• 대한족부족관절학회지
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• 제14권1호
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• pp.58-65
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• 2010

Purpose: This study was performed to evaluate the clinical outcomes of operative treatment using porous hydroxyapatite for intraarticular calcaneal fracture of joint depression type. Materials and Methods: Twenty patients with intraarticular calcaneal fracture were followed up for more than 1 year. The period to union was calculated to evaluate the osteoconductivity of porous hydroxyapatite used as bone graft substitute. The measurement of Bohler angle, Gissane angle and the degree of articular surface depression was performed through preoperative and postoperative radiographs. The clinical evaluation was performed according to hindfoot score of the American Orthopaedic Foot and Ankle Society (AOFAS) and scale of the Creighton-Nebraska health foundation (CNHF). Results: Bohler angle and Gissane angle had improved significantly from preoperative average $10.4^{\circ}$, $117.8^{\circ}$ to average $22.6^{\circ}$, $113.5^{\circ}$ immediate postoperatively, and had maintained to average $21.2^{\circ}$ and $114.4^{\circ}$ at the last follow-up. The degree of articular surface depression had improved significantly from preoperative average 4.8 mm to 1.5 mm at the last follow-up. All cases achieved bone union, and the interval to union was average 12.8 weeks. AOFAS score was average 85.2 points at last follow-up. There were 7 excellent, 10 good, and 3 fair results according to the CNHF scale. Therefore, 17 cases (85%) achieved satisfactory results. Conclusion: Plate fixation using porous hydroxyapatite seems to be one of effective treatment methods for intraarticular calcaneal fracture of joint depression type, because of supporting the reduction of subtalar articulation by augmenting bony defect and facilitating bone formation. Further evaluation about long-term radiological changes and histological analysis on hydroxyapatite implantation site should be required.

• Archives of Plastic Surgery
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• 제34권3호
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• pp.298-304
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• 2007

Purpose: This study was undertaken to investigate the osteogenic induction potential of PGA & FBS mixture on a calvarial defect in the rabbit. Methods: Twenty New zealand white rabbit, weighing from 3.5-4kg were allocated into each of the three groups. Four 8 mm sized bone defects were made on the parietal bone by drilling. In group I, the bony defects were implanted with $50{\mu}m$ thickness film containing mixture of PGA and FBS. In group II, with PGA only film, & in group III, the bony defects were left with no implants. Results were evaluated by using morphologic change, radiographic study, biochemical study and histologic examination at 1 week (group I n=7, group II n=7, group III n=14), 2 weeks (group I n=6, group II n=6, group III n=12) and 3 weeks (group I n=7, group II n=7, group III n=14) following implantation. Results: In the morphologic & radiographic study, the formation and corticalization of callus were observed earlier in group I than in groups II and III (p < 0.05). In histological examination, group I showed more abundant and faster new bone formation than in group II and III. In biochemical analysis, group I displayed more activity than in group II and III. Group I also showed more abundant osteopontin, osteocalcin than groups II and III. Conclusion: In conclusion, the results demonstrate that the mixture of PGA and FBS has an effect on osteoblastic formation in the rabbit model. It is considered that further evaluation of long term results on resorption, immunologic tissue reaction and response of applied mixture in the human model will be needed.

• 한국임상수의학회지
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• 제26권2호
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• pp.123-129
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• 2009

동맥관 개존증(PDA)은 동맥관의 불완전한 폐쇄로 인해 하행 대동맥과 폐동맥 사이에 비정상적인 단락이 형성된 것이다. 최근 인간의 유전자 연구에서 전사인자 AP-2 beta(TFAP2B)의 유전자 변이가 PDA 증후적 사례를 초래함을 발견하였다. TFAP2B 유전자의 변이는 사람의 PDA와 같은 특정 선천성 심장 기형과 관련되어 있다. 본 연구에서는 PDA에 이환된 개의 유전자 스크리닝을 하기 위해 개 TFAP2B유전자의 전체 exon 부위를 분리하였다. 개 TFAP2B유전자는 사람의 TFAP2B와 아미노산 서열이 매우 유사하였다. PDA에 이환된 말티즈견의 TFAP2B유전자 스크리닝에서 단일 c.936+203G>A 염기 변화가 발견되었다. 그러나 대조군의 유전자 스크리닝에서도 동일한 염기 변화가 발견되었다. 이 염기의 변화는 인트론 지역에 위치해 있었으며 이환되지 않은 대조군 개에서 발견된 것으로 보아 TFAP2B는 말티즈 견의 유전성 PDA와 다른 종의 PDA 환자를 초래하지 않을 것으로 보인다. 향후 더 많은 샘플을 모으고 PDA에 이환된 다양한 종과 다른 선천성 심장 기형을 가진 환축에서 TFAP2B를 스크리닝하는 연구가 필요하다.

