• 전기전자학회논문지
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• 제27권4호
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• pp.556-560
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• 2023

본 연구에서는 4H-SiC Epi Surface에 Nitrogen implantation 공정이 깊은준위결함과 lifetime에 미치는 영향을 비교분석하였다. Deep Level Transient Spectroscopy (DLTS)와 Time Resolved Photoluminescence (TR-PL)을 사용하여 깊은준위결함과 carrier lifetime을 측정하였다. As-grown SBD에서는 0.16 eV, 0.67 eV, 1.54 eV 에너지 준위와 implantation SBD의 경우 0.15 eV 준위에서의 결함을 측정되었으며, 이는 nitrogen implantation으로 불순물이 titanium 및 carbon vacancy를 대체됨으로 lifetime killer로 알려진 Z_1/2, EH_6/7 준위 결함은 감소하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 추계학술대회 논문집
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• pp.232-235
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• 1995

To improve the DIBL characteristics of deep sub micron BC PMOSFETs, the methods of DCI(Deep Channel Implantation) and Hale Implantation have been reported. In this study, using the process simulator TSUPREM4, we simulated the 0.25$\mu\textrm{m}$ and 0.45$\mu\textrm{m}$ gate length BC PMOSFETs applying the both methods to improve the DIBL characteristics, and their electric characteristics were compared to find the mothod suitable far deep sub-half micron BC PMOSFETs, using the device simulator MEDICI. So we found out that the method of Halo Implantation could be applied to deep sub-half micron BC PMOSFETs for 255 Mbit DRAM.

• 한국전기전자재료학회논문지
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• 제33권4호
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• pp.263-270
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• 2020

In this study, the physical mechanism and diffusion effects in aluminium implanted silicon was investigated. For fabricating power semiconductor devices, an aluminum implantation can be used as an emitter and a long drift region in a power diode, transistor, and thyristor. Thermal treatment with O₂ gas exhibited to a remarkably deeper profile than inert gas with N₂ in the depth of junction structure. The redistribution of aluminum implanted through via thermal annealing exhibited oxidation-enhanced diffusion in comparison with inert gas atmosphere. To investigate doping distribution for implantation and diffusion experiments, spreading resistance and secondary ion mass spectrometer tools were used for the measurements. For the deep-junction structure of these experiments, aluminum implantation and diffusion exhibited a junction depth around 20 ㎛ for the fabrication of power silicon devices.

• 대한심미치과학회지
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• 제28권1호
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• pp.27-41
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• 2019

예지성 있는 대구치부 임플란트을 위해서는 Crestal bone Stabliity를 위해 임플란트 주위에 biologic width라 할 수 있는 적절한 두께의 연조직이 필요하다. 그러기 위해선 기존에 우리가 적절하다고 혹은 어쩔 수 없는 한계라고 생각했던 깊이보다 좀 더 치조골 하방으로 깊이 심어야 하는 경우가 많은 것 같다. 이번 투고에서는 case report와 함께 관련된 surgical technique에 대해서 소개하면서 구치부 임플란트의 수직적 위치에 대해서 생각보고자 한다.

• 한국항해항만학회:학술대회논문집
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• 한국항해항만학회 2000년도 추계학술대회논문집
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• pp.17-20
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• 2000

This study is about a retrograde triple well employed in the Cell tr. of next DRAM and flash memory. triple well structure is formed deep n-well under the light p-well using MeV ion implantation. MeV P implanted deep n-well was observed to show greatly improved characteristics of electrical isolation and soft error. Junction leakage current, however, showed a critical behavior as a function of implantation and annealing conditions. {311} defects were observed to be responsible for the leakage current. {311} defects were generated near the R$\sub$p/ (projected range) region and grown upward to the surface during annealing. This is study on the defect behavior in device region as a function of implantation and annealing conditions.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.17-20
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• 2000

This study is about a retrograde triple well employed in the Cell tr. of next DRAM and flash memory. Triple well structure is formed deep n-well under the light p-well using MeV ion implantation. MeV P implanted deep n-well was observed to show greatly improved characteristics of electrical isolation and soft error. Junction leakage current, however, showed a critical behavior as a function of implantation and annealing conditions. {311} defects were observed to be responsible for the leakage current. {311} defects were generated near the R$\_$p/ (Projected range) region and grown upward to the surface during annealing. This is study on the defect behavior in device region as a function of implantation and annealing conditions.

