• Journal of the Korean Ceramic Society
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• v.43 no.6 s.289
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• pp.362-368
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• 2006

Epitaxial $Ba_{0.5}Sr_{0.5}TiO_3$ (BSTO) thin films have been grown on TiN buffered Si (001) substrates by Pulsed Laser Deposition (PLD) method and the effects of substrate temperature and oxygen partial pressure during the deposition on their dielectric properties and crystallinity were investigated. The crystal orientation, epitaxy nature, and microstructure of oxide thin films were investigated using X-Ray Diffraction (XRD) and Transmission Electron Microscopy (TEM). Thin films were prepared with laser fluence of $4.2\;J/cm^2\;and\;3\;J/cm^2$, repetition rate of 8 Hz and 10 Hz, substrate temperatures of $700^{\circ}C$ and ranging from $350^{\circ}C\;to\;700^{\circ}C$ for TiN and oxide respectively. BSTO thin-films were grown on TiN-buffered Si substrates at various oxygen partial pressure ranging from $1{\times}10^{-4}$ torr to $1{\times}10^{-5}$ torr. The TiN buffer layer and BSTO thin films were grown with cube-on-cube epitaxial orientation relationship of $[110](001)_{BSTO}{\parallel}[110](001)_{TiN}{\parallel}[110](001)_{Si}$. The crystallinity of BSTO thin films was improved with increasing substrate temperature. C-axis lattice parameters of BSTO thin films, calculated from XRD ${\theta}-2{\theta}$ scans, decreased from 0.408 m to 0.404 nm and the dielectric constants of BSTO epitaxial thin films increased from 440 to 938 with increasing processing oxygen partial pressure.

• Journal of IKEEE
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• v.18 no.4
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• pp.447-455
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• 2014

In this research, n-based 4H-MOS Capacitor was fabricated with PECVD (plasma enhanced chemical vapor deposition) process for improving SiC/$SiO_2$ interface properties known as main problem of 4H-SiC MOSFET. To overcome the problems of dry oxidation process such as lower growth rate, high interface trap density and low critical electric field of $SiO_2$, PECVD and NO annealing processes are used to MOS Capacitor fabrication. After fabrication, MOS Capacitor's interface properties were measured and evaluated by hi-lo C-V measure, I-V measure and SIMS. As a result of comparing the interface properties with the dry oxidation case, improved interface and oxide properties such as 20% reduced flatband voltage shift, 25% reduced effective oxide charge density, increased oxide breakdown field of 8MV/cm and best effective barrier height of 1.57eV, 69.05% reduced interface trap density in the range of 0.375~0.495eV under the conduction band are observed.

• Journal of computational fluids engineering
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• v.18 no.4
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• pp.74-81
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• 2013

A numerical design analysis is conducted to search for an optimal shape of outlet in a rotating-disk CVD reactor. The goal is to suppress flow recirculation that has been found in a reactor having a sudden expansion of flow passage outside of the rotating disk. In order to streamline gas flow, the sidewall at which the flow in the Ekman layer is impinged, is tilted. The axisymmetric laminar flow and heat transfer in the reactor are simulated using the incompressible ideal gas model. For the conventional vertical sidewall, the flow recirculation forming in the corner region could be expanded into the interior to distort the upstream flow. The numerical results show that this unfavorable phenomenon inducing back flow could be dramatically suppressed by tilting the sidewall at a certain range of angle. The assessment of deviation in deposition rate based on the characteristic isotherm illustrates that the sidewall tilting may expand the domain of stable plug-like flow regime toward higher pressure. A physical interpretation is attempted to explain the mechanism to suppress flow recirculation.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.95-95
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• 2014

