• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2011년도 춘계학술대회 및 Fine pattern PCB 표면 처리 기술 워크샵
• /
• pp.139-139
• /
• 2011

DC magnetron sputtering과 DC pulsed magnetron sputtering을 이용하여 공정 압력별, $O_2$ 분압별, 온도등의 증착조건에 따른 IGZO 박막의 특성을 조사하였다. Working pressure 따른 deposition rate 측정한 결과 동일 파워 적용 시 DC magnetron sputtering 대비하여 DC pulsed magnetron sputtering 은 약 84% 수준에 머물렀으며, IGZO 박막 내에 $O_2$의 분압비가 증가함에 따라 투과도는 단파장 영역에서 장파장 영역으로 갈수록 상승 경향을 보였다. 캐리어 농도와 이동도 등 전기적 특성도 증가하는 경향을 보였다. 온도에 따른 전기적 특성을 비교 해 본 결과 상온과 $150^{\circ}C$ 영역에서는 유의차가 없었으며, DC pulsed magnetron sputtering의 경우 $50^{\circ}C$ 영역에서 변곡점이 형성됨을 알수 있었다.

• 한국결정성장학회지
• /
• 제14권6호
• /
• pp.277-280
• /
• 2004

p형 ZnO 에피 박막을 사파이어 기판의 (0001)면 상에 RF-DC magnet co-sputtering 법으로 성장시켰다. 약 120nm두께의 단결정상 박막을 성공적으로 얻어내었다. p형 ZnO를 만들기 위해서 Al 금속 타켓을 이용하여 DC 스퍼터링으로 $400^{\circ}C$와 $600^{\circ}C$에서 ZnO를 rf magnetron sputtering으로 증착하고, 동시에 Al의 doping을 행하였으며, 성장된 박막의 결정성과 광특성에 대하여 고찰하였다.

• Corrosion Science and Technology
• /
• 제22권6호
• /
• pp.393-398
• /
• 2023

Properties of hafnium nitride (HfN) coatings are affected by deposition conditions, most often by the sputtering technique. Appropriate use of different magnetron sputtering modes allows control of the structural development of the film, thereby enabling adjustment of its properties. This study compared properties of HfN coatings deposited by direct current magnetron sputtering (dcMS), mid-frequency direct current magnetron sputtering (mfMS), and inductively coupled plasma-assisted magnetron sputtering (ICPMS) systems. The microstructure, crystalline, and mechanical properties of these HfN coatings were investigated by field emission electron microscopy, X-ray diffraction, atomic force microscopy, and nanoindentation measurements. HfN coatings deposited using ICPMS showed smooth and highly dense microstructures, whereas those deposited by dcMS showed rough and columnar structures. Crystalline structures of HfN coatings deposited using ICPMS showed a single δ-HfN phase, whereas those deposited using dcMS and mfMS showed a mixed δ-HfN and HfN_0.4 phases. Their performance were increased in the order of dcMS < mfMS < ICPMS, with ICPMS achieving a value of 47.0 GPa, surpassing previously reported results.

• The Korean Journal of Ceramics
• /
• 제7권1호
• /
• pp.26-29
• /
• 2001

Indium tin oxide (ITO) films were deposited on glass substrates at $300^{\circ}C$ in oxygen/argon mixtures by RF-enhanced DC-magnetron sputtering and were compared to those by conventional DC magnetron sputtering. The RF enhancement was performed using a coil above an ITO target. X-ray diffraction measurements revealed that RF-enhanced plasma affected the preferred orientation and the crystallinity of the films. The resistivity of the films prepared by RF-enhanced DC-magnetron sputtering was almost constant at oxygen content lower than 0.3% and then increased sharply with increasing oxygen content. However the resistivity of the films by conventional sputtering has little dependence on the oxygen content. Those results can be explained on the basis of the incorporation of oxygen into the ITO films due to the RF enhancement.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
• /
• pp.256-256
• /
• 2013

기존에 사용되어 오던 DCMS (DC magnetron sputtering)과 HPPMS (high-power pulsed magnetron sputtering)에 비해 MPP를 이용한 magnetron sputtering은 높은 증착률을 가지고 있으며, 증착된 박막의 특성도 우수하다고 알려져 있다. 본 연구에서는 최대 출력 700 V, 12.5 A, 100 kHz)의 사양을 가지는 DC, pulse DC, modulated pulsed DC의 세 종류로 변환이 가능한 Power supply를 제작하여 Cr 박막을 증착하였다. 증착시 혼합기체 Ar/$N_2$를 사용하였으며, 박막의 특성을 sputtering power 종류별로 비교 평가하였다. 실험 결과얻어진 박막을 SEM과 XRD를 이용하여 분석하였다.

• 한국세라믹학회지
• /
• 제33권4호
• /
• pp.441-447
• /
• 1996

Sb doped SnO2(ATO:Antinomy doped Tin Oxide) thin films were prepared by a DC magnetron spttuering method using oxide target and the deposition characteristics were investigated. The experimental conditions are as follows :Ar flow rate : 100 sccm oxygen flow rates ; 0-100 sccm deposition temperature ; 250 -40$0^{\circ}C$ DC sputter powder ; 150~550 W and sputtering pressure ; ; 2~7 mTorr. Deposition rate greatly depends not on the deposition temperature but on the reaction pressure oxygen flow rate and sputter power,. when the sputter powder is low ATO thin films with (110) preferred orientation are deposited. And when the sputter power is high (110) prefered orientation appeares with decreasing of oxygen flow rate and increasing of suputte-ring pressure.

• 한국전기전자재료학회논문지
• /
• 제13권8호
• /
• pp.704-710
• /
• 2000

Metal electrode materials for plasma display panel should have low electrical resistivity in order to maintain stable gas discharge and have fast response time. They should also hae good film uniformity adhesion and thermal stability. In this study Cr/Cu/Cr metal electrode structure is formed by DC magnetron sputtering. Cr and Cu films were deposited on ITO coated glasses with various DC power density and main pressures as the major parameters. After metal electrodes were formed a heat treatment was followed at 55$0^{\circ}C$ for 20 min in a vacuum furnace. The intrinsic stress of the sputtered Cr film passed a tensile stress maximum decreased and then became compressive with further increasing DC power density. Also with increasing the main pressure stress turned from compression to tension. After heat the treatment the electrical resistivity of the sputtered Cu film of 2${\mu}{\textrm}{m}$ in thickness prepared at 1 motor with the applied power density of 3.70 W/cm$^2$was 2.68 $\mu$$\Omega$.cm With increasing the main pressure the DC magnetron sputtered Cu film became more open structure. The heat treatment decreased the surface roughness of the sputtered Cr/Cu/Cr metal electrodes.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
• /
• pp.842-845
• /
• 2002

We report on the properties of ITO thin films prepared by dc and pulse magnetron sputtering at low temperature. The electrical, optical, and surface properties of the films prepared by dc and pulse magnetron sputtering were compared. We discuss the role the pulse power plays in determining ITO thin film properties that are important in flat panel applications.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2001년도 춘계학술발표회 초록집
• /
• pp.61-62
• /
• 2001

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 1999년도 춘계학술발표강연 및 눈문개요집
• /
• pp.67-67
• /
• 1999