• Journal of the Korean Society of Hazard Mitigation
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• v.5 no.1 s.16
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• pp.13-21
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• 2005

Experiments on settling behaviour of fine-grained particles without destroying the large fragile aggregates were carried out in still water with a CCD (Charged Coupled Device)-Camera. The experiments dealt with the measuring of the vertical concentration profile of cohesive particles with a CCD-Camera and the physico-chemical influences (NaCl, density, temperature and pH value) on the vertical distribution of the concentration. The vertical concentration profile of fine suspended particles (alumina and quartz) was possible up to $20,000\;mg/{\ell}$ with a CCD-Camera. The vertical concentration profile of cohesive sediments was on the decrease because of the increasing initial concentration, temperature and salinity. The vertical concentration profile of alumina was on the decrease quicker than quartz with increasing salinity. Furthermore, the pH value affects the settling behaviour of alumina. At a PH value of 4.2 the settling rate of the particles was very low and on the increase until pH 8.9 because of the aggregation behaviour of particles. From the PH value of 9 the average settling velocity was on the decrease.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.460-460
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• 2012

반도체 Device가 Shrink 함에 따라 Pattern Size가 작아지게 되고, 이로 인해 Photo Resist 물질 자체만으로는 원하는 Patterning 물질들을 Plasma Etching 하기가 어려워지고 있다. 이로 인해 Photoresist를 대체할 Hard Mask 개념이 도입되었으며, 이 Hardmask Layer 중 Amorphous Carbon Layer 가 가장 널리 사용되고 지고 있다. 이 Amorphous Carbon 계열의 Hardmask를 Etching 하기 위해서 기본적으로 O2 Plasma가 사용되는데, 이 O2 Plasma 내의 Oxygen Species들이 가지는 등 방성 Diffusion 특성으로 인해, 원하고자 하는 미세 Pattern의 Vertical Profile을 얻는데 많은 어려움이 있어왔다. 이를 Control 하기 인해 O2 Plasma Parameter들의 변화 및 Source/Bias Power 등의 변수가 연구되어 왔으며, 이와 다른 접근으로, N2 및 CO, CO2, SO2 등의 여러 Additive Gas 들의 첨가를 통해 미세 Pattern의 Profile을 개선하고, Plasma Etching 특성을 개선하는 연구가 같이 진행되어져 왔다. 본 논문에서 VLSI Device의 Masking Layer로 사용되는, Carbon 계 유기 층의 Plasma 식각 특성에 대한 연구를 진행하였다. Plasma Etchant로 사용되는 O2 Plasma에 새로운 첨가제 가스인 카르보닐 황화물 (COS) Gas를 추가하였을 시 나타나는 Plasma 내의 변화를 Plasma Parameter 및 IR 및 XPS, OES 분석을 통하여 규명하고, 이로 인한 Etch Rate 및 Plasma Potential에 대해 비교 분석하였다. COS Gas를 정량적으로 추가할 시, Plasma의 변화 및 이로 인해 얻어지는 Pattern에서의 Etchant Species들의 변화를 통해 Profile의 변화를 Mechanism 적으로 규명할 수 있었으며, 이로 인해 기존의 O2 Plasma를 통해 얻어진 Vertical Profile 대비, COS Additive Gas를 추가하였을 경우, Pattern Profile 변화가 개선됨을 최종적으로 확인 할 수 있었다.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.45 no.5
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• pp.1-13
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• 2013

This study found fit optimum C, M, Y, K solid density and $CIEL^*a^*b^*$ value to paper & ink as well as check about printing machine state for color management in H-UV waterless off-set printing first. These values applied to GRACoL G7 calibration method. This method is one of color standard management method of printing. GRACoL G7 calibration method is possible stable tone reappearance by controlling gray balance by NPDC(Natural Printing Density Curve). Also, this study used values to make device profile as result that is gotten by application of GRACoL G7 calibration method. This profile was applied to CMS(Color Management System) of H-UV waterless off-set printing, and the result was possible by color management that correspond in printing quality standard of ISO 12647-2 and GRACol 2006 specifications.

• Korean Journal of Computational Design and Engineering
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• v.17 no.3
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• pp.156-163
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• 2012

Real-time three-dimensional shape measurement is becoming increasingly important in various fields, including medical sciences, high-technology industry, and microscale measurements. However, there are not so many 3D profile tools specially designed for specifically narrow space, for example, to scan the tooth shape of a human jaw. In this paper, a real-time 3D intraoral scanner is proposed for the measurement of tooth profile in the mouth cavity. The proposed system comprises a laser diode beam, a micro charge-coupled device, a graticule, a piezoelectric transducer, a set of optical lenses, and a polhemus device sensor. The phase-shifting technique is used along with an accurate calibration method for the measurement of the tooth profile. Experimental and theoretical inspection of the phase-to-coordinate relation is presented. In addition, a nonlinear system model is developed for collimating illumination that gives the more accurate mathematical representation of the system, thus improves the shape measurement accuracy. Experiment results are presented to verify the feasibility and performance of the developed system. The experimental results indicate that overall measurement error accuracy can be controlled within 0.4 mm with a variability of ${\pm}0.01$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.1
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• pp.13-15
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• 2004

