• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.18 no.1
• /
• pp.83-89
• /
• 2009

In most multi-stage forging processes, the die spotting process or alignment of punch and die depends on the manual operation. It results a very tedious and inefficient procedure, thus the proper measurement system is needed to improve productivity and accuracy. This paper proposes a measurement system for alignment of die and punch which has a cylindrical holder, and describes the system concepts using 3 eddy-current displacement transducers and precise measurement jig. In order to apply this measurement system to real situations, the measuring procedures and system calibration method, etc. are proposed. Finally, the accuracy and productivity of this measurement system are investigated in this paper.

• Journal of the Korean Society for Precision Engineering
• /
• v.11 no.1
• /
• pp.150-156
• /
• 1994

To meet the process requirement of semiconductor device manufacturing, it is necessary to improve the alignment accuracy in exposure equipments. We developed the excimer laser stepper and will describe the methodology for alignment measurement and experimental results. Our wafer alignment system consists of off-axis optics, TTL(Through The Lens) optics and high precision stage. Off-axis alignment utilizes the image processing and /or diffraction from thealign marks of off-centered chip area. On the other hand, TTL alignment can be used for the die-by-die alignment using dual beam interferometry. When only off-axis alignment was used, the experimental alignment error(lml+3 .sigma. ) was 0.26-0.29 .mu. m, and will be reduced down to 0.15 .mu. m by adding TTL alignment.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1997.10a
• /
• pp.1084-1087
• /
• 1997

In this paper, we developed the micro NCT system for punching the thin plates, which is driven is driven by the standalone type microprocessor. In order to adjust the alignment between the punch and die in-situ punching procedures, the non-contact type laser sensor for measuring the burr and micro-driving system for punching die with using the differential screw are developed. The height of burr in four directions in the punched hole of test specimen are measured, and the measured data are transferred to the personal computer by RS232C serial communication technology. In the personal computer, by using the graphic user interface type monitoring program and data handling procedures which includes the filtering algorithms, the direction and length of movement of the die position is decided and these data are transferred back to the microprocessor. The microprocessor drives the micro positioning stage based on these data. Even if this method is not a perfect solution for the in-situ alignment in micro punching, but this alignment methodology is accomplished in the same stage just after the punching that we hope to solve the alignment problem in the punching system based on this technology.

• Design & Manufacturing
• /
• v.15 no.4
• /
• pp.51-56
• /
• 2021

Piercing is the process of shearing a circular hole in sheet metal, whose high shear force makes it difficult to secure the durability of tools. In addition, uneven clearance between tools due to poor alignment of the piercing punch causes accelerated die wear and breakage of the tool. This study reviewed the feasibility of in-situ determining alignment failure during the piercing process by analyzing the signal deviation of a bolt-type piezo sensor installed inside the tool whose alignment level was controlled. Finite element analysis was performed to select the optimal sensor location on the piercing tool for sensitive detection of process signals. A well-aligned piercing process results in uniform deformation in the circumferential direction, and shearing is completed at a stroke similar to the sheet thickness. Afterward, a sharp decrease in shear load is observed. The misaligned piecing punch leads to a gradual decrease in the load after the maximum shear load. This gradual decrease is due to the progressive shear deformation that proceeds in the circumferential direction after the initial crack occurs at the narrow clearance site. Therefore, analyzing the stroke at which the maximum shear load occurs and the load reduction rate after that could detect the misalignment of the piercing punch in real-time.

• Journal of the Korean Society for Precision Engineering
• /
• v.21 no.7
• /
• pp.70-75
• /
• 2004

The shearing process for the sheet metal is normally used in the precision elements such as a lead frame of IC chips. In these precision elements, the burr formation brings a bad effect on the system assembly and demands the additional deburring process. In this paper, we developed the small size precision punching system to investigate burr formation mechanism and to present kinematically punch-die aligning methodology between the rectangular shaped punch and die. The punch is driven by an air cylinder and the sheet metal is moving on the X-Y table system which is driven by two stepping motors. The whole system is controlled by microprocessor and is communicated with each other by RS232C serial communication protocol. Punching results are measured manually using the SEM photographs and are compared aligning result with miss aligning one.