• 한국진공학회지
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• 제2권2호
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• pp.188-198
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• 1993

두께가 6~10 nm인 게이트 산화막의 계면에 염소(Cl)를 도입시킨 n-MOS capacitor 및 n-MOSFET을 제잘하여 물성적인 방법(SIMS, ESCA)과 전기적인 방법에 의해서 소자의 특성을 분석, 평가하였다. Last step TCA법을 이용하여 성장시킨 산화막은 No TCA법으로 성장시킨 것보다 mobility가 7% 정도 증가하였고, 결함 밀도도 감소하였다. Time-zero-dielectric-breakdown(TZDB)으로 측정한 결과, Cl를 도입한 막의 파괴 전계(breakdon field)는 18 MV/cm인데, 이것은 Cl을 도입하지 않은 것보다 약 0.6 MV/cm 정도 높은 값이다. 또한 time-dependent-dielectric-breakdown(TDDB) 결과로부터 수명이 20년 이상인 것으로 평가되었고, hot carrier 신뢰성 측정으로부터 평가한 소자의 수명도 양호한 것으로 나타났다. 이상의 결과에서 Cl을 계면에 도입시킨 게이트 산화막을 가진 소자가 좋은 특성을 나타내고 있으므로 Last step TCA법을 종래의 산화막 성장 방법 대신에 사용하면 MOSFET 소자의 새로운 게이트 절연막 성장법으로서 대단히 유용할 것으로 생각된다.

• 대한기계학회논문집A
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• 제40권6호
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• pp.531-537
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• 2016

기계 혹은 구조물의 파손 및 파괴는 소재의 내부에 존재하는 결함에서 발생하는 크랙에 의한 것이다. 이러한 크랙들은 밀집하여 존재하는 경우가 많기 때문에 크랙의 진전 및 성장특성들을 고려하지 않으면 안 된다. 이에 따라 본 연구에서는 표준 CT 시험편 내부의 크랙 및 구멍의 위치에 따른 파괴특성을 고찰하였으며, 표준CT 시험편에 편심된 집중하중을 가하였을 때, 시험편 내 크랙 주변의 구멍의 존재유무 및 위치에 따른 파괴역학적 거동에 대하여 규명하였다. 연구 결과로서 Model 3(크랙 주변에 구멍이 한 개 존재하는 시험편 모델로서 크랙의 끝부분과 구멍 간의 거리 가로방향으로 2mm의 경우)가 최대 변형량, 최대 응력 및 최대 변형 에너지, 모두 가장 크게 나타났으며, 모든 시험편 모델들이 시험편 내부의 크랙과 구멍의 거리가 가까울수록 최대 응력이 커지는 경향을 보였다. 또한 구멍의 개수와는 별개로 시험편 내부의 크랙 가까이에 구멍이 존재할 때 크랙 가까이에서 최대 응력은 커지는 경향이 나타나는 것을 알 수 있었으며, 이러한 본 연구 결과를 토대로 기계 혹은 기계 구조물 내부에 구멍을 뚫는다면, 시험편에 발생하는 파괴 응력의 값을 줄임으로써 파손이나 고장이 일어나는 것을 방지할 수 있을 것으로 사료된다.

• Molecules and Cells
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• 제42권12호
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• pp.858-868
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• 2019

Shoot branching is an essential agronomic trait that impacts on plant architecture and yield. Shoot branching is determined by two independent steps: axillary meristem formation and axillary bud outgrowth. Although several genes and regulatory mechanism have been studied with respect to shoot branching, the roles of chromatin-remodeling factors in the developmental process have not been reported in rice. We previously identified a chromatin-remodeling factor OsVIL2 that controls the trimethylation of histone H3 lysine 27 (H3K27me3) at target genes. In this study, we report that loss-of-function mutants in OsVIL2 showed a phenotype of reduced tiller number in rice. The reduction was due to a defect in axillary bud (tiller) outgrowth rather than axillary meristem initiation. Analysis of the expression patterns of the tiller-related genes revealed that expression of OsTB1, which is a negative regulator of bud outgrowth, was increased in osvil2 mutants. Chromatin immunoprecipitation assays showed that OsVIL2 binds to the promoter region of OsTB1 chromatin in wild-type rice, but the binding was not observed in osvil2 mutants. Tiller number of double mutant osvil2 ostb1 was similar to that of ostb1, suggesting that osvil2 is epistatic to ostb1. These observations indicate that OsVIL2 suppresses OsTB1 expression by chromatin modification, thereby inducing bud outgrowth.