The current driven in an MOSFET is limited by the intrinsic channel resistance. All the other parasitic elements in a device structure play a significant role and degrade the device performance. These other resistances need to be less than 15％ of the channel resistance. To achieve the requirements, we should investigate the methodology of separation and quantification of those resistances. In this paper, we developed the extraction method of resistances using calibrated TCAD simulation. The resistance of the extension region is also partially determined by the formation of a surface accumulation region that forms under the gate in the tail region of the extension profile. This resistance is strongly affected by the abruptness of the extension profile because the steeper the profile is, the shorter this accumulation region will be.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.6
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• pp.132-140
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• 1998

Recently, precision machining technology has been developed continuously in order to make high productivity and quality assurance of the precision parts of several industrial fields. Waviness may occur on the surface of the machined parts due to the table motion error and the dynamic cutting mechanism between the tool and the workpiece. The waviness may fall off the form accuracy of the precision machine parts. In the research, a micro cutting device with piezoelectric actuator has been developed to control precise depth of cut and compensate the waviness on the surface of the workpiece. Experiments have been carried out in the precision lathe. The characteristics of the surface profile and cause of the waviness profile have been analyzed and waviness profiles of some cause have been compared with those of experiments.

• Proceedings of the Korean Information Science Society Conference
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• 2000.10c
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• pp.195-197
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• 2000

J2ME(Java 2 Micro Edition)는 소비자/임베디드 디바이스 시장을 목표로 한 자바2 플랫폼으로서 이는 컨피규레이션(Configuration)과 프로파일(Profile)로 구성된다. SLDC/ MIDP(Connected Limited Device Configuration/Mobile Information Device Profile)는 그 중에서도 휴대폰과 양방향 페이저 같은 제한된 메모리를 가진 장치 위에서 사용되는 플랫폼이다. 본 논문에서는 J2ME 기반 하에서 CLDC/MIDP를 이용하여 보안모듈을 작성하고 휴대폰에서도 안전한 전자서명 및 전자지불을 가능케 하여 Mobile Commerce의 기초를 이루었다. 여기서 서명은 XML 기반으로 구성되었고, 시스템은 MIDlet으로 구현하였다.

• Journal of Korea Multimedia Society
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• v.24 no.6
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• pp.825-837
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• 2021

The Bluetooth Low Energy profile has the advantage of continuing wireless communication with very little power consumption compared to the existing Bluetooth, so it is widely applied to smart devices. Most of them are applied to Point-to-Point (1:1) communication between Central (Master) and Peripheral (Slave), but can be applied to Point-to-Multiple (1:N) wireless communication through the use of multiple threads and timers. Therefore, in this paper, a precise timer was designed in the BLE profile to devise an image segmentation transmission/reception structure based on multiple access, and a smart image block device applied to it was designed and verified.

• ETRI Journal
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• v.36 no.4
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• pp.617-624
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• 2014

Through-silicon via (TSV) technology provides much of the benefits seen in advanced packaging, such as three-dimensional integrated circuits and 3D packaging, with shorter interconnection paths for homo- and heterogeneous device integration. In TSV, a destructive cross-sectional analysis of an image from a scanning electron microscope is the most frequently used method for quality control purposes. We propose a quantitative evaluation method for TSV etch profiles whereby we consider sidewall angle, curvature profile, undercut, and scallop. A weighted sum of the four evaluated parameters, nominally total score (TS), is suggested for the numerical evaluation of an individual TSV profile. Uniformity, defined by the ratio of the standard deviation and average of the parameters that comprise TS, is suggested for the evaluation of wafer-to-wafer variation in volume manufacturing.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.46 no.1
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• pp.103-111
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• 2009

In SCA, the core framework must include the domain parser to parse the domain profile and thus reconstructs the platform on the time including the starting of the platform, the initialization of the new radio, and etc. The domain profile is described in XML and it includes the characteristics about the software component or the hardware device in a platform. Elementarily, the core framework has to have within the domain profile parser in order to parse the domain profile. In this paper, in order to apply to the limited environment like the mobile terminal, we propose the method for reducing the size of the domain profile parser and for strengthening the independency of the XML parser vendor to have with the domain profile parser. Therefore, domain profile parser can be solve the problem like the overhead about the DOM tree creation due to the repetitive parsing of the domain profile, the compatibility degradation by the specific XML parser vender, the dependency about the domain profile technique, and etc.