• Journal of the Korean Crystal Growth and Crystal Technology
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• v.26 no.2
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• pp.67-73
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• 2016

The degradation behaviors of TiN coating layers under thermo-mechanical stress were investigated in terms of comparison of finite element analysis (FEA) and experimental data. The coating specimen was designed to quarter cylinder model, and the pulsed laser ablation was assumed as heat flux condition. The FEA results showed that heat accumulation at the center of the laser-ablated spot occurred and principle stress was concentrated at the lower region of the coating layer. The microstructural observation revealed that surface melting and decrease of the coating thickness occurred in the TiN/Inconel 617 and the interfacial cracks formed in the TiN/Si. The delamination was caused by the mechanical stress from the center to the outside of the ablated spot as the FEA results expected. It was considered that the improvement of the thermal shock resistance was attributed to higher thermal conductivity of Si wafer than that of Inconel 617.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.63-68
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• 2014

For a nanoscale Cu/low-k wafer, inter-layer dielectric (ILD) and metal layers peelings, cracks, chipping, and delamination are the most common dicing defects by traditional diamond blade saw process. Sidewall void in sawing street is one of the key factors to bring about cracks and chipping. The aim of this research is to evaluate laser grooving & mechanical sawing parameters to eliminate sidewall void and avoid top-side chipping as well as peeling. An ultra-fast pico-second (ps) laser is applied to groove/singulate the 28-nanometer node wafer with Cu/low-k dielectric. A series of comprehensive parametric study on the recipes of input laser power, repetition rate, grooving speed, defocus amount and street index has been conducted to improve the quality of dicing process. The effects of the laser kerf geometry, grooving edge quality and defects are evaluated by using scanning electron microscopy (SEM) and focused ion beam (FIB). Experimental results have shown that the laser grooving technique is capable to improve the quality and yield issues on Cu/low-k wafer dicing process.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.9-19
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• 2020

Transferring of functional nanofilms onto target substrates is a cornerstone to developing nanofilm-based nextgeneration applications. In this work, we provide a brief review of recent advances on nanofilm transfer methods by categorizing them into the following three methods: wet-etching transfer, electrochemical delamination, and mechanical transfer. Furthermore, the mechanical transfer method, which is regarded as a promising technology owing to its facile, substrate recyclable, and widely applicable process, is overviewed by focusing on fracture mechanics approaches. Finally, the perspectives and challenges for future development of the mechanical transfer method are discussed.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2004.10a
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• pp.229-236
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• 2004

A new three-node triangular shell element based on higher order zig-zag theory is developed for laminated composite shells with multiple delaminations. The present higher order zig-zag shell theory is described in a general curvilinear coordinate system and in general tensor notation. All the complicated curvatures of surface including twisting curvatures can be described in an exact manner in the present shell element because this element is based on geometrically exact surface representation. The displacement field of the proposed finite element includes slope of deflection. which requires continuity between element interfaces. Thus the nonconforming shape function of Specht's three-node triangular plate bending element is employed to interpolate out-of-plane displacement. The present element passes the bending and twisting patch tests in flat surface configurations. The developed element is evaluated through the buckling problems of composite cylindrical shells with multiple delaminations. Through the numerical examples it is demonstrated that the proposed shell element is efficient because it has minimal degrees of freedom per node. The accuracy of the present element is demonstrated in the prediction of buckling loads and buckling modes of shells with multiple delaminations. The present shell element should serve as a powerful tool in the prediction of buckling loads and modes of multi-layered thick laminated shell structures with arbitrary-shaped multiple delaminations.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.123-127
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• 1997

Recently, it is gradually raised necessity that interface is measured accurately and managed in industrial circles and medical world, An Ultrasonic wave transmitted from a focused beam transducer is being expected as a powerful tool for NDE of micro-defect. The ultrasonic NDE of the defect is based on the form of the wave reflected form the interface In this study, regarding to the thickness of film which is in opaque object and thickness measurement was done by MEM-cepstrum analysis of received ultrasonic wave. In measument results, film thickness which is beyond distance resolution capacity was measured accurately. Also, automatically repeated discrimination analysis method can be decided in the category of all kinds of defects on semiconductor package.

