• 동력기계공학회지
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• 제4권4호
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• pp.54-58
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• 2000

The complete joining method for dissimilar hot die punch materials and its real-time evaluation method are not available at present. Brazing method has been used for joining them, but it is known that the welded joint by the brazing has the lower bonding efficiency and reliability than the diffusion welding. The friction welding with a diffusion mechanism in bonding was applied in this study. So, this work was carried out to determine the optimal friction welding conditions and to analyze mechanical properties of friction welded joints of hot die punch materials (STD61 for the blade part of hot die punch) to alloy steel (SCM440 for the shank part of hot die punch) such as plunger. In addition, acoustic emission test was carried out during friction welding to evaluate the weld quality.

• 한국해양공학회지
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• 제13권3호통권33호
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• pp.77-82
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• 1999

The compleete joining method for dissimilar hot die punch materials and its real-time evaluation method are not available at present. Brazing method has been used for joining them, but it is known that the welded joint by the brazing has the lower bonding efficiency and reliability than the diffusion welding. The friction wleding with a diffusion mechanism in bonding was applied in this study. So, this work was carried out to determine the optimal friction welding conditions and to analyze mechanical properties of friction welded joints of hot die punch materials (STD61 for the blade part of hot die punch) to alloy steel (SCM440 for the shank park of hot die punch) such as plunger. In addition, acoustic emission test was carried out during friction welding to evaluate the weld quality.

• 마이크로전자및패키징학회지
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• 제5권2호
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• pp.37-48
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• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

• 반도체디스플레이기술학회지
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• 제19권3호
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• pp.30-35
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• 2020

A microlens has been fabricated by various methods such as a thermal reflow, hot embossing, diamond milling, etc. However, these methods require a relatively complex process to control the microlens shape. In this work, we report on a simple and cost-effective method to fabricate a cylindrical microlens (CML), which can diffuse light widely. We have employed a slot-die head with the dual plate (a meniscus guide with a protruded μ-tip and a shim with a slit channel) for coating of a narrow stripe using poly(methyl methacrylate) (PMMA). We have shown that the higher the coating gap, the lower the maximum coating speed, which causes an increase in the stripe width and thickness. The coated PMMA stripe has the concave shape. To make it in the shape of a convex microlens, we have applied the thermal reflow method. When the stripe thickness is small, however, its effect is negligible. To increase the stripe thickness, we have increased the number of repeated coating. With this scheme, we have fabricated the CML with the width of 223 ㎛ and the thickness of 7.3 ㎛. Finally, we have demonstrated experimentally that the CML can diffuse light widely, a feature demanded for light extraction efficiency of organic light-emitting diodes (OLEDs) and suppression of moiré patterns in displays.

• Design & Manufacturing
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• 제16권2호
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• pp.46-52
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• 2022

As the consumer market in the eco-friendly vehicle industry grows, the demand for water pump in a electric car parts market. This study intend to propose a mathematical model that can verify the effect of improving thermal properties when a non-conductive cooling filler liquid is introduced into an electric vehicle water pump. Also, the pros and cons of the immersion cooling method and future development way were suggested by analyzing the cooling characteristics using on the derived analysis solution. Thermal characteristics analysis of electric water pump applied with non-conductive filler liquid was carried out, and the diffusion boundary condition in the motor body and the boundary condition the inside pump were expressed as a geometric model. As a result of analyzing the temperature change for the heat source of the natural convection method and the heat conduction method, the natural convection method has difficulty in dissipating heat because no decrease in temperature due to heat release was found even after 300 sec. Also, it can be seen that the heat dissipation effect was obtained even though the non-conductive filling liquid was applied at the 120 sec and 180 sec in the heat conduction method. It has proposed to minimize thermal embrittlement and lower motor torque by injecting a non-conductive filler liquid into the motor body and designing a partition wall thickness of 2.5 mm or less.

• Journal of the Korean Physical Society
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• 제73권9호
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• pp.1219-1224
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• 2018

We investigate the evolutionary dynamics and the phase transitions of the island model which consists of subdivided populations of individuals confined to two islands. In the island model, the population is subdivided so that migration acts to determine the evolutionary dynamics along with selection and genetic drift. The individuals are assumed to be haploid and to be one of two species, X or Y. They reproduce according to their fitness values, die at random, and migrate between the islands. The evolutionary dynamics of an individual based model is formulated in terms of a master equation and is approximated by using the diffusion method as the multidimensional Fokker-Planck equation (FPE) and the coupled non-linear stochastic differential equations (SDEs) with multiplicative noise. We analyze the infinite population limit to find the phase transitions from the monomorphic state of one type to the polymorphic state to the monomorphic state of the other type as we vary the ratio of the fitness values in two islands and complete the phase diagram of our island model.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 1997년도 추계학술강연 및 발표대회 강연 및 발표논문 초록집
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• pp.7-7
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• 1997

