• Elastomers and Composites
• /
• v.48 no.2
• /
• pp.133-140
• /
• 2013

Carbon fiber reinforced polymer (CFRP) composites consist of carbon fibers in a polymer matrix. Recently, CFRP composites having high thermal stability and low outgassing are finding their use in high performance materials for aerospace and electronics applications under high temperature and high vacuum conditions. Cyanate ester resin is one of the most suitable matrix resins for this purpose. In this study, proper combination of cyanate ester and catalyst, curing behavior, and cure cycle were determined by chemorheology. Optimum condition was found to be catalyst content of 100 ppm and curing temperature of $150^{\circ}C$. Thermal stability and outgassing of cured resin composition were analyzed and the results showed thermal decomposition temperature of $385^{\circ}C$ and total mass loss of 0.29%. The CFRP prepregs and subsequent composites were fabricated by predetermined resin composition and the cure condition. Tensile moduli of the composites were compared with theoretical models and the results were very consistent.

• Composites Research
• /
• v.36 no.5
• /
• pp.335-341
• /
• 2023

We proposed a high-temperature circuit-analog radar absorbing structures (CA-RAS), and evaluated radar absorption performance and tensile properties in 350℃ and a hot-wet environment. The CA-RAS was implemented with a glass/cyanate ester composites and a square resistive pattern layer, and reflection loss was measured by 350℃ and after exposure of hot-wet condition using free space measurement. And the tensile strength at 350℃ and after exposure of hot-wet condition was measured according to the ASTM D638. The proposed CA-RAS showed a 4 GHz of -dB bandwidth and -20 dB of a peak value at 350℃. In addition, there was no deterioration in absorption performance after exposure to a hot-wet condition. The tensile strength value of more than 95% compared to the strength of the glass/cyanate ester composite was confirmed at 350℃ and after exposure of hot-wet condition. Through this, the applicability of CA-RAS proposed in this study was confirmed as a load bearing structure for stealth weapon exposed to high temperature and hot-wet environment.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2004.10a
• /
• pp.228-231
• /
• 2004

The optical bench was designed using composite material, M40J/Cyanate Ester. Mechanical tests, thermal tests were carried out for M40J and structural vibration FEM analysis was performed. From the experimental results, the material properties of M40J/Cyanate Ester were obtained in longitudinal and transverse directions. By applying the properties into FEM vibration analysis, a proper stacking sequence was proposed for the laminated facesheets, so that natural frequency of the platform structure satisfy the design specification.

• Polymer(Korea)
• /
• v.31 no.6
• /
• pp.474-478
• /
• 2007

Polymer substrate materials with low dielectric loss were obtained by fabricating the composite using dicyclopentadienyl bisphenol cyanate ester oligomer and polyphenylene ether (PPE). From the analysis of the curing reaction of oligomer and catalyst, it was observed that the optimum amount of catalyst was 0.02 phr of Zn content. It was applied to the fabrication of polymer composite. By changing oligomer/PPE weight ratio, the peel strength and the gel content of the fabricated composites were measured, and then, the dielectric constant and the dissipation factor were measured in the GHz frequency range. The amount of PPE affected the peel strength and the dielectric properties of composites. However, the amount of catalyst did not affect them at all. Resulting from all experiments, we obtained polymer composite laminates haying the peel strength of above 1 kN/m and the low dissipation factor of 0.004 at 1 GHz.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.02a
• /
• pp.111-111
• /
• 2010

최근 전자 소자의 집적기술은 기존의 2차원에서 System on package (SOP) 개념에 기반을 둔 3차원 집적 기술로 발전 되어가고 있다. 소자의 3차원 실장을 실현시키는 과정에서 세라믹의 여러 유용성이 언급되어져 왔지만, 취성이 매우 크다는 등의 단점이 있었다. 이러한 이유로 연성을 가지는 폴리머와 세라믹을 합성한 복합체 기판에 대하여 많은 연구가 되고 있다. 그러나 세라믹 제작을 위해서는 높은 공정온도가 요구되고 있고 이러한 높은 공정상에서의 온도는 3차원 실장에 있어서 문제점이 되고 있다. 이러한 문제점을 극복하기 위하여 상온에서 치밀한 세라믹 후막을 제작할 수 있는 공정인 Aerosol Deposition Method (ADM)방법으로 세라믹-폴리머 후막의 제조를 시도하였다. 일반적으로 ADM은 수백 나노의 출발 파우더를 사용하여 치밀한 세라믹 막을 형성하는데 사용된다. 본 연구에서는 ADM으로 100 nm미만의 나노 세라믹 파우더를 사용하여 다공성의 세라믹 후막을 제조한 후 resin을 함침시키는 방법으로 세라믹-폴리머 후막의 제조를 시도하였다. 그 결과 운송가스, aerosol 농도 등의 공정조건을 변화시켜 다공성의 $Al_2O_3$ 후막을 제조하였고, 이 다공성 후막은 반투명의 특성을 보이며 고충전율로 형성되었다. 이렇게 제조된 나노 다공성 $Al_2O_3$ 후막에 cyanate ester resin을 함침시키는 방법을 사용하여 $Al_2O_3$-cyanate ester 복합체 후막을 제조하였으며, 이의 비유전율 및 품질계수는 각각 1 MHz에서 6.7, 1000으로 우수한 유전특성을 보임이 확인되었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.22 no.4
• /
• pp.297-302
• /
• 2009