• Aerospace Engineering and Technology
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• v.8 no.1
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• pp.138-143
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• 2009

Thermal barrier efficiency and endurance of coatings in liquid rocket engine combustor were evaluated for air plasma spray coating and electro/electroless plating. The result of firing tests has revealed occasional occurrence of local delamination of $ZrO_2$, NiCrAlY coating obtained by the method of air plasma spray in the region of supersonic flow and it necessitated a new coating method as a substitution. It was found that Ni-Cr coating by means of electro/electroless plating can substitute $ZrO_2$, NiCrAlY coatings of air plasma spray in terms of thermal barrier efficiency and endurance.

• Journal of the Korean Ceramic Society
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• v.28 no.9
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• pp.675-682
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• 1991

Among many problems that need to be solved in the process of preparing multilayer chip LC filters, we studied the control of shrinkage in order to prevent the crack, warpage, and/or delamination which occurs at the interface between the inductance (L part) and the capacitance (C part). Shrinkage was controlled by compositions, powder size, calcining temperature and amount of organic binder. Capacitance sheet was prepared by mixing 65 wt% binder with the composition of 96 wt% TiO2 having an average particle size of 0.5 $\mu\textrm{m}$, 3 wt% CuO. After small amount of MnO2 and SiO2 added, it was calcined at 750$^{\circ}C$ for 2 hr. Inductance sheet was prepared by mixing 60 wt% binder with the composition of 49.5% mol% Fe2O3, 20.5 mol% ZnO, 20 mol% NiO and 10 mol% CuO which was calcined at 775$^{\circ}C$ for 2 hr. These sheets was laminated at 250 kg/$\textrm{cm}^2$, and cofired at 900$^{\circ}C$ for 2 hr to give rise to a multilayer chip LC filter without any warpage.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.12
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• pp.1106-1111
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• 2006

To improve warpage, delamination and the chemical reaction between 2 different co-fired materials, the bonding behavior with common glass was studied. As shown in the previous paper, the phenomenon of the infiltration is different with the composition of the glass. In particular, in the case of low temperature melting glass, infiltration is experimented in this study. GA-1 glass is infiltrated among $BaTiO_3$ particles below $800^{\circ}C$ and is made by glass/ceramic composite. Until the laminate is fired under $850^{\circ}C$, provskite phase is observed. Although in the case of GA-12 glass, the temperature of the glass infiltration is lower than it of GA-l glass, the perovskite phase already disappears at $800^{\circ}C$. As a result, GA-1 and GA-12 glasses are infiltrated among particles at low temperature, however, the chemical reactivity of the glass/ceramic and sintering temperature should be considered.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.735-738
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• 2003

Downsizing electronics requires precision position control with an accuracy of sub-micron order, which demands development of ultra-fine displacive devices. Piezoelectric transducer is one of devices transferring electric field energy into mechanical energy and being capable for fine displacement control. The transducer has been widely used as fine Position control device Multilayer piezoelectric actuator, one of typical piezo-transducer, is fabricated by stacking alternatively ceramic and electrode layers several hundred times followed by cofiring process. Electrode material should be tolerable in the firing process maintaining at ceramic-sintering temperatures up to $1100{\sim}1300^{\circ}C$. Ag-Pd can be used as stable electrode material in heat treatment above $960^{\circ}C$. Besides, adding small quantity ceramic powder allow the actuator to be fabricated in a good shape by diminishing shrinkage difference between ceramic and electrode layers, resulting in avoidance of crack and delamination at and/or nearby interface between ceramic an electrode layers. This study presents synthesis of nano-oxide-added Ag/Pd powders and its feasibility to candidate material tolerable at high temperature. The powders were formed in a co-precipitation process of Ag and Pd in nano-oxide-dispersed solution where Ag and Pd precursors are melted in $HNO_3$ acid.

• Transactions of the Korean Society of Mechanical Engineers
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• v.8 no.5
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• pp.425-434
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• 1984

The concept of intermittent interlaminar bonding is investigated as a means of improving the fracture toughness of cross-ply Gr/Ep composites without significant loss of tensile strength and modulus. The concept of linear elastic fracture mechanics(LEFM)is used to study the effects of strong bonded area and bonding composites. The experimental results indicate that the fracture toughness and notch strength of intermittent interlaminar bonded composities are improved and the tensile strength only decreased by 3-8% in comparison to those of the fully bonded composites. Damage zones around the crack tip are detected by the modified X-Ray non-destructive testing technique and the fractography. The improvement of toughness is explained based on the damage zones. The mechanisms of damage zone are shown to be caused by subcrack along the fiber on the 0.deg. ply, matrix cracking along the fiber on the 90.deg. ply, interlaminar delamination, and ply pull-out of the 0.deg. ply.