• Title/Summary/Keyword: deposition rate

Search Result 1,889, Processing Time 0.035 seconds

Preparation of MgO Protective layer for AC PDP by High Energy Particle Bombardment (고속 입자 충격을 도입한 AC PDP의 MgO 보호층 형성에 관한 연구)

  • Kim, Young-Kee;Park, Jung-Tae;Ko, Kwang-Sik;Kim, Gyu-Seob;Cho, Jung-Soo;Park, Chong-Hoo
    • The Transactions of the Korean Institute of Electrical Engineers C
    • /
    • v.49 no.9
    • /
    • pp.527-532
    • /
    • 2000
  • The performance of ac plasma display panels (PDP) is influenced strongly by the surface glow discharge characteristics on the MgO thin films. This paper deals with the surface glow discharge characteristics and some physical properties of MgO thin films prepared by reactive RF planar unbalanced magnetron sputtering in connection with ac PDP. The samples prepared with dc bias voltage of -10V showed lower discharge voltage and lower erosion rate byion bombardment than those samples prepared by conventional magnetron sputtering or E-beam evaporation. The main factor that improves the discharge characteristics by bias voltage is considered to be due to the morphology changes or crystal structure of the MgO thin film by ion bombardement during deposition process.

  • PDF

A study on the E-beam resist characteristics of plasma polymerized styrene (플라즈마중합 스티렌 박막의 e-beam 레지스트 특성에 관한 연구)

  • 이덕출;박종관
    • Electrical & Electronic Materials
    • /
    • v.7 no.5
    • /
    • pp.425-429
    • /
    • 1994
  • In this paper, we study on the plasma polymerized styrene as a negative electron-beam resist. Plasma polymerized thin film was prepared using an interelectrode inductively coupled gas-flow type reactor. We show that polymerization parameters of thin film affect sensitivity and etching resistance of the resist. Molecular weight distribution of plasma polymerized styrene is 1.41-3.93, and deposition rates of that are 32-383[.angs./min] with discharge power. Swelling and etching resistance becomes . more improved with increasing discharge power during plasma polymerization. Etch rate by RIE is higher than that by plasma etching.

  • PDF

Application of Al-doped Zinc Oxide for transparent conductive thin film (Al이 첨가된 Zinc Oxide박막의 투명전도막으로서의 응용)

  • 정운조;정용근;유용택
    • Electrical & Electronic Materials
    • /
    • v.8 no.6
    • /
    • pp.693-698
    • /
    • 1995
  • We fabricated Zinc Oxide transparent conductive thin films with 2wt% of A1203 doping using rf magnetron sputtering. And we investigated electrical and optical characteristics of them which were made with conditions ; rf power 60-300W, thickness of film 3000 11000.angs.. Resistivity, carrier concentration and Hall mobility were investigated for electrical characteristics. Transmittance and optical band gap were investigated with Spectrophotometer in the wavelength range between 200-900 nm. As a result, ZnO thin film fabricated with rf power of 180W and thickness of 5000.angs. showed the best properties. At the best condition, the sample has resistivity of 1*10$\^$-4/.ohm.cm and transmittance of 95% in the visible range.

  • PDF

Influences of Plating Conditions on Magnetic Properties of Co-P Thin Films by Electroless Plating (무전해도금에 의한 코발트- 인 박막의 자성에 미치는 도금조건의 영향)

  • Choi, Byoung-Ik;Yeo, Woon-Kwan;Lee, Ju-Seong
    • Journal of Surface Science and Engineering
    • /
    • v.19 no.1
    • /
    • pp.3-12
    • /
    • 1986
  • Influences of pH, temperature, and composition of bath on the deposition rate and the magnetic properties were studied for two kinds of electroless Co-P plating bath. The results obtained are as follows. Ammonia alkaline citrate bath was more stable than ammonia alkaline tartrate bath, and the film deposited from citrate bath gave a higher squareness. The magnetic properties of the film obtained from citrate bath greatly depended upon pH. Under the optimum conditions, the film deposited from citrate bath had coercive force of 330 Oe and squareness of 0.67. However the films deposited from tartrate bath had coercive force of 300 Oe and squareness of 0.58.

  • PDF

IGZO films deposited by DC and DC pulsed magnetron sputtering (DC와 DC pulsed magnetron sputtering을 이용한 IGZO 박막 증착)

  • Kim, Min-Su;Kim, Se-Yun;Seong, Sang-Yun;Jo, Gwang-Min;Hong, Hyo-Gi;Lee, Jun-Hyeong;Kim, Jeong-Ju;Heo, Yeong-U
    • Proceedings of the Korean Institute of Surface Engineering Conference
    • /
    • 2011.05a
    • /
    • pp.139-139
    • /
    • 2011
  • DC magnetron sputtering과 DC pulsed magnetron sputtering을 이용하여 공정 압력별, $O_2$ 분압별, 온도등의 증착조건에 따른 IGZO 박막의 특성을 조사하였다. Working pressure 따른 deposition rate 측정한 결과 동일 파워 적용 시 DC magnetron sputtering 대비하여 DC pulsed magnetron sputtering 은 약 84% 수준에 머물렀으며, IGZO 박막 내에 $O_2$의 분압비가 증가함에 따라 투과도는 단파장 영역에서 장파장 영역으로 갈수록 상승 경향을 보였다. 캐리어 농도와 이동도 등 전기적 특성도 증가하는 경향을 보였다. 온도에 따른 전기적 특성을 비교 해 본 결과 상온과 $150^{\circ}C$ 영역에서는 유의차가 없었으며, DC pulsed magnetron sputtering의 경우 $50^{\circ}C$ 영역에서 변곡점이 형성됨을 알수 있었다.

