• 소성∙가공
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• 제18권7호
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• pp.556-564
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• 2009

Flexible forming process for sheet material using reconfigurable die is introduced based on numerical simulation. In general, this flexible forming process using the reconfigurable die has been utilized for manufacturing of curved thick plates used for hull structures, architectural structures and so on. In this study, numerical simulation of sheet metal forming process is carried out by using flexible dies model instead of conventional matched die set. The numerical simulation and experimental verification for sheet metal forming process using a flexible forming machine that is more suitable for thick plate forming process are carried out to confirm the appropriateness of the simulation process. As an elastic cushion, urethane pads are utilized using hyperelastic material model in the simulation for smoothing the forming surface which is discrete due to characteristics of the flexile die. In the flexible forming process for sheet metal, effect of a blank holder is also investigated according to blank holding methods. Formability in view of occurrence of dimples is compared with regard to the various punch sizes. Consequently, it is confirmed that the flexible forming for sheet material using urethane pad has enough capability and feasibility for manufacturing of smoothly curved surface instead of conventional die forming method.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 춘계학술대회 논문집
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• pp.57-61
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• 2004

in order to improve the quality of the sheared surface in cutting of sandwich sheet metals the cut-off operation is mainly investigated which is the typical shearing process in sheet metal forming technology. For experiments the cut-off die is made which can be easily adjusted by die design variables such as blankholding force, pad force, and clearance. The sheet metals chose as specimen are clad304(STS304-Al1050-STS304) and anti-vibration sheet metal. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface before and after cut-off operation is measured and quantitatively compared with the help of the optical microscope. From test results the good sheared surface was shown when the clearance gets small with large blankholding force.

• 한국정밀공학회지
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• 제19권10호
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• pp.212-220
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• 2002

The finishing process for die and mold manufacturing is very important because it influences the final quality of products. Injection molds need higher quality surface than general purpose dies and molds. Conventional polishing can not make mold surface down to nanometer roughness efficiently because of their loading and glazing. This paper focused on the development of fixed abrasive pad using water swelling mechanism of polymer binder network. Self-conditioning was recognized as the long term polishing stabilization tool without any loading or glazing because water makes fixed abrasives free by swelling of the pad. Consequently, stable nano-polishing process has been applied on the injection mold, from the experimental results with polished surface roughness of Ra 15.1nm on STD-11 die steel.

• 소성∙가공
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• 제12권6호
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• pp.582-587
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• 2003

This paper is concerned with the mechanical property changes of the milli-size products manufactured by forward extrusion processes with square dies. Experiments are carried out with pure aluminum and pure copper billets. Extrusion ratio and knock-out pad are chosen as the important process parameters affecting the changes of mechanical properties such as shear strength and hardness. Shear strength tests with the extruded milli-size pin have shown the strong relation between victors hardness and shear strength in the neck of a stepped pin. As the extrusion ratio increases, the hardness on both the surface and the center line of a pin also increase. It is also noted that the hardness on the surface is a little higher than that on the center. The existence of knock-out pad in extrusion die causes the hardness in the neck of a extruded pin to increase. Finally, the approximated linear relations between shear strength and hardness of a pin are suggested.

• 소성∙가공
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• 제19권8호
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• pp.486-493
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• 2010

A shape error of the sheet metal product made by a flexible stretch forming process is occurred by a various forming parameters. A die used in the flexible stretch forming is composed of a punch array to obtain the various objective surfaces using only one die. But gaps between the punches induce the shape error and the defect such as a scratch. Forming parameters of the punch size and the elastic pad to prevent the surface defect must be considered in the flexible die design process. In this study, tendency analysis of shape error according to the forming parameters in the flexible stretch process is conducted using a finite element method. Three forming parameters, which are the punch size, the objective curvature radius and the elastic pad thickness, are considered. Finite element modeling using the punch height calculation algorithm and the evaluation method of the shape error, which is a representative value for the formability of formed surface, are proposed. Consequently, the shape error is in proportion to the punch size and is out of proportion to the objective curvature radius and the elastic pad thickness.

• Journal of Welding and Joining
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• 제16권4호
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• 한국정밀공학회지
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• 제21권5호
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• pp.32-37
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• 2004

Polishing processes are widely used in the glass, optical, die and semiconductor industries. Chemical Mechanical Polishing (CMP) especially is becoming one of the most important ULSI processes for the 0.25m generation and beyond. CMP is conventionally carried out using abrasive slurry and a polishing pad. But the surface of the pad has irregular pores, so there is non-uniformity of slurry flow and of contact area between wafer and the pad, and glazing occurs on the surface of the pad. This paper introduces the basic concept and fabrication technique of the next generation CMP pad using micro-molding method to obtain uniform protrusions and pores on the pad surface.

• 소성∙가공
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• 제6권3호
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• pp.192-202
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• 1997

This study presents an effect of number of passes in wire-cut electric discharge machining on fine blanking dies and products. Three part fine blanking dies were produced by the difference of numbers of passes discharge machining. Brake pad was produced, through the die produced like that, the objective of this study is the improvement in surface roughness of die block and punch, life extension of die block, the decrease of second fracture dimensions, the rise of productive.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.129-132
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• 2004

This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 sccm at a supplied voltage of 100 V with a 50 % duty cycle, maximum non-linearity was 2.24 % FS and leak rate was $3.03{\times}10^{-8}\;pa{\cdot}m^3/cm^2$. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, a medical bio-system, automobile and air transportation industry.

• 센서학회지
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• 제13권3호
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• pp.230-235
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• 2004

This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 seem at a supplied voltage of 100 V with a 50% duty cycle, maximum non-linearity was 2.24% FS and leak rate was $3.03{\times}10^{-8}pa{\codt}m^{3}/cm^{2}$. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, a medical bio-system, automobile and air transportation industry.