• Title/Summary/Keyword: curing degree

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Influence of Thermal Aging in Change of Crosslink Density and Deformation of Natural Rubber Vulcanizates

  • Choe, Seong Sin
    • Bulletin of the Korean Chemical Society
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    • v.21 no.6
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    • pp.628-634
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    • 2000
  • Crosslink is the most important chemistry in a rubber vulcanizate. Degree and type of crosslinks of the vulcanizate determine its physical properties. Change of crosslink density and deformation of a rubber vulcanizate by thermal aging were studied using natural rubber (NR) vulcanizates with various cure systems (conventional, semi-EV, and EV) and different cure times (under-, optimum-, and overture). All the NR vulcanizates were deformed by the thermal aging at 60-100 $^{\circ}C.$ The higher the aging temperature is, the more degree of the deformation is. The undercured NR vulcanizates after the thermal aging were deformed more than the optimumand overcured ones. The NR vulcanizates with the EV cure system were less deformed than those with the conventional and semi-EV cure systems. The deformation of the NR vulcanizates was found to be due to change of the crosslink density of the vulcanizates. The crosslink densities of all the vulcanizates after the extraction of organic materials were also changed by the thermal ging. The sources to change the crosslink densities of the vulcanizates by the thermal aging were found to be dissociation of the existing sulfur crosslink and the formation of new crosslinks by free sulfur, reaction products of curing agents, and pendent sulfide groups.

A STUDY ON THE FRACTURE TOUGHNESS OF DENTAL COMPOSITE RESINS (치과용 복합레진의 파괴인성에 관한 실험적 연구)

  • Park, Jin-Hoon;Min, Byung-Soon;Choi, Ho-Young;Park, Sang-Jin
    • Restorative Dentistry and Endodontics
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    • v.15 no.2
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    • pp.17-33
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    • 1990
  • The purpose of this study was to evaluate the fracture toughness of dental composite resins and to investigate the filler factor affecting the fracture behaviour on which the degree of fracture toughness depends. Six kinds of commercially available composite resin;, including two of each macrofilled, microfilled, and hybrid type were used for this study, The plane strain fracture toughness ($K_{10}$) was determined by three-point bending test using the single edge notch specimen according to the ASTM-E399. The specimens were fabricated with visible light curing or self curing of each composite resin previously inserted into a metal mold, and three-point bending test was conducted with cross-head speed of 0.1mm/min following a day's storage of the specimens in $37^{\circ}C$ distilled water. The filler volume fractions were determined by the standard ashing test according to the ISO-4049. Acoustic Emission(AE), a nondestructive testing method detecting the elastic wave released from the localized sources In material under a certain stress, was detected during three-point bending test and its analyzed data was compared with, canning electron fractographs of each specimen. The results were as follows : 1. The filler content of composite resin material was found to be highest in the hybrid type followed by the macrofilled type, and the microfilled type. 2. It was found that the value of plane strain fracture toughness of composite resin material was in the range from 0.69 MPa$\sqrt{m}$ to 1 46 MPa$\sqrt{m}$ and highest In the macrofilled type followed by the hybrid type, and the microfilled type. 3. The consequence of Acoustic Emission analysis revealed that the plane strain fracture toughness increased according as the count of Acoustic Emission events increased. 4. The higher the plane strain fracture toughness became, the higher degree of surface roughness and irregularity the fractographs demonstrated.

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On-line Cure Monitoring of Adhesive Joints by Dielectrometry (유전기법을 이용한 접착 조인트의 실시간 경화 모니터링)

  • 권재욱;진우석;이대길
    • Composites Research
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    • v.16 no.4
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    • pp.51-58
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    • 2003
  • Since the reliability of adhesively bonded joints is much dependent on the curing status of thermosetting adhesive, the on-line cure monitoring during the cure of adhesively joints could improve the quality of adhesively bonded joints. In this work, the dielectric method which measures the dissipation factor of the adhesive during the cure of joints and converts it into the degree of cure of the adhesive was devised. The relation between the dissipation factor and the degree of cure of adhesive was investigated, which could eliminate the temperature effect on the dissipation factor that is a strong function of the degree of cure and temperature of adhesive. From the investigation, it was found that the dissipation factor showed a trend similar to the cure rate of the adhesive.