  • PDF

Formation of Dielectric Carbon Nitride Thin Films using a Pulsed Laser Ablation Combined with High Voltage Discharge Plasma (펄스 레이저 애블레이션이 결합된 고전압 방전 플라즈마 장치를 이용한 유전성 질화탄소 박막의 합성)

  • 김종일
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.16 no.7
    • /
    • pp.641-646
    • /
    • 2003
  • The dielectric carbon nitride thin films were deposited onto Si(100) substrate using a pulsed laser ablation of pure graphite target combined with a high voltage discharge plasma in the presence of a N$_2$ reactive gas. We calculated dielectric constant, $\varepsilon$$\_$s/, with a capacitance Schering bridge method. We investigated the influence of the laser ablation of graphite target and DC high voltage source for the plasma. The properties of the deposited carbon nitride thin films were influenced by the high voltage source during the film growth. Deposition rate of carbon nitride films were increased drastically with the increase of high voltage source. Infrared absorption clearly shows the existence of C=N bonds and C=N bonds. The carbon nitride thin films were observed crystalline phase confirmed by x-ray diffraction data.

Efficiency Improvement of the Organic Light-Emitting Diodes depending on Thickness Variation of Hole-Infection Materials (정공 주입 물질 두께 변화에 따른 유기 발광 다이오우드 효율 향상)

  • Kim, Weon-Jong;Lee, Young-Hwan;Cha, Ki-Ho;Lee, Sang-Kyo;Kim, Tae-Wan;Hong, Jin-Woong
    • Proceedings of the KIEE Conference
    • /
    • 2006.07c
    • /
    • pp.1291-1292
    • /
    • 2006
  • In the structure of ITO/HIL/$Alq_3$/Al device, we investigated an efficiency improvement of the Organic Light-Emitting Diodes depending on thickness variation of hole-injection layer. Using the thermal evaporation in a base vacuum $5{\times}10^{-5}$[Torr], we have measured efficiency after the $Alq_3$ was evaporated to 100 [nm] as a deposition rate $1.5[{\AA}/s]$. In optimal condition, when PTFE thickness increased from 0 to 3.0 [nm], we have obtained that an optimal thickness of PTFE was 2.5 [nm]. And using the PTFE, luminance efficiency and external quantum efficiency of the device were improved by 12.8 times and 11.1 times, respectively.

  • PDF

Sputtering of Magnesium Oxide this film for Plasma Display Panel Application (PDP용 MgO 박막의 스퍼터 연구)

  • Choi, Young-Wook;Kim, Jee-Hyun
    • Proceedings of the KIEE Conference
    • /
    • 2003.07c
    • /
    • pp.1732-1734
    • /
    • 2003
  • An MgO thin film sputtering system for the PDP (Plasma Display Panel) applications has been developed. This system was manufactured with a vertical In-Line type of 42 inch, which has the length of 520 mm and the width of 900 mm. A reactive magnetron discharge for this sputtering was generated using an unipolar pulsed power supply which has functions of constant voltage (Max. 500 V) and current (Max. 15 A) control, frequency of $10{\sim}100$ kHz and duty ratio of $10{\sim}60$ %. The experiment was conducted under various conditions : $3{\sim}10$ mTorr of pressure, the ratio of $O_2$/Ar = $0.1{\sim}0.5$, 50 % of duty and power of $0.5{\sim}1.7$ kW. From the experiment, the deposition rate of a static state and a moving state were measured to be about 45 nm/min and 6 nm m/min at the distance of 50 mm between the target and the substrate, respectively.

  • PDF

Characteristics of Nickel-Diamond Composite Powders by Electroless Nickel Plating (무전해 니켈 도금법으로 제조된 니켈-다이아몬드 복합분체의 특성)

  • ;;Hoang Tri Hai
    • Journal of Powder Materials
    • /
    • v.11 no.3
    • /
    • pp.224-232
    • /
    • 2004
  • Ni-diamond composite powders with nickel layer of round-top type on the surface of synthetic diamond (140/170 mesh) were prepared by the electroless plating method (EN) with semi-batch reactor. The effects of nickel concentration, feeding rates of reductant, temperature, reaction time and stirring speeds on the weight percentage and morphology of deposited Ni, mean particle size and specific surface area of the composite powders were investigated by Atomic Adsortion Spectrometer, SEM-EDX, PSA and BET. It was found that nucleated Ni-P islands, acted as catalytic sites for further deposition and grown into these relatively thick layers with nodule-type on the surface of diamond by a lateral growth mechanism. The weight percentage of Ni in the composite powder increased with reaction time, feeding rate of reductant and temperature, but decreased with stirring speed. The weight percentage of Ni in Ni-diamond composite powder was 55% at 150 min., 200 rpm and 7$0^{\circ}C$ .

The Effect of Complexing Agent on the Deposit Charateristics in the Electroless Nickel Plating Solution (무전해 니켈 도금액에서 착화제가 도금피막에 미치는 영향)

  • Jeon Jun-Mi;Koo Suck-Bon;Lee Hong-Kee;Park Hae-Duck;Shim Su-Sap
    • Journal of Surface Science and Engineering
    • /
    • v.37 no.6
    • /
    • pp.326-334
    • /
    • 2004
  • Deposit charateristics of Electroless nickel(EN) were investigated with various complexing agents. As expected, the deposition rate of nickel is increased with pH and that of Phosphorous is decreased with pH. The result of SEM investigation shows that the rough surface crystallization is appeared with pH. It is show that the surface resistance of EN deposit is decreased with pH at 85$^{\circ}C$.