• Korean Journal of Remote Sensing
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• v.18 no.3
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• pp.147-153
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• 2002

The real-time reception and recording of down-link mission data from a satellite requires the highest reliability because the data lost in receiving process cannot be recovered. The data receiving and recording system has moved from a set of dedicated hardware and software components to commercial-off-the-shelf (COTS) components in order to reduce the system cost as well as to upgrade the system easily for handling other satellite data. The use of COTS hardware and middleware components prevents the system developer from correcting or modifying the internal operations of the COTS components, and hence, instant performance degradation of the COTS components which affects the reliable data acquisition must be covered by a software algorithm. This paper introduces the instant performance problem of a COTS data recording device which leads to the data loss in the real-time data reception and recording process. As a result, the requirement of the modification of the conventional data read/write technique is issued. In order to overcome the data loss problem due to the use of COTS components and the conventional software technique, a new algorithm called a software buffering technique is proposed. The experiments show that the application of the proposed technique results in reliable real-time reception and recording of high speed serial data.

• Journal of the Korean Society of Visualization
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• v.17 no.2
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• pp.25-31
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• 2019

A device that consists of an array of hydrofoils (called a vane deployer) is widely used in ocean engineering. In general, the vane deployer has to spread out efficiently, which is possible by enhancing the lift-to-drag ratio. In the present study, using a computational fluid dynamics, we investigate the effect of hydrofoil arrangement on the lift-to-drag ratio to establish the condition in which a reasonable level of constant lift-to-drag ratio is achieved in a wide range of angle of attack, to avoid a degradation of the hydrodynamic performance. First, the flow around two-dimensional hydrofoil array is examined by varying the size of hydrofoil components, gap between the hydrofoils, and arrangement type. As a result, we determine the optimized hydrofoil array configuration whose lift-to-drag ratio is nearly independent on the angle of attack. Finally, a three-dimensional simulation is performed for the optimized geometry to estimate the performance of actual vane deployer.

• Journal of Broadcast Engineering
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• v.24 no.1
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• pp.142-152
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• 2019

There is growing interest in ultra-high-resolution content that gives a more realistic sense of presence than existing broadcast content. However, in order to provide ultra-high-resolution contents in existing broadcast services, there are limitations in view angle and resolution of the image acquisition device. In order to solve this problem, many researches on stitching, which is an image synthesis method using a plurality of input devices, have been conducted. In this paper, we propose method of dynamic object based video stitching using minimal error seam in order to overcome the temporal invariance degradation of moving objects in the stitching process of horizontally oriented videos.

• Journal of Korean Living Environment System
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• v.24 no.6
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• pp.810-823
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• 2017

The envelope is important for sustainable building. Recent commercial buildings are causing thermal degradation and cooling load due to the increase of the area of the windows. Therefore, this research studied kinetic shading system which can improve energy saving and visual environment in summer. For that, this study proposed new shading system and shape considering the orientation of the building and the location of the sun. Based on this, this study analyzed the effectiveness on energy reduction and improvement of visual environment by applying the kinetic shading system proposed in this study. As the results of this study, energy reduction rate was 35% in the east, 22.9% in the south, and 30.7% in the west depending on the application location. Also, as the result of the illuminance analysis, it was found that the effect of achieving uniformity ratio of illumination was considerable.

• Korean Journal of Artificial Intelligence
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• v.10 no.2
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• pp.7-11
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• 2022

OLED displays cannot be used permanently due to burn-in or generation of dark spots due to degradation. Therefore, the time when the display can operate normally is very important. It is close to impossible to physically measure the time when the display operates normally. Therefore, the time that works normally should be predicted in a way other than a physical way. Therefore, if you do computer simulations based on artificial intelligence, you can increase the accuracy of prediction by saving time and continuous learning. Therefore, if we do computer simulations based on artificial intelligence, we can increase the accuracy of prediction by saving time and continuous learning. In this paper, a dataset in the form of development from generation to diffusion of dark spots, which is one of the causes related to the life of OLED, was generated by applying the finite element method. The dark spots were generated in nine conditions, such as 0.1 to 2.0 ㎛ with the size of pinholes, the number was 10 to 100, and 50% with water content. The learning data created in this way may be a criterion for generating an artificial intelligence-based dataset.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.23 no.4
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• pp.137-142
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• 2023

