• 오토저널
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• 제15권3호
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• pp.96-110
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• 1993

A procedure has been developed so that a die-face for stamping automobile outer panels can be design and modelled efficiently. The procedure is composed of four parts each of which corresponds to modeling major components of a die-face, i.e. tipped product, blankholder, draw beads, and step draw. The modeling techniques developed specifically for die-face design enable a designer to generate the shape of a die-face quickly with the minimum input, and the resulting models can be used in FEM analysis and NC tool path generation. This will lead to the reductions in lead time and manhours required for the design and manufacture of the stamping dies.

• International Journal of Automotive Technology
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• 제7권7호
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• pp.853-858
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• 2006

The method of die-face design based on the CAE platform for automobile panels can fast modify the die addendum. In contrast with the process of the die-face design based on the CAD platform, there are some special steps for the die-face design based on the CAE platform. The most obvious difference is that the auto-body part contour needs smoothing arlier than the design of addendum surfaces does. It is helpful to improve the design quality of addendum surface. In spite of extensive researches on the smoothing technique, here is still dearth of the published solutions about smoothing the part contour with additional surface. This paper attempts to analyze the difficulties and provides practical solutions. Main results include the algorithm to calculate the segments needing to be smoothed on boundary, the strategy to create the smoothing curve and the procedure of surface generation. The relevant function modules for parametric design are developed. A few examples and suggestions for future work conclude the paper.

• Journal of information and communication convergence engineering
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• 제13권3호
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• pp.172-179
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• 2015

Face-to-face (F2F) bonding in three-dimensional integrated circuits (3D ICs), compared with other bonding styles, is closer to commercialization because of its benefits in terms of density, yield, and cost. However, despite the benefits that F2F bonding expect to provide, it's physical nature has not been studied thoroughly. In this study, we, for the first time, extract cross-die (inter-die) parasitic elements from F2F bonds on the full-chip scale and compare them with the intra-die elements. This allows us to demonstrate the significant impact of field sharing across dies in F2F bonding on full-chip noise and critical path delay values. The baseline method used is the die-by-die method, where the parasitic elements of individual dies are extracted separately and the cross-die parasitic elements are ignored. Compared with this inaccurate method, which was the only method available until now, our first-of-its-kind holistic method corrects the delay error by 25.48% and the noise error by 175%.

• 마이크로전자및패키징학회지
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• 제28권3호
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• pp.1-7
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• 2021

본 논문에서는 Bare-die Chip 형태의 Drive amplifier를 Ajinomoto Build-up Film (ABF)와 FR-4로 구성된 PCB에 내장함으로써 28 GHz 대역 모듈에서 적용될 수 있는 내장형 능동소자 모듈을 구현하였다. 내장형 모듈에 사용된 유전체 ABF는 유전율 3.2, 유전손실 0.016의 특성을 가지고 있으며, Cavity가 형성되어 Drive amplifier가 내장되는 FR4는 유전율 3.5, 유전손실 0.02의 특성을 가진다. 제안된 내장형 Drive amplifier는 총 2가지 구조로 공정하였으며 측정을 통해 각각의 S-Parameter특성을 확인하였다. 공정을 진행한 2가지 구조는 Bare-die Chip의 패드가 위를 향하는 Face-up 내장 구조와 Bare-die Chip의 패드가 아래를 향하는 Face-down내장 구조이다. 구현한 내장형 모듈은 Taconic 사의 TLY-5A(유전율 2.17, 유전손실 0.0002)를 이용한 테스트 보드에 실장 하여 측정을 진행하였다. Face-down 구조로 내장한 모듈은 Face-up 구조에 비해 Bare-die chip의 RF signal패드에서부터 형성된 패턴까지의 배선 길이가 짧아 이득 성능이 좋을 것이라 예상하였지만, Bare-die chip에 위치한 Ground가 Through via를 통해 접지되는 만큼 Drive amplifier에 Ground가 확보되지 않아 발진이 발생한다는 것을 확인하였다. 반면 Bare-die chip의 G round가 부착되는 PCB의 패턴에 직접적으로 접지되는 Face-up 구조는 25 GHz에서부터 30 GHz까지 약 10 dB 이상의 안정적인 이득 특성을 냈으며 목표주파수 대역인 28 GHz에서의 이득은 12.32 dB이다. Face-up 구조로 내장한 모듈의 출력 특성은 신호 발생기와 신호분석기를 사용하여 측정하였다. 신호 발생기의 입력전력(P_in)을 -10 dBm에서 20 dBm까지 인가하여 측정하였을 때, 구현한 내장형 모듈의 이득압축점(P_1dB)는 20.38 dB으로 특성을 확인할 수 있었다. 측정을 통해 본 논문에서 사용한 Drive amplifier와 같은 Bare-die chip을 PCB에 내장할 때 Ground 접지 방식에 따라 발진이 개선된다는 것을 검증하였으며, 이를 통해 Chip Face-up 구조로 Drive amplifier를 내장한 모듈은 밀리미터파 대역의 통신 모듈에 충분히 적용될 수 있을 것이라고 판단된다.