Postharvest Procedures on Storage, Management and Utilization of Sweetpotato (고구마의 수확 후 관리현황과 개선방안)

  • Ahn Young-Sup;Jeong BC;Lee JS;Chung MN;Kim HS
    • Proceedings of the Korean Society of Crop Science Conference
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    • 2004.10a
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    • pp.36-41
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    • 2004
  • Postharvest handling of sweetpotatoes is inevitable procedure for the maintenance, storage, management and utilization of high fresh quality of storage roots. It ranges in degree from simple lifting of roots, carrying them from field to storage house and immediate consumption after cooking, to sophisticated methods of curing, and storage under controlled conditions followed by processing into a high quality food products. Postharvest saleability, quality and nutritional value of roots and the presence or absence in roots of bitter, toxic furanoterpenoid phytoalexins or mycotoxins depends greatly on the degree and types of treatment to which produce is subjected. Climatic and soil conditions before harvest and contamination or attack by microorganisms or insect pests in the field may initiate or enhance subsequent postharvest deterioration. Careless postharvest handling can lead to both quantitative and qualitative losses which may be extremely high in some circumstances. Research has concentrated on the improvement of preharvest conditions to increase yield and lower decrease rates. However, such efforts are wasted unless they go hand in hand with others designed to reduce the high degree of loss associated with careless postharvest handling.

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Improvement of Polyimide/Epoxy Adhesion Strength from the Modification of Polyimide Surface and Epoxy Adhesive (폴리이미드 표면개질과 에폭시접착제 개질을 통한 폴리이미드/에폭시의 접착력 향상)

  • Kim, Seong-Hun;Lee, Dong-U;Jeong, Gyeong-Ho
    • Korean Journal of Materials Research
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    • v.9 no.1
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    • pp.65-72
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    • 1999
  • In order to minimize flexible printed circuit(FPC), which is used in computer, communication, medical facility, aviation space industry, it is required to improve the interfacial adhesion of polymide/epoxy or polyimide/polyimide consists of FPC. In this study, it was considered to improve the adhesion strength of polyimide/epoxy joint by introducing functional group on polyimide film and improving mechanical property of epoxy. Functional group on polyimide film was introduced by changing polyimide film surface to polyamic acid in KOH aqueous solution. The optimum conditions for surface modification were the concentration of 1M KOH and treatment time of 5min. Also, the optimum adhesion strength of polyimide/epoxy joint was obtained using rubber modified epoxy and polyamic acid as a base resin and curing agent of epoxy adhesive, respectively. The degree of surface modification of polyimide film examined with contact angle measurement of FTIR, thus modification of polyimide to polyamic acid was identified. Fracture surface of plymide/epoxy joint was analyzed by scanning electron microscopy, and modified polyamic acid reimidezed to polymide as increasing curing temperature.

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Cure simulation in LED silicone lense using dynamic reaction kinetics method (승온 반응속도식을 이용한 LED용 실리콘 렌즈의 경화공정해석)

  • Song, Min-Jae;Hong, Seok-Kwan;Park, Jeong-Yeon;Lee, Jeong-Won;Kim, Heung-Kyu
    • Design & Manufacturing
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    • v.8 no.2
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    • pp.46-49
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    • 2014
  • Silicone is recently used for LED chip lense due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for curing process during silicone molding. For analysis of curing process, a dynamic cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the slow cure reduced abrupt reaction heat and it was predicted decrease of the residual stress.

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Finite Element Analysis of Residual Stress Evolution during Cure Process of Silicone Resin for High-power LED Encapsulant (고출력 LED 인캡슐런트용 실리콘 레진의 경화공정중 잔류응력 발달에 대한 유한요소해석)

  • Song, Min-Jae;Kim, Heung-Kyu;Kang, Jeong-Jin;Kim, Kwon-Hee
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.2
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    • pp.219-225
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    • 2011
  • Silicone resin is recently used as encapsulant for high-power LED module due to its excellent thermal and optical properties. In the present investigation, finite element analysis of cure process was attempted to examine residual stress evolution behavior during silicone resin cure process which is composed of chemical curing and post-cooling. To model chemical curing of silicone, a cure kinetics equation was evaluated based on the measurement by differential scanning calorimeter. The evolutions of elastic modulus and chemical shrinkage during cure process were assumed as a function of the degree of cure to examine their effect on residual stress evolution. Finite element predictions showed how residual stress in cured silicone resin can be affected by elastic modulus and chemical shrinkage behavior. Finite element analysis is supposed to be utilized to select appropriate silicone resin or to design optimum cure process which brings about a minimum residual stress in encapsulant silicone resin.

