• Design & Manufacturing
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• v.14 no.1
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• pp.49-55
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• 2020

In this study, the fatigue behavior and fatigue life characteristics of PA2200 specimens fabricated by SLS 3D printer were studied. Fatigue tests were performed according to the standard specification (ASTM E468) and fatigue life curves were obtained. In order to perform the fatigue test, mechanical properties were measured according to the test speed of the simple tensile test, and the self-heating temperature of the specimen according to the test speed was measured using an infrared temperature measuring camera in consideration of heat generation due to plastic deformation. There was no significant difference within the set test speed range and the average self-heating temperature was measured at 38.5 ℃. The mechanical strength at the measured temperature showed a relatively small difference from the mechanical strength at room temperature. Fatigue test conditions were established through the preceding experiments, and the loading conditions below the tensile strength at room temperature 23 ℃ were set as the cyclic load. The maximum number of replicates was less than 100,000 cycles, and the fracture behavior of the specimens with the repeated loads showed the characteristics of Racheting. It was confirmed that SLS 3D printing PA2200 material could be applied to the Basquin's S-N diagram for the fatigue life curve of metal materials. SEM images of the fracture surface was obtained to analyze the relationship between the characteristics of the fracture surface and the number of repetitions until failure. Brittle fracture, crazing fracture, grain melting, and porous fracture surface were observed. It was shown that the larger the area of crazing damage, the longer the number of repetitions until fracture.

• Design & Manufacturing
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• v.14 no.1
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• pp.1-7
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• 2020

In this study, the variation of the shrinkage in the thickness direction of the molded parts according to the gate size of the polymer core fabricated through the 3D printer using the SLS method was studied. The polymer cores are laser sintered and the powder material is nylon base PA2200. The polymer cores have lower heat transfer rate and rigidity than the metal core due to the characteristics of the material. Therefore, the injection molding test conditions are set to minimize the deformation of the core during the injection process. The resin used in the injection molding test is a PP material. The packing condition was set to 80, 90 and 100% of the maximum injection pressure for each gate size. The runner diameter used was ∅3mm, and the gates were fabricated in semicircle shapes with cross sections 1, 2, and 3 ㎟, respectively. Thickness measurement was performed for 10 points at 2.5 mm intervals from the point 2.5 mm away from the gate, and the shrinkage to thickness was measured for each point. The shrinkage rate according to the gate size tends to decrease as the cross-sectional area decreases as the maximum injection pressure increases. The average thickness shrinkage rate was close to 0% when the packing pressure was 90% for the gate area of 1mm2. When the holding pressure was set to 100%, the shrinkage was found to decrease by 3% from the standard dimension due to the over-packing phenomenon. Therefore, the smaller the gate, the more closely the molded dimensions can be molded due to the high pressure generation. It was confirmed that precise packing process control is necessary because over-packing phenomenon may occur.

• Design & Manufacturing
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• v.13 no.4
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.3
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• pp.320-326
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• 2017

Multistage deep-drawing technology is used widely in the production of mobile phone battery cases to improve productivity and economy. To ensure adequate capacity and rigidity, such cases are fabricated as a rectangular cup with a high slender ratio. The multistage deep-drawing of a rectangular cup entails a high slender ratio, and the heights of the product sides may be non-uniform because of the complicated deformation mechanisms. This causes problems in product assembly that affects the surface quality of the case. This study examined a blank shape that minimizes the height variations of the product to resolve the aforementioned problems. Optimization design and analysis were performed to identify the shape that yields the least variation. The long and short sides of an oval blank were set as the design variables. The objective function was set to yield the lowest height difference, and the thickness reduction rate of the product was set to the target range. In addition, the height of the final shape was set as a constraint. The height difference was minimized successfully using the optimized design. The design process of the initial blank for all rectangular shapes can be automated in the future.

• Composites Research
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• v.19 no.1
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• pp.29-35
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• 2006

The avoidance of enemy's radar detection is very important issue in the modem electronic weapon system. Researchers have studied to minimize reflected signals of radar. In this research, two types of radar absorbing structure (RAS), 'C'-type shell and 'U'-type shell, were fabricated using fiber-reinforced composite materials and their radar cross section (RCS) were evaluated. The absorption layer was composed of glass fiber reinforced epoxy and nano size carbon-black, and the reflection layer was fabricated with carbon fiber reinforced epoxy. During their manufacturing process, undesired thermal deformation (so called spring-back) was observed. In order to reduce spring-back, the bending angle of mold was controlled by a series of experiments. The spring-back of parts fabricated by using compensated mold was predicted by finite element analysis (ANSYS). The RCS of RAS shells were measured by compact range and predicted by physical optics method. The measured RCS data was well matched with the predicted data.

