• Title/Summary/Keyword: defects in 3D printing

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The effect of fixation plate use on bone healing during the reconstruction of mandibular defects

  • Hong, Khang Do Gia;Kim, Seong-Gon;Park, Young-Wook
    • Journal of the Korean Association of Oral and Maxillofacial Surgeons
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    • v.45 no.5
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    • pp.276-284
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    • 2019
  • Objectives: This study sought to compare efficiency results between the use of a customized implant (CI) and a reconstruction plate (RP) in mandibular defect reconstruction in an animal model. Materials and Methods: Fifteen rabbits underwent surgery to create a defect in the right side of the mandible and were randomly divided into two groups. For reconstruction of the mandibular defect, the RP group (n=5) received five-hole mini-plates without bone grafting and the CI group (n=10) received fabricated CIs based on the cone-beam computed tomography (CBCT) data taken preoperatively. The CI group was further divided into two subgroups depending on the time of CBCT performance preoperatively, as follows: a six-week CI (6WCI) group (n=5) and a one-week CI (1WCI) group (n=5). Daily food intake amount (DFIA) was measured to assess the recovery rate. Radiographic images were acquired to evaluate screw quantity. CBCT and histological examination were performed in the CI subgroup after sacrifice. Results: The 1WCI group showed the highest value in peak average recovery rate and the fastest average recovery rate. In terms of reaching a 50% recovery rate, the 1WCI group required the least number of days as compared with the other groups ($2.6{\pm}1.3days$), while the RP group required the least number of days to reach an 80% recovery rate ($7.8{\pm}2.2days$). The 1WCI group showed the highest percentage of intact screws (94.3%). New bone formation was observed in the CI group during histological examination. Conclusion: Rabbits with mandibular defects treated with CI showed higher and faster recovery rates and more favorable screw status as compared with those treated with a five-hole mini-plate without bone graft.

Study on Corrosion Properties of Additive Manufactured 316L Stainless Steel and Alloy 625 in Seawater

  • Jung, Geun-Su;Park, Yong-Ha;Kim, Dae-Jung;Lim, Chae-Seon
    • Corrosion Science and Technology
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    • v.18 no.6
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    • pp.258-266
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    • 2019
  • The objective of this study was to evaluate corrosion resistance of additive manufactured 316L stainless steel and alloy 625 powders widely used in corrosion resistance alloys of marine industry in comparison with cast alloys. Directed Energy Deposition (DED) method was used in this work for sample production. DED parameter adjustment was also studied for optimum manufacturing and for minimizing the influence of defects on corrosion property. Additive manufactured alloys showed lower corrosion resistance in seawater compared to cast alloys. The reason for the degradation of anti-corrosion property was speculated to be due to loss of microstructural integrity intrinsic to the additive manufacturing process. Application of heat treatment with various conditions after DED was attempted. The effect of heat treatments was analyzed with a microstructure study. It was found that 316L and alloy 625 produced by the DED process could recover their expected corrosion resistance when heat treated at 1200 ℃.

Analysis of Research Trends on Electrochemical-Mechanical Planarization (전기화학-기계적 평탄화에 관한 연구 동향 분석)

  • Lee, Hyunseop;Kim, Jihun;Park, Seongmin;Chu, Dongyeop
    • Tribology and Lubricants
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    • v.37 no.6
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    • pp.213-223
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    • 2021
  • Electrochemical mechanical planarization (ECMP) was developed to overcome the shortcomings of conventional chemical mechanical planarization (CMP). Because ECMP technology utilizes electrochemical reactions, it can have a higher efficiency than CMP even under low pressure conditions. Therefore, there is an advantage in that it is possible to reduce dicing and erosions, which are physical defects in semiconductor CMP. This paper summarizes the papers on ECMP published from 2003 to 2021 and analyzes research trends in ECMP technology. First, the material removal mechanisms and the configuration of the ECMP machine are dealt with, and then ECMP research trends are reviewed. For ECMP research trends, electrolyte, processing variables and pads, tribology, modeling, and application studies are investigated. In the past, research on ECMP was focused on basic research for the development of electrolytes, but it has recently developed into research on tribology and process variables and on new processing systems and applications. However, there is still a need to increase the processing efficiency, and to this end, the development of a hybrid ECMP processing method using another energy source is required. In addition, ECMP systems that can respond to the developing metal 3D printing technology must be researched, and ECMP equipment technology using CNC and robot technology must be developed.

Development of real-time defect detection technology for water distribution and sewerage networks (시나리오 기반 상·하수도 관로의 실시간 결함검출 기술 개발)

  • Park, Dong, Chae;Choi, Young Hwan
    • Journal of Korea Water Resources Association
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    • v.55 no.spc1
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    • pp.1177-1185
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    • 2022
  • The water and sewage system is an infrastructure that provides safe and clean water to people. In particular, since the water and sewage pipelines are buried underground, it is very difficult to detect system defects. For this reason, the diagnosis of pipelines is limited to post-defect detection, such as system diagnosis based on the images taken after taking pictures and videos with cameras and drones inside the pipelines. Therefore, real-time detection technology of pipelines is required. Recently, pipeline diagnosis technology using advanced equipment and artificial intelligence techniques is being developed, but AI-based defect detection technology requires a variety of learning data because the types and numbers of defect data affect the detection performance. Therefore, in this study, various defect scenarios are implemented using 3D printing model to improve the detection performance when detecting defects in pipelines. Afterwards, the collected images are performed to pre-processing such as classification according to the degree of risk and labeling of objects, and real-time defect detection is performed. The proposed technique can provide real-time feedback in the pipeline defect detection process, and it would be minimizing the possibility of missing diagnoses and improve the existing water and sewerage pipe diagnosis processing capability.