An OLED(Organic Light-Emitting Diode) device based on the emissive electroluminescent layer a film of organic materials. OLED is used for many electronic devices such as TV, mobile phones, handheld games consoles. ULVAC's mass production systems are indispensable to the manufacturing of OLED device. ULVAC is a manufacturer and worldwide supplier of equipment and vacuum systems for the OLED, LCD, Semiconductor, Electronics, Optical device and related high technology industries. The SMD Series are single-substrate sputtering systems for deposition of films such as metal films and TCO (Transparent Conductive Oxide) films. ULVAC has delivered a large number of these systems not only Organic Evaporating systems but also LTPS CVD systems. The most important technology of thin-film encapsulation (TFE) is preventing moisture($H_2O$) and oxygen permeation into flexible OLED devices. As a polymer substrate does not offer the same barrier performance as glass substrate, the TFE should be developed on both the bottom and top side of the device layers for sufficient lifetimes. This report provides a review of promising thin-film barrier technologies as well as the WVTR(Water Vapor Transmission Rate) properties. Multilayer thin-film deposition technology of organic and inorganic layer is very effective method for increasing barrier performance of OLED device. Gases and water in the organic evaporating system is having a strong influence as impurities to OLED device. CRYO pump is one of the very useful vacuum components to reduce above impurities. There for CRYO pump is faster than conventional TMP exhaust velocity of gases and water. So, we suggest new method to make a good vacuum condition which is CRYO Trap addition on OLED evaporator. Alignment accuracy is one of the key technologies to perform high resolution OLED device. In order to reduce vibration characteristic of CRYO pump, ULVAC has developed low vibration CRYO pumps to achieve high resolution alignment performance between Metal mask and substrate. This report also includes ULVAC's approach for these issues.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.11
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• pp.5377-5384
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• 2013

This paper presents the effects of the tube materials and corrosion on the heat transfer performance of double-tube heat exchangers for the development of heat exchangers using deep sea water. Heat exchangers made of titanium, aluminum. stainless steel, iron, copper, and aluminum with electro-deposition coatings(Carbon black_$15{\mu}m$, Carbon black_$150{\mu}m$) were tested. Also, the heat transfer rate of each heat exchanger was calculated by using EES program. For the acceleration of corrosion by sea water, the temperature of sea water $70^{\circ}C$ and the concentration of salt 3.5% were considered. And the specimens were immersed in sea water during 6 weeks. From the above experiment and analysis, aluminum with electro-deposition coating(Carbon black_$150{\mu}m$) can be considered the most promising candidate for the replacement of titanium heat exchanger.

• Journal of Surface Science and Engineering
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• v.42 no.1
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• pp.1-7
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• 2009

Resistive heating sources are widely used to prepare thin films by vapor deposition because they are cheap, and easy to install and handle in vacuum system. Graphite is one of materials used to make the resistive heating source, but until now only limited applications have been possible as it reacts easily with evaporating materials at high temperature. In this study, evaporation characteristics of aluminum have been investigated by using graphite boat thermally treated with BN powder. The employed graphite boat has been prepared by spray-coating BN power onto the cavity surface of the boat and thermal treatment with aluminum in vacuum at the temperature of more than $1400^{\circ}C$. The voltage-current characteristics as well as resistivity changes of the graphite boat have been investigated during aluminum evaporation according to the applied voltage and time. The evaporation aspect has been picturized during flash evaporation for 40 seconds based on the characterization results. The evaporation rate of the graphite boat has been compared with that of BN boat. The graphite boat showed some different characteristics compared with BN boat, in that the evaporation occurred at the last stage of flash evaporation. The film appearance according to the applied voltage has been compared, and also the reflectance of the resulting film has been investigated according to the film thickness. It has been found that the graphite boat thermally treated with BN powder can be used for aluminum evaporation without problem.

• Progress in Superconductivity
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• v.8 no.2
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• pp.175-180
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• 2007

High temperature superconductor $YBa_2Cu_3O_{7-x}$ (YBCO) films have been grown by in-situ electron beam evaporation on artificial metal tapes such as ion-beam assisted deposition (IBAD) and rolling assisted biaxially textured substrates (RABiTS). Deposition rate of the YBCO films is $10{\sim}100{\AA}/sec$. X-ray diffraction shows that the films are grown epitaxially but have inter-diffusion phases, like as $BaZrO_3\;or\;BaCeO_3$, at their interfaces between YBCO and yttrium-stabilized zirconia (YSZ) or $CeO_2$, respectively. Secondary ion mass spectroscopy depth profile of the films confirms diffused region between YBCO and the buffer layers, indicating that the growth temperature ($850{\sim}900^{\circ}C$) is high enough to cause diffusion of Zr and Ba. The films on both the substrates show four-fold symmetry of in-plane alignment but their width in the -scan is around $12{\sim}15^{\circ}$. Transmission electron microscopy shows an interesting interface layer of epitaxial CuO between YBCO and YSZ, of which growth origin may be related to liquid flukes of Ba-Cu-O. Resistivity vs temperature curves of the films on both substrates were measured. Resistivity at room temperature is between 300 and 500 cm, the extrapolated value of resistivity at 0 K is nearly zero, and superconducting transition temperature is $85{\sim}90K$. However, critical current density of the films is very low, ${\sim}10^3A/cm^2$. Cracking of the grains and high-growth-temperature induced reaction between YBCO and buffer layers are possible reasons for this low critical current density.