• Design & Manufacturing
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• v.15 no.2
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• pp.23-29
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• 2021

The specific strength of magnesium alloy is four times that of iron and 1.5 times that of aluminum. For this reason, its use is increasing in the transportation industry which is promoting weight reduction. At room temperature, magnesium alloy has low formability due to Hexagonal closed packed (HCP) structure with relatively little slip plane. However, as the molding temperature increases, the formability of the magnesium alloy is greatly improved due to the activation of other additional slip systems, and the flow stress and elongation vary greatly depending on the temperature. In addition, magnesium alloys exhibit asymmetrical behavior, which is different from tensile and compression behavior. In this study, a jig was developed that can measure the plane deformation behavior on the surface of a material in tensile and compression tests of magnesium alloys in warm temperature. A jig was designed to prevent buckling occurring in the compression test by applying a certain pressure to apply it to the tensile and compression tests. And the tensile and compressive behavior of magnesium at each temperature was investigated with the developed jig and DIC equipment. In each experiment, the strain rate condition was set to a quasi-static strain rate of 0.01/s. The transformation temperature is room temperature, 100℃. 150℃, 200℃, 250℃. As a result of the experiment, the flow stress tended to decrease as the temperature increased. The maximum stress decreased by 60% at 250 degrees compared to room temperature. Particularly, work softening occurred above 150 degrees, which is the recrystallization temperature of the magnesium alloy. The elongation also tended to increase as the deformation temperature increased and increased by 60% at 250 degrees compared to room temperature. In the compression experiment, it was confirmed that the maximum stress decreased as the temperature increased.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.391-397
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• 2017

Recently, digital image correlation (DIC) techniques have been used to measure dynamic deformation during tensile testing. The standard tensile test method measures the average displacement of the relevant specimen to calculate the true stress-strain curve. Therefore, the validity of the true stress curve is restricted to the stress incurred within the uniform stretching interval, i.e., the maximum stress corresponds to the starting point of the necking deformation. Alternatively, if DIC is used, the effective range of the strain and strain rate can be extended to the breaking point of the tensile specimen, because of the feasibility of measuring the local strain over the entire area of interest. Because of these advantages, many optical 3D measurement systems have been introduced and used in research and industry. However, the conventional 3D measurement systems are exceedingly expensive and time consuming. In addition, these systems have the disadvantage of a very large equipment size which makes their transport difficult. In this study, a 2D image correction method employing a 2D DIC measurement method in conjunction with a numerical analysis method is developed using a smartphone. The results of the proposed modified 2D DIC method yielded higher accuracy than that obtained via the 3D measurement equipment. In conclusion, it was demonstrated that the proposed 2D DIC and calibration methods yield accurate measurement results with low time costs.

• The Journal of Korean Academy of Prosthodontics
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• v.41 no.2
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• pp.243-257
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• 2003

The purpose of this study was to search the influences of the increase of the contents of sodium alginate in the experimental alginates on the some mechanical properties. 3 commercial alginates were selected for the purpose of comparison of the results of experiments. 7 experimental alginates were manufactured with the rise of contents of sodium alginate from 8.8% to 18.3% with the decrease of contents of diatomaceous earth and with the constant contents of calcium sulfate 12.5%. sodium phosphate 2.2%, zinc fluoride 2.0%. Splitable metal mold with 12.5mm diameter and 20.0mm height was filled with mixed alginate to prepare the cylinder shaped specimens. Strain in compression, elastic recovery, compressive strength were tested using the ISO specification number 1563, alginate impression material. Experimental groups were 7, and 10 specimens were used for each test items and each groups. Following results were obtained ; 1. Strain in compression was decreased with the increase of sodium alginate contents (p=0.0077, r2 = 0.6302). 2. Elastic recovery was decreased with the increase of sodium alginate contents but was not significant(p=0.0639, r2=0.7449). 3. Compressive strength was increased with the increase of sodium alginate contents (p<0.0001, r2 = 0.9617). These results mean that the increase of sodium alginate contents make alginate harder but may result the increased permanent deformation.

• Design & Manufacturing
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• v.16 no.3
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• pp.9-15
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• 2022

In order to reduce the manufacturing costs of the glass lens, it is necessary to manufacture a lens using a UV curable resin or a thermosetting resin, which is a curable material, in order to replace a glass lens. In the case of forming a lens using a thermosetting material, it is necessary to form several lenses at once using the wafer-level lens manufacturing technologies due to the long curing time of the material. When a lens is manufactured using a curable material, an error in the shape of the lens due to the shrinkage of the material during the curing process is an important cause of defects. The major factors for these shape errors and deformations are the shrinkage and the change of mechanical properties in the process of changing from a liquid material during curing to a solid state after complete curing. Therefore, it is necessary to understand the curing process of the material and to examine the shrinkage rate and change of physical properties according to the degree cure. In addition, it is necessary to proceed with CAE for lens molding using these and to review problems in lens manufacturing in advance. In this study, the viscoelastic properties of the material were measured during the curing process using a rheometer. Using the results, Rheological investigation of cure kinetics was performed. At the same time, The shrinkage of the material was measured and simple mathematical models were created. And using the results, the molding process of a single lens was analyzed using Comsol, a commercial S/W. In addition, the experiment was conducted to compare and verify the CAE results. As a result, it was confirmed that the shrinkage rate of the material had a great influence on the shape precision of the final product.