• Proceedings of the Korea Air Pollution Research Association Conference
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• 1999.04a
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• pp.183-184
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• 1999

• Journal of the Korean Society for Precision Engineering
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• v.16 no.10
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• pp.59-67
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• 1999

The lead time for new products is very limited in the current manufacturing processes, therefore the Rapid Prototyping process has been introduced and generally used in the industry. Fused Deposition Manufacturing (FDM) is one of the most common methods in this field. In the FDM process, the patterns are made of Wax of ABS and ABS shows better quality of the patterns. To date, the FDM/ABS patterns are used in investment casting for making silicon moulds to produce was patterns because it is very difficult to dewax FDM/ABS directly. The aim of this paper was to propose a feasibility of using FDM/ABS parts as wax-pattern substitutes in the investment casting process. The effects of casting conditions, such as pre-heat temperature and casting temperature, are provided. Comparisons with the conventional investment casting processes using the wax-patterns under the same prototype are made. Lead-time and saving cost are discussed in using FDM/ABS parts as was-pattern substitutes compared with the products from other rapid prototype systems.

• Korean Journal of Materials Research
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• v.18 no.6
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• pp.302-306
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• 2008

Polycrystalline germanium (Ge) thin films were grown by metal organic chemical vapor deposition (MOCVD) using tetra-allyl germanium [$Ge(allyl)_4$], and germane ($GeH_4$) as precursors. Ge thin films were grown on a $TiN(50nm)/SiO_2/Si$ substrate by varying the growth conditions of the reactive gas ($H_2$), temperature ($300-700^{\circ}C$) and pressure (1-760Torr). $H_2$ gas helps to remove carbon from Ge film for a $Ge(allyl)_4$ precursor but not for a $GeH_4$ precursor. $Ge(allyl)_4$ exhibits island growth (VW mode) characteristics under conditions of 760Torr at $400-700^{\circ}C$, whereas $GeH_4$ shows a layer growth pattern (FM mode) under conditions of 5Torr at $400-700^{\circ}C$. The activation energies of the two precursors under optimized deposition conditions were 13.4 KJ/mol and 31.0 KJ/mol, respectively.

• 한국신재생에너지학회:학술대회논문집
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• 2007.11a
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• pp.281-284
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• 2007

Recently, we have developed p-i-n a-Si:H single junction thin film solar cells with RF (13.56MHz) plasma enhanced chemical vapor deposition (PECVD) system, and also successfully fabricated the mini modules ($>300cm^2$), using the laser patterning technique to form an integrated series connection. The efficiency of a mini module was 7.4% ($Area=305cm^2$, Isc=0.25A, Voc=14.74V, FF=62%). To fabricate large area modules, it is important to optimise the integrated series connection, without damaging the cell. We have newly installed the laser patterning equipment that consists of two different lasers, $SHG-YVO_4$ (${\lambda}=0.532{\mu}m$) and YAG (${\lambda}=1.064{\mu}m$). The mini-modules are formed through several scribed lines such as pattern-l (front TCO), pattern-2 (PV layers) and pattern-3 (BR/back contact). However, in the case of pattern-3, a high-energy part of laser shot damaged the textured surface of the front TCO, so that the resistance between the each cells decreases due to an incomplete isolation. In this study, the re-deposition of SnOx from the front TCO, Zn (BR layer) and Al (back contact) on the sidewalls of pattern-3 scribed lines was observed. Moreover, re-crystallization of a-Si:H layers due to thermal damage by laser patterning was evaluated. These cause an increase of a leakage current, result in a low efficiency of module. To optimize a-Si:H single junction thin film modules, a laser beam profile was changed, and its effect on isolation of scribed lines is discussed in this paper.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.15-15
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• 2014

Block Copolymer(BCP) 는 self assembly 현상을 이용하여 다양한 pattern을 형성하는데 용이한 물질로써 이를 이용한 다양한 구조물 제작에 대한 연구가 활발히 진행되고 있다. 본 연구에서는 hoe pattern 모양을 갖는 BCP 패턴을 이용하여 Atomic Layer Deposition(ALD) 및 Reactive Ion Etching(RIE) 공정을 이용한 3차원 quantum tube 구조물을 제작하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.3
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• pp.319-322
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• 2004

ZnO nanostructures were formed on a Si substrate by off-axis pulsed laser deposition(PLD) system in which a substrate plane was tilted toward a plume propagation direction. Atomic force microscopy (AFM) showed islands of 20∼40 nm width. From the x-ray diffraction (XRD) pattern exhibiting only (002) ZnO peak, the islands observed in AFM image were found to well crystallized. Optical bandgap enlargement from 3.26 eV to 3.35 and 3.47 eV due to the quantum size effect of ZnO nanostructures were observed by Photoluminescence (PL) at room temperature.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.3
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• pp.329-332
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• 2004

ZnO thin films were grown with different plume-substrate angles by pulsed laser deposition (PLD) to control the amount of ablated species arriving on a substrate per laser shot. The angles between plume propagation direction and substrate plane (P-S angle) were 0$^{\circ}$, 45$^{\circ}$ and 90$^{\circ}$. The growth time was changed in order to adjust film thickness. From the XRD pattern exhibiting a dominant (002) and a minor (101) XRD peak of ZnO, all films were found to be well oriented along c-axis. From the AFM image, it was found that the grain size of ZnO thin film was increased, as P-S angle decreased. UV intensity investigated by PL (Photoluminescence) increased as P-S angle decreased.

• Korean Journal of Materials Research
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• v.26 no.9
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• pp.455-459
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• 2016

The deposition process for the gap-filling of sub-micrometer trenches using DMDMOS, $(CH_3)_2Si(OCH_3)_2$, and $C_xH_yO_z$ by flowable chemical vapor deposition (F-CVD) is presented. We obtained low-k films that possess superior gap-filling properties on trench patterns without voids or delamination. The newly developed technique for the gap-filling of submicrometer features will have a great impact on IMD and STI for the next generation of microelectronic devices. Moreover, this bottom up gap-fill mode is expected to be universal in other chemical vapor deposition systems.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1119-1122
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• 2005

A selective deposition of Co thin films for thin film transistor gate electrode has been carried out by the growth with combination of micro-contact printing and metal organic chemical vapor deposition (MOCVD). This results in the elimination of optical lithography process. MOCVD has been employed to selectively deposit Co films on preformed OTS gate pattern by using micro-contact printing (${\mu}CP$). A hydrogenated amorphous silicon TFT with a Co gate selectively formed on SAMs patterned structure exhibited a subthreshold slope of 0.88V/dec, and mobility of $0.35cm^2/V-s$, on/off current ratio of $10^6$, and a threshold voltage of 2.5V, and thus demonstrating the successful application of the novel bottom-up approach into the fabrication of a-Si:H TFTs.

• Journal of Ocean Engineering and Technology
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• v.16 no.4
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• pp.7-12
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• 2002

This study is aimed to find the scouring mechanism at the toe of rubble mound structures. To investigate the characteristics of scouring in front of the structure, experiments were performed with regular waves in a 2-D flume. The results of this study are as follows. 1) It can be said the characteristics of incident wave causes rolling and sliding of armour block. The difference of wave pressure on the slope, internal flow as well as settlement of armour block due to the weight cause scouring. 2) It is observed that scouring depth at the toe increased when wave height or period increased. The location of ultimate scouring and deposition depth moved seaward when wave period increased. 3) The failure of rubble mound structure was caused by waves or scouring. Failure by erosion increased with high waves and long waves. 4) Using surf-similarity parameter including characteristics of incident waves and structure, scouring and deposition pattern were found and their limit was formulated.