTA(Rapid Thermal Anneal) treatment was performed for as-deposited films in an oxygen atmosphere at $600^{\circ}C$ for 60 sec. We learned from X-ray diffraction that the RTA annealed films were changed from amorphous to poly-crystalline $LiNbO_3$ which exhibited (012), (015), and (022) orientations. The I-V characteristics of $LiNbO_3$ films before and after anneal treatment showed that RTA improved the leakage current of films. The leakage current density of films decreased from $10^{-5}$ to $10^{-7} A/cm^2$ at room temperature measurement. Breakdown electric field of the films exhibited higher than 500 kV/cm. The C-V curves showed the clockwise hysteresis represents ferroelectric switching characteristics. From C-V curves, we calculated dielectric constant of thin film $LiNbO_3$ as 27.5 which is close to that of bulk value.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.272-272
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• 2010

We have fabricated alumina thick films by inkjet printing technology. Two different types of ink system were formulated in order to understand their evaporation behaviors and their evaporation effects on the powder distribution on, the surface during inkjet-printed alumina thick films. Single solvent system was formulated with N,N-dimethylformamide(DMF), which led to coffee ring effects which non-uniformly distributed alumina particles on the substrate during the ink evaporation. However, Co-solvent system which consists of both Water and DMF produced relatively uniform distribution of the particles on the substrate. We believe that these two different distributions of alumina particles are attributed to the ink fluid flow directions in the ink droplets ejected from the different ceramic ink system. We have modulated inkjet parameters such as dot-to-dot distance, line-to-line distance, jetting velocity and jetting drop size in order to find out the optimum condition for the printing of alumina thick films from two different ink systems. The surface roughness, microstructures and dielectric properties of these inkjet-printed alumina thick films were investigated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.28-28
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• 2010

This study realized low-temperature crystallization process of the $Ba_{0.6}Sr_{0.4}TiO_3$ (BST) thin films without thermal damage of substrate using excimer laser annealing (ELA) and structural and electrical characteristics were investigated. The amorphous BST thin films were prepared on Pt/Ti/$SiO_2$/Si substrate by sol-gel method at $250^{\circ}C$. The ELA was carried out using KrF excimer laser which provided excitation wavelength of 248 nm. The beam homogenizing system was used in order to homogenize beam shape of Gaussian fit. The XRD and SEM were used to analyze structural characteristics and the microwave capacitance, dielectric loss and tunability of the BST films were measured by a symmetrical stripline resonator method with shorted end. Consequently, the crystallinity of BST thin films were improved after ELA process and RF tunable capacitor was demonstrated at low temperature below $300^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.79-79
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• 2008

We report the growth of $Ba_{0.5}Sr_{0.5}TiO_3$(BST) thin films and their substrate-dependent electrical characteristics. BST thin films were deposited on alumina(non-single crystal), $Al_2O_3$(100) substrates by Nd:YAG Pulsed Laser Deposition(PLD) with a 355nm wavelength at substrate temperature of $700^{\circ}C$ and post-deposition annealing at $750^{\circ}C$ in flowing $O_2$ atmosphere for 1hours. BST materials had been chosen due to high dielectric permittivity and tunability for high frequency applications, To analyze the oxygen partial pressure effects, deposited films at 1, 10, 50, 100, 150, 200, 300 mTorr. The effects of oxygen pressure on structural properties of the deposited films have been investigated by X-ray diffraction(XRD) and atomic force microscope(AFM), respectively. Then we manufactured a inter-digital capacitor(IDC) patterns twenty fingers and $10{\mu}m$ gap, $700{\mu}m$ length and electrical properties were characterized. The results provide a basis for understanding the growth mechanisms and basic structural and electrical properties of BST thin films as required for tunable microwave devices applications such as varactors and tunable filters.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.12
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• pp.89-100
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• 1997

This paper investigated a new type of low voltage threshold switch (LVTS). As distinguished from the many other types of electronic threshold switches, the LvTS is ; voltage controlled, occurs at low voltages ($V_{2}$ $O_{5}$lV devices. The average low threshold voltage < $V_{LVT}$>=218 mV (standard deviation =24mV~kT/q, where T=300K), and was independent of the device area (x100) and amorphous oxide occurred in an ~22.angs. thick interphase of the V/amorphous- $V_{2}$ $O_{5}$ contacts. At $V_{LVT}$ there was a transition from an initially low conductance (OFF) state into a succession of quantized states of higher conductance (ON). The OFF state was spatically homogeneous and dominated by tunneling into the interphase. The ON state conductances were consistent with the quantized conductances of ballistic transport through a one dimensional, quantum point contact. The temeprature dependence of $V_{LVT}$, and fit of the material parameters (dielectric function, barrier energy, conductivity) to the data, showed that transport in the OFF and ON states occurred in an interphase with the characteristics of, respectively, semiconducting and metallic V $O_{2}$. The experimental results suggest that the LVTS is likely to be observed in interphases produced by a critical event associated with an inelastic transfer of energy.rgy.y.rgy.