• 한국정밀공학회지
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• 제10권3호
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• pp.161-167
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• 1993

This paper deals with a new method for the machining of a die cavity defined by sculptured surfaces. In machining die cavities or pockets, process planners have been faced with some troulbes. One of the troubles ius to rebove a great deal of material within a given boundary while avoiding cutter interference. Cutter interference is a ciritical problem in NC machining of a die cavity. Even though this cavity machining has been implemented in many CAM systems, most of them can handle limited shapes of cavities or pockets. In this paper, a procedure has been developed to machine die cavity or pocket of a sculptured surface. The offset surfaces of the part surfaces and boundary surfaces are determined to calculate the intersection curves. These intersection curves form a FACE on the part surface, and the interference free tool pathe is generated by eliminating the points outside the FACE when computing the cutter contact (CC) data. Additionally, the cutter location (CL) data obtained from the CC data convert to an NC data. The NC data generated through this algorithm are verified on the CINCINNATI milling machine. A propotype die cavity machining system has been implemented in FORTRAN language and FIGARO graphics library on IRIS workstation.

• 한국수학사학회지
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• 제19권3호
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• pp.43-56
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• 2006

이 연구에서는 <목제주령구(木製酒令具)>의 명칭을 사용한 최초의 문헌을 찾아 보고하였다. 또한, 목제주령구의 제작기법과 기하적 구조를 찾았으며, 확률적 구조를 재확인함으로서 수학교육적 의미를 고찰하였다. 또한 목제주령구에 대한 몇 가지 오해를 해소하였다.

• 한국정밀공학회지
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• 제21권5호
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• pp.131-141
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• 2004

In this study a 3-D automatic die design supporting system for a bonnet panel has been developed using Pro/ROGRAM of the widespread CAD software Pro/ENGINEER A standard drawing die was defined in terms of the punch profile, the die face geometry, and the blank sheet size. The strip layout of a trimming die was defined, in addition, in terms of the trimming line and the locations of scrap cutters. Necessary relations for each design step are formulated and rules for bottom-up type 3-D die design were set up for the automatic design of drawing and trimming dies of a bonnet. With the input geometric data of punch profile, die face, and blank sheet, this 3-D design supporting system could complete the basic design process, in case of the bonnet drawing die, in a time 78% shorter than that required by a typical 2-D CAD system. The new design system showed remarkable design efficiency also when it was applied to the case of redesign and modification of the previous standard output for a different car type.

• 대한기계학회논문집
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• 제17권6호
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• pp.1389-1403
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• 1993

본 논문에서는 초기 변형소재가 이미 결정된 상태에서 제품의 최적 성형 방향 을 구하는 방법을 기술하였다. 초기 변형소재는 블랭크 호울더 곡면에 의해 변형된 중간 단면들에서의 형상을 에너지 최소화 개념을 적용하여 스플라인 곡선으로 나타내 고 이것들로 부터 곡선망을 구성한 후 최종적으로 양방향 스키닝기법(bi-directional skinning technique)에 의해 구현 하였다.

• 마이크로전자및패키징학회지
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• 제19권4호
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• pp.45-50
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• 2012

A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the center-bonded devices (DDR3, DDR4 and LPDDR3 ${\times}16$ die) and for the face up wirebonded ${\times}32$ LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.26-30
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• 1996

This paper presents the performance of CBN tools in the machining of hardened die-materials, SKD11 and SKD61 steel with HRC 50, by high-speed face milling. Generally, grinding or EDM is being used in machining of hardened materials but the cost is very high. If those can be replaced by cutting, it will be a greatly economical advantage. CBN tool has been recognized as an effective tool in turning, but it has not been in milling. So wear and surface roughness mode of CBN tool for hardened SKD11 and SKD61 steel were investigated by high-speed face milling in this study Also the relation between cutting force and wear mode of CBN tools was investigated.