A Hydration based Model for Chloride Penetration into Slag blended High Performance Concrete

  • Shin, Ki-Su;Park, Ki-Bong;Wang, Xiao-Yong
    • Architectural research
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    • v.20 no.1
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    • pp.27-34
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    • 2018
  • To improve the chloride ingress resistance of concrete, slag is widely used as a mineral admixture in concrete industry. And currently, most of experimental investigations about non steady state diffusion tests of chloride penetration are started after four weeks standard curing of concrete. For slag blended concrete, during submerged chloride penetration tests periods, binder reaction proceeds continuously, and chloride diffusivity decreases. However, so far the dependence of chloride ingress on curing ages are not detailed considered. To address this disadvantage, this paper shows a numerical procedure to analyze simultaneously binder hydration reactions and chloride ion penetration process. First, using a slag blended cement hydration model, degree of reactions of binders, combined water, and capillary porosity of hardening blended concrete are determined. Second, the dependences of chloride diffusivity on capillary porosity of slag blended concrete are clarified. Third, by considering time dependent chloride diffusivity and surface chloride content, chloride penetration profiles in hardening concrete are calculated. The proposed prediction model is verified through chloride immersion penetration test results of concrete with different water to binder ratios and slag contents.

Influence of the Cure Systems on Long Time Thermal Aging Behaviors of NR Composites

  • Choi, Sung-Seen;Kim, Jong-Chul;Lee, Seung-Goo;Joo, Yong-L.
    • Macromolecular Research
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    • v.16 no.6
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    • pp.561-566
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    • 2008
  • NR composites with different curing systems were aged thermally at 60, 70, 80, and $90^{\circ}C$ for 2-185 days in a convection oven, and the changes in the crosslink density were investigated as a function of the accelerated thermal aging. The overall crosslink densities increased with increasing aging time irrespective of the aging temperatures and curing systems. The changes in crosslink density were enhanced by increasing the aging temperature. The degree of the increased crosslink density was in the following order: "the conventional cure system > the semi-EV system > the EV system". For short term thermal aging, the change in crosslink density with the aging time was complicated, particularly for low temperature aging. The activation energies of the change in crosslink density with thermal aging using the conventional and semi-EV cure systems increased and then remained relatively constant with increasing aging time, whereas that of the specimen with an EV cure system tended to increase linearly. The experimental results were explained by the dissociation of the existing polysulfidic linkages and the formation of new cross links through the crosslinking-related chemicals remaining in the sample.

Development of a Functional Fixator System for Bone Deformity Near Joints

  • Chun, Keyoung-Jin;Lee, Ho-Jung
    • Journal of Mechanical Science and Technology
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    • v.20 no.2
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    • pp.234-241
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    • 2006
  • A functional external fixator system for bone deformity near the joints using worm gear was developed for curing the angle difference in fracture bones while the lengthening bar was developed for curing the differences in length, also in fracture bones. Both experiments and FE analysis were performed to compare the elastic stiffness in several loading modes and to improve the functional external fixator system for bone deformity near joints. The FE model using compressive and bending FE analysis was applied due to the angle differentiations. The results indicate that compressive stiffness value in the experiment was 175.43N/mm, bending stiffness value in the experiment was 259.74 N/mm, compressive stiffness value in the FEA was 188.67 N/mm, and bending stiffness value in the FEA was 285.71 N/mm. Errors between experiments and FEA were less than $10\%$ in both the 'compressive stiffness and the bending stiffness. The maximum stress (157 MPa) applied to the angle of the clamp was lower than the yield stress (176.4 MPa) of SUS316L. The degree of stiffness in both axial compression and bending of the new fixator are about 2 times greater than other products, with the exception of EBI (2003).