Effect of the Processes of Polysilazane Solid Electrolyte Layer and Silver Active Electrode on the Electrical Characteristics of Memristor (폴리실라잔 고체 전해질 층과 은 활성 전극의 공정이 멤리스터의 전기적 특성에 미치는 영향)

  • Hui-Su Yang;Gyeong-seok Oh;Dong-Soo Kim;Jin-Hyuk Kwon;Min-Hoi Kim
    • Journal of IKEEE
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    • v.27 no.1
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    • pp.25-29
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    • 2023
  • Effect of the processes of polysilazane solid electrolyte layer and silver (Ag) active electrode on the electrical characteristics of memristor was investigated. The memristor with the solid electrolyte annealed at higher temperature exhibited the higher set voltage and better memory retention characteristics than that annealed at lower temperature. The increase in the set voltage and the improvement of the memory retention characteristic at high annealing temperature were attributed to a reduction in the void density and an increase in the void uniformity inside the solid electrolyte, respectively. In the case where the polysilazane solution's concentration is high, the memristor exhibited rapid degradation of low resistive state even annealed at high temperature. Lastly, it was shown that the memristor with the solution-processed Ag active electrode showed WORM property unlike that with the vacuum-processed Ag active electrode. The WORM property was possibly due to morphological defects present in the solution-processed Ag active electrode.

Characterization and Mechanical Properties of Stainless Steel 316L Fabricated Using Additive Manufacturing Processes (적층식 제조 공정을 활용한 스테인레스 316L 제작기술의 특징과 기계적 속성)

  • Choi, Cheol;Jung, Mihee
    • KEPCO Journal on Electric Power and Energy
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    • v.7 no.1
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    • pp.129-135
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    • 2021
  • Recently, additive manufacturing (AM) technology such as powder bed fusion (PBF) and directed energy deposition (DED) are actively attempted as consumers' needs for parts with complex shapes and expensive materials. In the present work, the effect of processing parameters on the mechanical properties of 316L stainless steel coupons fabricated by PBF and DED AM technology was investigated. Three major mechanical tests, including tension, impact, and fatigue, were performed on coupons extracted from the standard components at angles of 0, 45, 90 degrees for the build layers, and compared with those of investment casting and commercial wrought products. Austenitic 316L stainless steel additively manufactured have been well known to be generally stronger but highly vulnerable to impact and lack in elongation compared to casting and wrought materials. The process-induced pore density has been proved the most critical factor in determining the mechanical properties of AM-built metal parts. Therefore, it was strongly recommended to reduce those lack of fusion defects as much as possible by carefully control the energy density of the laser. For example, under the high energy density conditions, PBF-built parts showed 46% higher tensile strength but more than 75% lower impact strength than the wrought products. However, by optimizing the energy density of the laser of the metal AM system, it has been confirmed that it is possible to manufacture metal parts that can satisfy both strength and ductility, and thus it is expected to be actively applied in the field of electric power section soon.

Study on the optimization of additive manufacturing process parameters to fabricate high density STS316L alloy and its tensile properties (고밀도 STS316L 합금 적층 성형체의 제조공정 최적화 및 인장 특성 연구)

  • Yeonghwan Song
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.33 no.6
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    • pp.288-293
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    • 2023
  • To optimize the process parameters of laser powder bed fusion process to fabricate the high density STS316L alloy, the effect of laser power, scanning speed and hatching distance on the relative density was studied. Tensile properties of additively manufactured STS316L alloy using optimized parameters was also evaluated according to the build direction. As a result of additive manufacturing process under the energy density of 55.6 J/mm3, 83.3 J/mm3 and 111.1 J/mm3, high density STS316L specimens was suitably fabricated when the energy density, power and scan speed were 83.3 J/mm3, 225 W and 1000 mm/s, respectively. The yield strength, ultimate tensile strength, and elongation of STS316L specimens in direction perpendicular to the build direction, show the most competitive values. Anisotropic shape of the pores and the lack of fusion defects probably caused strain localization which result in deterioration of tensile properties.

Effects of Solder Particle Size on Rheology and Printing Properties of Solder Paste (미세피치 접합용 솔더 페이스트의 솔더 분말 크기에 따른 레올로지 및 인쇄 특성 평가)

  • Jun, So-Yeon;Lee, Tae-Young;Park, So-Jeong;Lee, Jonghun;Yoo, Sehoon
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.2
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    • pp.91-97
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    • 2022
  • The wettability and rheological properties of solder paste with the size of the solder powder were evaluated. To formulate the solder paste, three types of solder powder were used: T4 (20~28 ㎛), T5 (15~25 ㎛), and T6 (5~15 ㎛). The viscosities of the T4, T5, and T6 solder pastes at 10 RPM were 155, 263, and 418 Pa·s, respectively. After 7 days, the viscosity of the T4 solder paste slightly increased by 2.6% and that of T5 was increased by 20.6%. The viscosity of the T6 solder paste after 7 days could not be measured due to high viscosity. The viscosity variation with solder particle size also affected on the printability of the solder. In the case of the T4 solder paste, printability, slump, bridging, and soldering properties were excellent. On the other hand, T5 showed slight dewetting and solder ball defects. Especially, T6, which the smallest powder size, showed poor printability and dewetting at the edge of solder.