• Journal of Information Display
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• v.9 no.1
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• pp.14-19
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• 2008

We demonstrated the capillary force lithography (CFL) method for controlling the azimuthal anchoring energy of a liquid crystal (LC) alignment layer. When a thermoplastic polymer film is heated to over the glass transition temperature, the melted polymer is filled into the mold structure by the capillary action and the aspect ratio of the pattern is determined by the dewetting time of the CFL process. Here, the proposed method showed that the azimuthal anchoring energy of the LC alignment layer could be simply controlled by the surface relief patterns which were determined by the dewetting times during the CFL patterning.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.623-623
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• 2008

• The KSFM Journal of Fluid Machinery
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• v.17 no.2
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• pp.30-34
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• 2014

Membrane distillation (MD) is a thermal driven separation process in which separation a hydrophobic membrane is a barrier for the liquid phase, letting the vapor phase pass through the membrane pores. Therefore, a porous and hydrophobic membrane should be used in membrane distillation. MD cannot work if water penetrates into the pores of the membrane (membrane wetting). Accordingly, it is necessary to prevent wetting of MD membranes and to remove water inside the pores of the wetted membranes if possible. In this context, our study aimed to develop methods to recover wetted membranes in MD processes. Poly-vinylidene fluoride (PVDF) membranes were used in this study. A laboratory-scale direct contact MD (DCMD) system was used to examine the effect of operating parameters on wetting. For dewetting the wetted membranes, specific techniques including the use of high temperature air were applied. The performances of the membranes before and after dewetting were compared in terms of flux, salt rejection and liquid entry pressure(LEP). The surface morphology of dewetted membrane was confirmed by scanning electron microscope (SEM).

• Macromolecular Research
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• v.11 no.5
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• pp.357-367
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• 2003

The linear low density polyethylene (LLDPE)/zeolite composite using novel inorganic filler, zeolite, is prepared by a conventional compounding procedure using a twin-screw extruder. The observed scanning electron microscopic (SEM) morphology shows a good dispersion and adhesion of zeolite in the LLDPE matrix. The mechanical properties in terms of the Young's modulus, the yield stress, the impact strength, and the elongation at break were enhanced with a successive increment of zeolite content up to 40 wt%. The X-ray diffraction measurement is of supportive for the improved mechanical properties and the complex melt viscosity is as well. Upon applying a certain level of strain on the composites, the dewetting, the air hole formation and its growth are characterized. The dewetting originates around the filler particles at low strain and induces elliptical micropores upon further stretching. The microporosity such as the aspect ratio, the number and the total area of the air holes is also characterized. Thus, the composites loaded 40 % zeolite and 300 % elongation may be applicable for breathable microporous films with improved modulus, impact and yield stress, elongation at break, microporosity and air hole properties.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.91-97
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• 2022

The wettability and rheological properties of solder paste with the size of the solder powder were evaluated. To formulate the solder paste, three types of solder powder were used: T4 (20~28 ㎛), T5 (15~25 ㎛), and T6 (5~15 ㎛). The viscosities of the T4, T5, and T6 solder pastes at 10 RPM were 155, 263, and 418 Pa·s, respectively. After 7 days, the viscosity of the T4 solder paste slightly increased by 2.6% and that of T5 was increased by 20.6%. The viscosity of the T6 solder paste after 7 days could not be measured due to high viscosity. The viscosity variation with solder particle size also affected on the printability of the solder. In the case of the T4 solder paste, printability, slump, bridging, and soldering properties were excellent. On the other hand, T5 showed slight dewetting and solder ball defects. Especially, T6, which the smallest powder size, showed poor printability and dewetting at the edge of solder.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1719-1722
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• 2006

We proposed a soft-lithographic method for aligning a liquid crystal (LC) in patterned azimuthal orientations. It is demonstrated that a thermoplastic polystyrene layer is patterned from a thermally stable polyimide layer via pressure-assisted capillary force lithography, which provides multidirectional LC alignment condition simply followed by a unidirectional rubbing process.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1739-1743
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• 2006

Recent advances in the microstructural modification of metal films using excimer laser projection irradiation and lateral resolidification are discussed. Pure copper films have been directionally resolidified into large sheet-like grains when properly encapsulated for suppression of liquid-phase dewetting. A survey and quantitative assessment of the defects found in these icrostructures, typical for rapidly solidified metals, is presented.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 1996.05a
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• pp.85-93
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• 1996

비선형 해석의 중요성이 증가하고 있는 혼합형 고체 추진제의 비선형거동중 재료비선형에 대한 거시적/미시적 현상을 설명하고, 그 주요한 원인으로서 Mullin 효과와 결합제/충전미립자 사이의 접착분리(Dewetting)를 주로 고찰하였다. 이를 응용한 지금까지의 비선형 구성방정식의 개발동향을 검토하여 비교하였으며 최근에 제시되고 있는 손상변수를 분석하였다. 여러 변형률 크기에 대한 응력이완 모듈러스 실험을 통하여 변형률 크기가 손상변수로서 적합하지 않음을 보였으며, 변형률 크기에 따라 모듈러스의 저하가 크기 때문에 비선형 점탄성 해석이 중요한 문제임을 제시하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.205-205
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• 2013

플라즈마 밀도, 전자 온도, 쉬스 전압이 플라즈마 디웨팅으로 나노 분말 어레이를 제작할 때에 끼치는 영향을 연구하였다. 플라즈마 변수를 조절하여 기판에 입사하는 이온 충돌 에너지가 높은 조건에서는 디웨팅 시에 홀이 상대적으로 많이 생성이 되어 균일한 구리 나노 분말이 생성되었고, 반대의 경우에는 디웨팅 시 홀이 적게 생성되어 크고 작은 나노분말이 혼재해 있는 불균일한 구리 나노 분말 어레이가 형성되었다. 따라서 이온 충돌 에너지를 조절하면 구리 나노 분말의 균일도를 조절할 수 있다.

• Applied Science and Convergence Technology
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• v.23 no.5
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• pp.284-288
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• 2014

We present tapered nanostructures fabricated on a selective area of gallium phosphide substrates for advanced optoelectronic device applications. A lithography-free fabrication process was accomplished by dry etching of metal nanoparticles. Thermal dewetting of micro-patterned metal thin films provides etch masks for tapered nanostructures. This simple process also allows the formation of plasmonic surfaces with corrugated shapes. Rigorous coupled-wave analysis calculations provide design guidelines for tapered nanostructures on gallium phosphide substrates.