• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.37.1-37.1
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• 2010

The multi-component olivine cathode material, $LiMn_{1/3}Fe_{1/3}Co_{1/3}PO_4$, was prepared via a novel coprecipitation method of the mixed transition metal oxalate, $Mn_{1/3}Fe_{1/3}Co_{1/3}(C_2O_4){\cdot}2H_2O$. The stoichiometric ratio and distribution of transition metals in the oxalate, therefore, in the olivine product, was affected sensitively by the environments in the coprecipitation process, while they are the important factors in determining the electrochemical property of electrode materials with multiple transition metals. The effect of the pH, atmosphere, temperature, and aging time was investigated thoroughly with respect to the atomic ratio of transition metals, phase purity, and morphology of the mixed transition metal oxalate. The electrochemical activity of each transition metal in the olivine synthesized through this method clearly was enhanced as indicated in the cyclic voltammetry (CV) and galvanostatic charge/discharge measurement. Three distinctive contributions from Mn, Fe, and Co redox couples were detected reversibly in multiple charge and discharge processes. The first discharge capacity at the C/5 rate was $140.5\;mAh\;g^{-1}$ with good cycle retention. The rate capability test showed that the high capacity still is retained even at the 4C and 6C rates with 102 and $81\;mAh\;g^{-1}$, respectively.

• Journal of Applied Biological Chemistry
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• 제62권3호
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• pp.305-313
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• 2019

남성의 클라이맥스 증후군, 남성갱년기, 또는 테스토스테론 결핍 증후군은 고령화시대 남성노인들의 건강에 새로운 문제 중 하나이다. 이 현상은 나이가 들수록 남성에게서 나타나는 자연현상으로 혈중 테스토스테론 수치의 감소와 신체적 및 정신적 활동의 현저한 감소를 특징으로 한다. 이 연구의 목적은 해면체내 일산화질소(NO)와 혈액 내 남성호르몬의 수준을 비교하여 포공영(Taraxacum coreanum) 열수 추출물의 효과를 조사하였다. 포공영 추출물은 생체외 및 생체내에서 NO 생산량을 용량 의존적으로 증가시켰다. 포고영 추출물을 4 주간 섭취 한 나이든 쥐(22주)에서 다이하이드로 테스토스테론과 17-하이드록시 스테로이드 탈수소효소의 수준과 신경 인산화 질소 합성효소와 cGMP의 양은 유의하게 증가했다. 그러나 프로스타글란딘$E_2$, 테스토스테론 및 성 호르몬 결합 글로불린 수치는 모든 군에서 차이가 없었다. 또한, 총 정자 수 및 운동성 정자 수 또한 유의한 차이가 없었다. 전반적으로, 이러한 결과는 NO, cGMP 및 유리 테스토스테론을 향상시키기 위한 안전하고 효과적인 천연물질로서 Taraxacum coreanum 추출물의 가능성을 시사한다.

• 성인간호학회지
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• 제12권4호
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• pp.690-705
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• 2000

This ethnography was based on Kleinman's explanatory model of a health care system. It is conducted to make thick discription of illness conception of the elderly in a sociocultural context. The basic assumptions were as follows. 1) A health care system is a cultural system, and as with any other cultural system, it is a system of symbolic meanings anchored in a particular arrangement of social institutions and patterns of interpersonal relationships; 2) In all societies health care activities are more or less interrelated. Therefore, they need to be in a holistic manner as socially organized responses to disease that constitute a special cultural system; health care system; 3) Health and illness experiences are the natural process of disease. Individuals who recognized a for state of health, their family, neighbors, and communities define the state, search for causes of the health problems, and response to it. According by, they proceed to search for healing stratagies. So, understanding of the illness experience is the starting point for health care. The study participants were 12 elders aged 60 or more. The fieldwork was conducted in an agricultural clan village of Namwon city. The data collection and analysis were cyclic, from descriptive observation, domain analysis, focused observation, taxanomic analysis, selected observation, componential analysis, and finally cultural themes were all analysed. Proxemic and text analysis techniques were used according to the characteristics of the data. The data of sociocultural context and descriptive data were collected from 1990 to 1992. Informations on illness concepts were collected during 1994 using focused observation. Data confirming and contrast observations were conducted from 1997 and 1999. Illness concepts of the elderly were taxonomized supernatural cause, non-supernatural cause, immediate cause, and ultimate cause. The supernatural ones were ancestors, god of home, god of village, and ghost such as 'sal(evil force of dead man)' and 'gagqui(ghost of begger)'. The non-supernatural ones were Ki, natural phenomenones, natural objects, foods, human and human behaviors. Immediate ones were insufficiency and overflows, discretion and consolidation, disorder and out of order, cloudness and contamination, and fluctuation and stagnation of supernatural cause and non-supernatural ones. Ultimate causes were intrusion and loss of supernatural and nonsupernatural ones. The cultural themes of illness concepts of the elderly are: 1) illness concepts are not based on causality principle, but on reciprocal principle; 2) illness concepts are affected by social level and charicteristics of the patients; 3) the causes of disease are recognized as imposed both positive and negative effects on health based on interpretation of the indiviuals; 4) illness concepts reflects on principles of everyday life of the society members such as hierachial structure and group cohesiveness; 5) illness concepts are ruled on principle of reciprocity and spread; 6) illness concepts are interrelated with physical environment of the participants. It can be concluded that the illness concepts of the elderly in a traditional clan village are a component of health care system as a cultural system based on these results. The these results can be a useful basis for gerontological nursing practice and education.

• 동아시아식생활학회지
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• 제20권5호
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• pp.735-742
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• 2010

식품 중 잠재적 위험 물질로 작용할 수 있는 BAs의 신속 검출을 위하여 전기전도성이 우수하다고 알려진 MWCNTs의 개질, 작업 전극의 제작, 효소반응기 제작을 통해 바이오센서 시스템을 구성하고 hydrogen peroxide와 주요 BAs 물질에 대한 감응도를 측정하였다. MWCTS의 성질을 향상시키기 위해 아민기를 도입하였고, 이를 FT-IR 스펙트럼을 통해 확인하였다. 아민기를 도입한 MWCNTs를 GCE에 고착시키고 PB 막을 입힌 후 cyclic voltammetry 반응을 비교한 결과, PB/MWCNT-$NH_2$/GCE 전극이 GCE에 비해 산화 전류는 8배 이상, 전체 전류는 25배 이상의 높은 전류 흐름을 보였으며, 미세한 전류 흐름의 측정도 용이해진 것으로 나타났다. 또한, carrier buffer의 pH를 달리하여 제작된 전극의 감응 전류를 비교한 결과, pH 7.0에서 전류의 감응도가 가장 높게 측정되었다. 과산화수소를 주입하여 전극의 성능의 검증한 결과, $0.5 {\mu}M{\sim}100 {\mu}M$ 범위에서 선형관계를 보였으며, 검출 한계는 $0.5{\mu}M$로 측정되었다. Histamine 표준 용액 주입 시 $1{\mu}M{\sim}100{\mu}M$ 범위에서 선형 관계를 나타내었고, tyramine은 histamine에 비해 약 95%, 2-phenylethylamine과 tryptamine은 histamine에 비해 각각 75%, 70% 수준의 감응도를 이용하여 구성된 바이오센서 시스템이 낮은 검출 한계와 높은 수준의 반응 감도를 나타내어 BAs를 측정하는데 좋은 장치임이 확인되었다.