• Journal of the Korean Magnetics Society
• /
• v.5 no.5
• /
• pp.416-420
• /
• 1995

An attempt has been made to investigate the mechanism of magnetic alignment in the magnets produced by upset forging the $Pr_{20}Fe_{74}B_{4}Cu_{2}$ cast bulk alloy. Upset forging of the cast alloy was carried out for 20 sec to an 80 % thickness reduction (strain rate : $4{$\times}10^{-2}s^{-1}$) in an open die configuration at varying temperatures in the range $600^{\circ}-900^{\circ}C$. It has been found that the upset forging process at temperatures above $800^{\circ}C$ can achieve a magnetic alignment to a great extent from copper-containing Pr-Fe- B-type cast ingot. The growth manner of the ferromagnetic $Pr_{2}Fe_{14}B$ matrix grain in Pr-Fe-B-type alloys was studied by examining the morphology change of the matrix grain in sintered body, and it was found that the matrix grains grew in anisotropic manner such that the grain grew more rapidly along the a- or b-axis than along the c-axis. This anisotropic grain growth led to the plate-like shape of the matrix grain. The magnetic alignment during the upset forging was attributed to grain boundary gliding of the plate-like grains, and the geometry of the grains in the cast ingot and the presence of a large amount of the praseodymium-rich grain boundary phase were thought to play a key role in the achievement of magnetic alignment.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.13 no.8
• /
• pp.3301-3306
• /
• 2012

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. Conventional pick-up device of the die bonder is simply operated by up and down motion of a collet and an ejector pin. However, this method may cause undesired problems such as position misalignment and/or severe die damage when the pick-up device reaches the die. In this study, to minimize the position alignment error and die damage, a die bonder is developed by adopting a new pick-up head for precise alignment and high speed feeding. To evaluate structural stability of the designed system, required finite element model of the die bonder is generated, and structural analysis is performed. Vibration analysis of the pick-up head is also performed using developed finite element model at operation frequency range. As a result of the analysis, deformation, stress, and natural frequency of the die bonder are investigated.

• Journal of Technologic Dentistry
• /
• v.41 no.4
• /
• pp.287-293
• /
• 2019

Purpose: To evaluate the accuracy of the 3D printed die models and to investigate its clinical applicability. Methods: Stone die models were fabricated from conventional impressions(stone die model; SDM, n=7). 3D virtual models obtained from the digital impressions were manufactured as a 3D printed die models using a 3D printer(3D printed die models;3DM, n=7). Reference model, stone die models and 3D printed die models were scanned with a reference scanner. All dies model dataset were superimposed with the reference model file by the "Best fit alignment" method using 3D analysis software. Statistical analysis was performed using the independent t-test and 2-way ANOVA (α=.05). Results: The RMS value of the 3D printed die model was significantly larger than the RMS value of the stone die model (P<.001). As a result of 2-way ANOVA, significant differences were found between the model group (P<.001) and the part (P<.001), and their interaction effects (P<.001). Conclusion: The 3D printed die model showed lower accuracy than the stone die model. Therefore, it is necessary to further improve the performance of 3D printer in order to apply the 3D printed model in prosthodontics.

• Transactions of Materials Processing
• /
• v.10 no.1
• /
• pp.30-34
• /
• 2001

The magnetic and metallurgical characteristics of Mischmetal(MM) -Ferroboron (FeB) Permanent magnets have been investigated by X-ray diffractometer, scanning and transmission electron microscope and vibrating sample magnetometer under hot-pressing and die-upsetting process. The best magnetic properties obtained in these studies were $H_c$=5.8 kOe, $B_r$=5.0 kG with $(BH)_{max}=7.6 MGOe for melt-spun ribbons, $H_c$=3.0 kOe, $B_r$=4.6 kG with $(BH)_{max}$=2.9 MGOe for hot-pressed magnets and $H_c$=1.8 kOe, $B_r$=5.5 kG with $(BH)_{max}$=4.1 MGOe for die-upset magnets. The higher magnetic properties in die-upset magnets were resulted from alignment of the c-axis along the die-upsetting direction.

• Journal of the Korean Society for Precision Engineering
• /
• v.20 no.7
• /
• pp.114-119
• /
• 2003

The aligning between the punch and die governs no only the burr formation characteristics but also the life time of the punch and die in the sheet metal blanking process. There are many ways to adjust the two elements in the general punching systems but in the case of micro punch system, the punch size is reduced to a few tenth of micrometer range and the general aligning methods are almost impossible to apply. The image processing is the most widely used method in micro punch aligning, but in order to apply the method, it needs quite a large space for visionary system to approach the punch-die aligning zone. In this paper, the new punch-die aligning method with using the total capacitance between the punch and die hole is proposed. In this method, the tip surface of the punch tool locates at the same plane of the die surface and the capacitance variation between the two elements are measured. When the center of the two elements are coincided, the capacitance is minimized, but when the align is changed to any direction, the capacitance between the two elements increase. In order to verify the feasibility of this method, the aligning and punching tests was performed.