• 한국재료학회지
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• 제11권1호
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• pp.55-60
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• 2001

고 에너지 (1.5 MeV) 이온 주입된 Boron의 농도와 silicon 기판의 초기 산소 농도의 변화에 따라 silicon기판에 형성된 결정 결함 및 금속 불순물의 Gettering 효율에 대하여 DLTS(Deep Level Transient Spectroscopy), SIMS(Secondary ion Mass Spectroscopy), BMD(Bulk Micro-Defect) analysis 및 TEM (Transmission Electron Microscopy)을 이용하여 연구하였다. 이온 주입 전후의 DLTS 결과를 확산로 및 RTA를 이용한 열처리 전후의 DLTS 결과와 비교할 때 이온 주입 전 시편에서 볼 수 있는 공공에 의한 깊은 준위는 열처리 온도의 증가에 따라 금속 불순물과 관련된 깊은 준위로 천이함을 알 수 있다. 또한 고온 열처리의 경우, 초기 산소 농도가 높을수록 깊은 준위의 농도가 감소함을 볼 때 초기 산소 농도가 높을 수록 gettering 효율 측면에서 유리한 것으로 사료된다

• 한국전기전자재료학회논문지
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• 제16권3호
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• pp.175-180
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• 2003

As the integrated circuit device shrinks to the deep submicron regime, the ion implantation process with high ion dose has been attracted beyond the conventional ion implantation technology. In particular, for the case of boron ion implantation with low energy and high dose, the stabilization and throughput of semiconductor chip manufacturing are decreasing because of trouble due to the machine conditions and beam turning of ion implanter system. In this paper, we focused to the improved characteristics of processing conditions of ion implantation equipment through the modified deceleration mode. Thus, our modified recipe with low energy and high ion dose can be directly apply in the semiconductor manufacturing process without any degradation of stability and throughput.

• Journal of Korean Neurosurgical Society
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• 제58권4호
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• pp.368-372
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• 2015

Objective : The occurrence of acute cerebral infection following deep brain stimulation (DBS) is currently being reported with elevation of C-reactive protein (CRP) level. The aim of the present study was to establish normal range of the magnitude and time-course of CRP increases following routine DBS procedures in the absence of clinical and laboratory signs of infection. Methods : A retrospective evaluation of serial changes of plasma CRP levels in 46 patients undergoing bilateral, two-staged DBS was performed. Because DBS was performed as a two-staged procedure involving; implantation of lead and internal pulse generator (IPG), CRP was measured preoperatively and postoperatively every 2 days until normalization of CRP (post-lead implantation day 2 and 4, post-IPG implantation day 2, 4, and 6). Results : Compared with preoperative CRP levels ($0.12{\pm}0.17mg/dL$, n=46), mean CRP levels were significantly elevated after lead insertion day 2 and 4 ($1.68{\pm}1.83mg/dL$, n=46 and $0.76{\pm}0.38mg/dL$, n=16, respectively, p<0.001). The mean CRP levels at post-lead implantation day 2 were further elevated at post-IPG implantation day 2 ($3.41{\pm}2.56mg/dL$, n=46, respectively, p<0.01). This elevation in post-IPG day 2 rapidly declined in day 4 ($1.24{\pm}1.29mg/dL$, n=46, p<0.05) and normalized to preoperative value at day 6 ($0.42{\pm}0.33mg/dL$, n=46, p>0.05). Mean CRP levels after IPG implantation were significantly higher in patients whose IPGs were implanted at post-lead day 3 than those at post-lead day 5-6 ($3.99{\pm}2.80mg/dL$, n=30, and $2.31{\pm}1.56mg/dL$, n=16, respectively, p<0.05). However, there was no difference in post-IPG day 2 and 4 between them (p>0.05). Conclusion : The mean postoperative CRP levels were highest on post-IPG insertion day 2 and decreased rapidly, returning to the normal range on post-IPG implantation day 6. The duration of post-lead implantation period influenced the magnitude of CRP elevation at post-IPG insertion day 2. Information about the normal response of CRP following DBS could help to avoid unnecessary diagnostic and therapeutic efforts.

• 전자공학회논문지D
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• 제35D권9호
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• pp.54-61
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• 1998

Deep submicron급 CMOS디바이스에서 래치업 면역특성을 향상시키기 위한 새로운 Triple well구조를 제안하였다. Triple well에서 이온주입 에너지와 도즈량 변화에 따른 최적인 래치업 면역을 위한 공정조건을 확립하고 이것을 기존의 Twin well구조와 비교분석하였다. 공정은 공정시뮬레이터인 ATHENA로 소자를 제작하여 도핑프로파일과 구조를 해석하고 래치업 특성은 소자시뮬레이터인 ATLAS를 사용하였다. Triple well과 Twin well의 구조에서 공정상의 차이가 도핑프로파일에 미치는 영향과 프로파일 형태가 래치업 특성에 미치는 영향을 규명하였다. Triple well구조에서 p-well이온주입에너지 2.5MeV, 도즈량 1×10/sup 14/[cm/sup -2/]일 때 트리거 전류가 2.5[mA/${\mu}{m}$]로 매우 큰 래치업 면역특성을 얻었다.