During sintering of very porous green bodies, as obtained by compaction of hard powders - such as tungsten carbide or ceramics - or by injection moulding, important shrinkage occurs. Due to heterogeneous green density field, gravity effects, friction on the support, thermal gradients, etc., this shrinkage is often non-uniform, which' may induce significant shape changes. As the ratio of compact dimension to powder size is very high, the mechanics of continuum is relevant to model such phenomena. Thus numerical techniques, such as the finite element method can be used to simulate the sintering process and predict the final shape of the sintered part. Such type of simulation has much been developed in the last decade firstly for hot isostatic pressing and next for die compaction. Finite element modelling has been recently applied to free sintering. The simulation of sintering should be based on constitutive equations describing the thermo-mechanical behaviour of the material under any state of stress and any temperature which may arise within the sintering body. These equations can be drawn either from experimental data or from micromechanical models. The experiments usually consist in free sintering and sinter-forging tests. Indeed applying more complex loading conditions at high temperature under controlled atmosphere is delicate. Micromechanical models describe the constitutive behaviour of aggregates of spheres from the deformation of two-sphere contact either by viscous flow or grain boundary diffusion. Such models are not able to describe complex microstructure and mechanisms as observed in real materials but they can give some basic information on the formulation of constitutive equations. Practically both experimental and theoretical approaches can be coupled to identify the constitutive equations. Such procedure has been performed for modelling the sintering of compacts obtained by die pressing of a mixture of tungsten carbide and cobalt powders. The constitutive behaviour of this material during sintering has been described by a linear viscous constitutive model, whose functions have been fitted from results of free sintering and sinter-forging experiments. This model has next been introduced in ABAQUS finite element code to simulate the sintering of heterogeneous green compacts of various geometries at constant temperature. Examples of simulations are shown and compared with experiments.

• 한국기계기술학회지
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• 제20권6호
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• pp.745-750
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• 2018

In this study, the thermal behavior of adaptor housing was analyzed by the numerical method. The boundary conditions used to die casting process were the temperature of molten metal and injection time. As the temperature of the molten metal increased, the tensile strength of the product decreased by the blow hole generated in the molten metal, and the decreasing tendency was gradually decreased. As the injection time of the molten metal increased, the heat flux rose, but the degree of the increase was very small. So, the injection time of the molten metal had little effect on the thermal behavior and diffusion of the adapter housing. As a result, the heat of the molten metal was transferred into the housing and the thermal behavior spread widely.

• 생명과학회지
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• 제19권7호
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• pp.994-1002
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• 2009

수집한 간장시료에서 형태학적인 특성에 따라 상이한 30주의 미생물을 분리하고 MRS 액체배지에서 $37^{\circ}C$, 24시간 배양한 후 회수한 배양 상등액 중 paper disc법으로 항균활성이있는 것을 일차 선별하여 proteinase K 처리에 의해 항균활성이 사라지는 시료 하나를 최종적으로 선별하였다. 선별한 분리주를 생화학적 분류와 분자계통학적 분류를 통해 동정한 결과 B. lichenifirnus로 나타났다. 이 균주의 생장온도와 배지의 초기 pH 에 따른 세포생장 및 박테리오신 활성을 조사한 결과 배양온도는 $37^{\circ}C$, 배지의 초기 pH는 7.0에서 박테리오신의 활성이 가장 높게 나타났다. B. lichenifirnus가 생산하는 박테리오신은 Bacill sogaerucey, Lactobacillus bulgaricus, Lactobacillus plantaum, Micrococcus Iateus, Paenibacillus polymyxa 및 Pediococcus dextrinicus 등에 대해서 항균활성을 보였으며, pH 3.0${\sim}$11.0에 이르는 거의 전 pH 영 역에서 20시간 이상 처리하여도 그 항균활성을 완전히 잃지 않아 비교적 넓은 pH 범위 내에서 안정함을 알 수 있었다. Acetone, acetonitrile, chloroform, ethanol 처리 및 $20{\sim}100^{\circ}C$C에서 60분간 가열시에도 높은 항균활성을 유지하였다. 여러 가수분해효소에 대한 내성을 조사한 결과 trypsin, a-chymotrypsin, pepsin, a -amylase 및 carboxypeptidase A 등은 항균활성에 영향을 주지 않았으나 lipase는 항균활성을 약간 감소시켰으며 proteinase K는 항균활성을 완전히 사라지게 하였다. 75% 황산암모늄 침전, 양이온교환크로마토그래피, 역상 HPLC 등의 과정을 통해 정제된 박테리오신의 상대비활성(specific activity)은 배양상등액에서 보다 약 75배 증가하였고 회수율은 13.5%였다. 역상 HPLC를 통해서 정제된 박테리오신의 분자량을 tricine SDS-PAGE을 통해서 확인한 결과 약 2.5 kDa으로 나타났으며 염색 시 단일 band로 나타나 순수하게 정제되었음을 확인하였다.