We have successfully fabricated the alumina thick films using inkjet printing processes without a high temperature sintering process. Alumina suspension as dielectric ink was formulated by combining nano-sized alumina powders with an anionic polymer dispersant in formamide/water as co-solvent. The thickness of the printed alumina thick film was measured at around 5 um by field emission scanning electron microscope. The calculated packing density of 68.5 % from the printed alumina thick film was much higher than the same films fabricated by conventional casting or dip coating processes. Q factor of the dielectrics thick film infiltrated with cyanate ester resin was evaluated by impedance analyzer.

• Journal of the Korea Institute of Military Science and Technology
• /
• v.15 no.2
• /
• pp.161-168
• /
• 2012

In this paper, we have experimentally studied on phase characteristics of airborne radome for ELINT directional finding system, because it is difficult to find theoretical solutions for phase error of the radome. Especially, we described the millimeter wave band radome that was fabricated with cyanate-ester material and its thickness was 2mm. We presented the phase error about millimeter band radome. That phase error is about 30 degrees for parallel and perpendicular polarization in the K-Ka band. That is reasonable value for the ELINT directional finding system.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.11a
• /
• pp.80-80
• /
• 2009

$BaTiO_3$ has high permittivity so that has been applied to dielectric and insulator materials in 3D system-level package integration. In order to achieve excellent performance of device, the $BaTiO_3$ layer should be highly dense. In this study, $BaTiO_3$ thick films were prepared by the inkjet printing method using 4 vol.% $BaTiO_3$ colloidal inks and cured at $28^{\circ}C$ for 5 h after infiltration of polymer resin for non-sintered process using 3 vol.% cyanate ester emulsion ink. From the obtained results. packing density was determined to be improved by overlapping rabbit ears which were generated by coffee ring effect. We also calculated the packing densities of the films and correlated these packing densities to the measured permittivity of the films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.207-207
• /
• 2008

Modern industry has focused on processing that produce low- loss dielectric substrates used complex micron-sized devices using tick film technologies such as tape casting and slip casting. However, these processes have inherent disadvantages fabricating high density interconnect with embedded passives for high speed communication electronic devices. Here, we have successfully fabricated porous alumina dielectric layer infiltrated with polymer solution by using inkjet printing process. Alumina suspensions were formulated as dielectric ink that were optimized to use in inkjet process. The layer was confirmed by field emission scanning electron microscope (FE-SEM) for measuring microstructure and volume fraction. In addition, the reaction kinetics and electrical properties were characterized by FT-IR and the impedance analyzer. The volume fraction of alumina in porous dielectric alumina layer is around 70% much higher than that in the conventional process. Furthermore, after infiltration on the dielectric layer using polymer resins such as cyanate ester. Excellent Q factors of the dielectric is about 200 when confirmed by impedance analyzer without any high temperature process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2010.06a
• /
• pp.332-332
• /
• 2010

We have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films withouWe have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films without a high temperature sintering process. In order to remove the coffee ring effect in the ink drop, we have introduced a co-solvent system in order to create Marangoni flow in the ink drop, which leads to the dense packing of ceramic powders on the substrate during inkjet process. The packing density of the Inkjet-printed $Al_2O_3$ films is around 60% (max. 70%) which is very high compared to the value obtained from the same material films by other conventional methods such as film casting, dip coating process, etc. The voids inside the films (which are around 40% of the entire film volume) are filled with the polymer resin (Cyanate ester) by the infiltration process. This resin infiltration is also implemented by the inkjet printing process right after the Ah03 film ink-jetting process. The microstructures of the printed $Al_2O_3$ films are investigated by Scanning Electron Microscope (SEM) to understand the degree of packing density in the printed films. The inkjet-printed $Al_2O_3$ films have been characterized to investigate its thickness and roughness. Quality factor of the printed $Al_2O_3$ film is also measured to be over 300 at 1MHz.