• Journal of the Korean Vacuum Society
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• v.9 no.4
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• pp.321-327
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• 2000

Tungsten(W) thin films with good adhesion property and low resistivity (~10 $\mu$\Omega$$.cm) were deposited directly on $SiO_2$ by LPCVD. The adhesion property of W thin films on $SiO_2$ improves as the temperature and/or $SiH_4/WF_6$ gas ratio increase. Specifically tungsten thin films could be deposited on $SiO_2$ even at $350^{\circ}C$ if the gas ratio of 2 was employed. The resistivity of tungsten thin films deposited at $350^{\circ}C$ was high due to the presence of $\beta$-W. However, the resistivity can be minimized by increasing the amount of $H_2$ gas flow. Therefore, it is shown in this work that the adhesion of tungsten thin films on $SiO_2$ can be improved simply by controlling the process parameters (e.g., temperature, gas ratio and $H_2$ flow rate) without employing complex deposition methods or additional glue layers.

• Korean Journal of Materials Research
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• v.7 no.1
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• pp.33-39
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• 1997

Single phase pero~~skite lead lanthanum titanate thin films were fabricated on $Pt/Ti/SiO_2/Si$ substrates at the temperature of $480^{\circ}C$ by electron cyclotron resonance plasma-enhanced chemical vapor deposition (ECR PECVD) using metal organic sources $Pb(DPM)_2$ pre-flowing treatment in ECIi oxygen plasma before fabricating PLT films 11romote the perovskite nucleation due to stable supplying of the $Pb(DPM)_2$ and providing the F'h-rich atmosphere in the early stage of deposition. $Pb(DPM)_2$ pie-flonring treatment enhanced the properties of PLT films. The charactcristics of the PLT filrris were investigated as a tunction of the flow rate of Ti-source. The PL'i' films were grown in a perovskite structure tvith (100) preferred orientation. The high X-ray diffraction intensity and dielectric constant were obtained from the stoichiometric perovskite $(Pb,La)TiO_3$.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.88-88
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• 2018

DLC(Diamond Like Carbon) 박막은 높은 열전도도, 큰 전기저항, 높은 강도 등의 다이아몬드와 유사한 특성을 가지고 있으면서 저온 저압에서도 합성이 가능하고, 합성 조건에 따라 물리 화학적 특성도 넓게 조절 할 수 있으며 상대적으로 넓은 면적에서 균일하고 평활한 박막의 합성이 가능하여 산업적 응용 면에서도 경쟁력을 갖추고 있다[1]. 이러한 DLC 박막을 합성함에 있어서 RF-PECVD(Radio Frequency Plasma Enhanced Chemical Vapor Deposition) 방법은 PECVD 방법 중 가장 보편적으로 사용되고 또 캐패시터 타입의 RF-PECVD 방법은 균일한 대면적 증착과 대량생산이 가능하다[1,2]. 본 연구에서는 우수한 특성을 갖는 DLC 박막의 증착 조건을 찾기 위해 캐패시터 타입의 RF-PECVD를 사용하여 공정 가스의 유량과 RF Power를 변화하여 박막을 증착하고, 증착된 박막의 특성을 연구하였다. DLC 박막은 ITO(Indium Tin Oxide) 유리 기판 위에 $100^{\circ}C$에서 5 min 동안 아세틸렌($C_2H_2$) 가스를 사용하여 가스 유량과 RF Power를 변화하여 증착하였다. 증착된 DLC 박막의 특성은 투과도, 평탄도, 두께를 측정하여 비교하였다. 가시광선 영역(380-780 nm)에서 투과도를 측정한 결과 ITO 유리 기판을 기준으로 한 DLC 박막의 투과도는 가시광선 영역 평균 94.8~98.8% 사이의 값으로 매우 높은 투과율을 나타내었다. 투과도는 가스 유량이 증가함에 따라 증가하는 경향을 나타내었고, RF Power의 변화에는 특정한 변화를 나타내지 않았다. 박막의 평탄도($R_a$, $R_{rms}$)와 두께는 AFM(Atomic Force Microscope)을 사용하여 측정하였다. 평탄도 $R_{rms}$는 0.8~3.3 nm, $R_a$는 0.6~2.5 nm 사이를 나타내었고 RF Power와 가스 유량의 변화에 따른 경향성을 나타내지는 않았다. 두께는 RF Power 25 W에서 55 W로 증가함에 따라 증가하는 경향을 나타내었으나 70W에서는 가스의 유량에 따라 상이한 결과를 나타내었다.