• 대한유전성대사질환학회지
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• 제16권3호
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• pp.148-154
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• 2016

요소 회로 대사 이상은 요소 합성에 관련된 효소의 결핍으로 인해 발생하는 질환으로, ornithine과 carbamylphosphate로부터 citrulline을 생성하는 과정에 관여하는 효소인 OTC 결핍증이 가장 흔하다. OTC 결핍증은 ammonia, glutamate, glutamine, alanine 등의 축적되면서 고암모니아 혈증 및 고글루타민 혈증으로 인한 신경학적 증상이 나타나게 되며, 근긴장 저하, 호흡 부전, 경련, 기면, 혼수로 진행하여 사망에 이르게 된다. 저자들은 생후 4일 경부터 구토와 함께 의식의 저하를 보인 환자에서 직열 질량 분석법을 통해 OTC 결핍증을 진단하였고, 증상 발생 31시간 만인 생후 118시간 째에 지속적 정정맥 혈액여과(continuous venovenous hemofiltration, CVVH)을 적용하여 고암모니아 혈증을 치료하였다. 또한 직접염기서열분석법을 통해 780번과 781번 염기 사이에 CAGGCAGTGT가 삽입되는 변이(c.780_781insCAGGCAGTGT (p.Ile261Glnfs*35))를 발견하였다. 환자는 4일 간의 CVVH 이후 혈중 암모니아 농도와 의식이 호전되어 생후 53일 째 퇴원하였으나, 생후 12개월 경 좌측 대퇴골의 골절과 골수염이 발생하였고, 이후 패혈증 쇼크, 고혈당, 다발성 장기부전으로 사망하였다. 이에 저자들은 OTC 결핍증 환자에서 CVVH 치료 및 패혈증과 당뇨를 경험하였고, 유전자 검사에서 이전에 보고된 바 없는 새로운 변이를 확인하였기에 증례를 보고하는 바이다.

• Archives of Reconstructive Microsurgery
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• 제16권2호
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• pp.113-118
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• 2007

Purpose: The purpose of this work was to describe the results of treatment for motor vehiclerelated crushing injuries among children and adolescents under sixteen years in Korea. Materials and Methods: A retrospective analysis was conducted of data from children who were under sixteen year and injured foot by motor vehicles. Cases were documented 1) age at the time of injury, 2) injured site, 3) the area of accident, 4) the kind of vehicle, 5) associated injuries, 6) methods of treatment for soft tissue reconstruction and 7) complications. The relationships between the area of accident and associated injuries, and the kind of vehicle and associated injuries were analyzed using Chi-square test and Fisher exact test. Results: There were 97 children who were 15 year and younger. The mean age was 7.4 years, and 65% were boys. The left foot was more dominant side of injury (57%). Seasonal variation was seen with the number of injuries peaking during the summer (43%, p<0.05). Among the vehicles, 78.3% were the large vehicles (bus, truck or van). The where of accident was more frequent at an alley or less than two lanes of traffic. But, the relationships between the place of accident and associated injury or the kind of vehicles and associated injury were not statistically significant. The associated injury were fracture or dislocation (23 cases, 35.9%), injury of tendon (21 cases, 32.8%). There were amputation or disarticulation of foot in 8 cases (8.2%) and post-traumatic deformities such as flatfoot, hindfoot varus or valus deformities by tendon injury in 7 cases (7.2%). Conclusion: More than 50% of crushing or degloving injuries of child's foot by traffic accidents happened in boys between 5 to 9 years old. The associated injury was unrelated with size of vehicles or accident place at the time of accident. But, even though foot injury happened in an alley or one lane by small vehicles, child who hurt feet by car need thorough investigation about associated injury. If a surgeon keep in mind and treat child to associated injury necessarily, can minimize complication. Microsurgical reconstruction for soft tissue defect was prior to other methods.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• 한국축산식품학회지
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• 제31권2호
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• pp.266-272
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• 2011

국내에서 유통되고 있는 오리의 도체중량 및 도체품질 현황을 조사하기 위해 총 419,164수의 오리 도체중량을 분석한 결과, 평균 2,164.4 g, 최빈값은 2,000 g, 중위수는 2,200 g 및 사분위 범위는 300 g이었다. 오리 생체중량 구간별 도체수율은 평균 70.1% 인 것으로 나타났다. 오리도체의 외모 불량률은 28.4%, 외관손상 발생률은 4.8%인 것으로 나타났다. 변색 발생률은 34.1% 인 것으로 나타났는데, 특히 다리살에서 유의적으로(p<0.05) 높게 나타났다. 오리 도체표면의 잔모제거 불량률은 평균 44% 수준으로 도체중량 2.15 kg 미만일 때 전체 불량률의 약 86%를 차지하는 것으로 나타났다. 이는 오리 생체중량으로 환산할 경우 약 3 kg 내외가 된다. 오리 도체의 탈골(골절) 발생률은 평균 9.91% 수준으로 대부분 날개 부위와 다리 부위에서 발생하는 것으로 나타났다. 오리 가슴살의 지방함량은 도체중량 2.3 kg 구간에서 유의적으로(p<0.05) 높게 나타났다. 이는 오리 생체중량으로 환산할 경우 약 3.28 kg 내외가 된다. 이상의 결과를 종합해 볼 때 오리의 출하체중은 최소 3 kg 이상은 되어야 할 것으로 사료된다.