When designing a SMPS(Switched Mode Power Supply) circuit, a part that is easily overlooked without special consideration is a snubber circuit. However, the performance degradation of the SMPS due to the snubber circuit and the effect on the entire SET cannot be ignored. In addition, a snubber circuit is added to both ends of the switch to protect the device from peak voltage and current during switching and to reduce loss during on/off switching. Therefore, in this paper, for a sufficient understanding of snubber circuits, theoretical analysis and experimental formulas that can be applied by designers during actual circuit design are arranged to promote optimization of snubber circuits.

• Journal of the Korea Society of Computer and Information
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• v.28 no.12
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• pp.97-104
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• 2023

In this paper, we propose a harmful bird repellent system using directional speakers. Existing sound systems for the extermination of harmful birds have the disadvantage of reducing effectiveness due to the learning effect of birds due to problems caused by noise pollution and monotonous sounds. In this paper, directional speakers are used to minimize surrounding noise. In addition, the up-down and left-right angles of the speaker driving device were freely adjusted to maximize usability. Additionally, the problem of performance degradation due to learning effects was solved by using various scanning patterns. In the future, we plan to develop a platform capable of central control by applying remote control functions and a deep learning model that can recognize bird species.

• Current Optics and Photonics
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• v.8 no.3
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• pp.259-269
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• 2024

Optical imaging systems that operate through atmospheric pathways often suffer from image degradation, mainly caused by the distortion of light waves due to turbulence in the atmosphere. Adaptive optics technology can be used to correct the image distortion caused by atmospheric disturbances. However, there are challenges in conducting experiments with strong atmospheric conditions. An optical phase plate (OPP) is a device that can simulate real atmospheric conditions in a lab setting. We suggest a novel two-step process to fabricate an OPP capable of simulating the effects of atmospheric turbulence. The proposed fabrication method simplifies the process by eliminating additional activities such as phase-screen design and phase simulation. This enables an efficient and economical fabrication of the OPP. We conducted our analysis using the statistical fluctuations of the refractive index and applied modal expansion using Kolmogorov's theory. The experiment aims to fabricate an OPP with parameters D/r₀ ≈ 30 and r₀ ≈ 5 cm. The objective is defined with the strong atmospheric conditions. Finally, we have fabricated an OPP that satisfied the desired objectives. The OPP closely simulate turbulence to real atmospheric conditions.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.30 no.1
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• pp.59-62
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• 2004

To know what happens to the internal structure of emulsions under high shear flow is very important for cosmetic product development because it is highly relevant to the physical degradation of emulsions during the application upon the skin. Here, in order to investigate the response of emulsions against the external shear forces, we designed a new device, .JELLI$^{TM}$ (Joint Electro-rheometer for Liquid-Liquid Inversion) chip, for the measurement of electrical and rheological properties of emulsions under shear flow. By using this device, we examined the real-time changes in conductivities of oil-in-water (O/W) and water-in-oil (W/O) emulsions on the artificial skin during large deformation under shear flow. In this study, O/W and W/O emulsions having various volumes were prepared. After emulsions were homogeneously applied on the artificial skin, the electrical resistance and viscosity changes were monitored under steady shear flow. In case of O/W emulsions, the resistance increased as a function of time. The resistance showed more dramatic increase as the increase of the internal oil phase. It was also found that the viscosity change was proportional to the resistance variation. This phenomenon might be caused by decreased resisting forces against the shear flow because of the breakdown of the internal phase.the internal phase.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.