• Composites Research
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• 제14권1호
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• pp.30-38
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• 2001

복합재료는 우수한 비강성, 비강도 특성 때문에 기존의 항공우주산업뿐만 아니라 로봇 팔. 공작기계 등에 널리 사용되고 있다. 복합재료 경화중의 온라인 모니터링기법은 생산성 향상 및 품질의 신뢰성 향상을 위하여 매우 중요한 연구분야로 대두되고 있다. 본 논문에서는 휘스톤 브리지식 유전회로를 설계하고 제작하였다. 또한 고온 경화 복합재료에 적용할 수 있는 고온 유전센서를 개발하여 그 성능을 평가하였다. 유한요소해석을 이용하여 유전 센서에 작용하는 열 잔류응력을 계산하였으며, 고온분위기 하에서 유전센서의 유전특성을 평가하였다. 이상에서 개발된 유전회로와 고온 유전센서를 이용하여 BMI(Blsmaleimlde) 수지의 경화모니터링을 수행하였다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2001년도 춘계학술발표대회 논문집
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• pp.219-223
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• 2001

The on-line cure monitoring during the cure process of composite materials is important for better quality and productivity. The dielectric sensor for cure monitoring consists of base film and electrodes. Because the characteristic of dielectric sensor for the on-line cure monitoring is dependent on the base material, width and number of electrode, etc, the dielectric sensor should be standardized. And the selection of base film material of sensor is very important. In order to prevent the measuring errors generated from the increase of environmental temperature, the base film material should have stable dielectric constant with respect to environmental temperature. In this study, the newly developed dielectric sensor for cure monitoring was designed and the dissipation factor which is function of degree of cure was measured using the sensor. The relationship between the dissipation factor and degree of cure with respect to environmental temperature was investigated.

• 소성∙가공
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• 제21권2호
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• pp.101-106
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• 2012

Generally, rapid cure reaction of LED encapsulation silicone resin causes serious defects in cured resin products such as warpage, residual bubbles, and reduced wettablility. In order to prevent residual bubbles in silicone resin, the step cure process was examined in the present paper. Three kinds of step cure processes were applied, and bubble-free phenomenon was observed. Most of the bubbles were removed under $70^{\circ}C$, the minimum temperature for activating cure reaction. In addition, degree of cure(DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded that maintaining cure temperature which provide a DOC under 0.5~0.6 effectively reduces residual bubbles.

• 폴리머
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• 제38권2호
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• pp.171-179
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• 2014

우수한 성능을 지닌 대형 구조의 섬유강화 고분자(FRP) 복합재료 제품을 제조하기 위해 저온 경화형 프리프레그 개발이 활발히 진행되고 있다. 본 연구에서는 저온 경화형 프리프레그 제조에 적합한 매트릭스 수지를 확보하기 위하여 에폭시 수지, 경화제, 경화 촉진제로 구성된 저온 경화형 에폭시 수지 조성물의 경화거동 및 화학유변학을 고찰하였다. 경화반응 특성은 시차주사열량분석법과 유변물성측정법을 활용하여 승온 및 등온 조건에서 분석하였다. 연구 결과 매트릭스 수지로 제안된 저온 경화형 에폭시 수지 조성물은 $80^{\circ}C$에서 3시간에 경화시킬 수 있었고, 80과 $90^{\circ}C$에서의 젤화 시간은 각각 120분과 20분인 것으로 나타났다. 저온 경화형 수지를 경화시킨 수지 경화물의 열적, 기계적 물성은 고온 경화형 수지 경화물의 물성과 거의 동등하였다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 추계학술발표대회 논문집
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• pp.22-28
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• 2000

The fiber reinforced composite materials is widely used in aircraft, space structures and robot arms because of high specific strength and high specific modulus. The on-line cure monitoring during the cure process of the composite materials has become an important research area for the better quality and productivity. In this paper, the dielectric circuit of the wheatstone bridge type for measuring the dissipation factor was designed and manufactured. Also, the dielectric sensor for the cure monitoring of the high temperature composites was developed. The residual thermal stresses of the dielectric sensor were analyzed by the finite element method and its dielectric characteristics under high temperature were evaluated. The on-line cure monitoring of the BMI resin was performed using the wheatstone bridge type circuit and developed high-temperature dielectric sensor.

• 접착 및 계면
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• 제5권2호
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• pp.1-7
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• 2004

A novel carboxyl terminated butadiene-acrylonitrile (CTBN) modified, low temperature cure epoxy film adhesive was developed in this paper. It can be cured at as low as $75^{\circ}C$ for 4 hours with a pressure of 0.1MPa. After post cure at $120^{\circ}C$ for 2 hours, the bonding strengths of Phosphoric Acid Anodizing(PAA) surface treated aluminum adherend were similar to those of structural film adhesives curing at $120^{\circ}C$. It is suitable to bond both metal/composite laminate-to-laminate and laminate to honeycomb structure.

• 연구논문집
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• 통권29호
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• pp.151-162
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• 1999

In general, manufacturing processes of thermosetting composites consist of mold filling and resin cure. The important parameters used in modeling and designing mold filling are the permeability of the fibrous preform and the viscosity of the resin. To consolidate a composite, resin cure or chemical reaction plays an essential role. Cure kinetics. Therefore, is necessary to quantify the extent of chemical reaction or degree of cure. It is also important to predict resin viscosity which can change due to chemical reaction during mold filling. There exists a heat transfer between the mold and the composite during mold filling and resin cure. Cure kinetics is also used to predict a temperature profile inside composite. In this study, a new scheme which can determine cure kinetics from dynamic temperature scaning was proposed. The method was applied to epoxy resin system and was verified by comparing measurements and predictions.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집A
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• pp.797-803
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• 2001

The on-line cure monitoring of fiber reinforced thermosetting resin matrix composite material was performed for the better quality and productivity during manufacturing. Since the dissipation factor measured by dielectrometry method is dependent on the degree of cure and temperature of resin, in this study, a new method to obtain the degree of cure during on-line cure monitoring for glass/polyester composites was developed by employing a combination function of the temperature and the dissipation factor. Two sensor signals from a K-type thermocouple and an interdigitated dielectric sensor were processed during curing process under various cure cycles. The DSC (Differential Scanning Calorimetry) data was also used for the reference of degree of cure.

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2006년 창립20주년기념 정기학술대회 및 국제워크샵
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• pp.233-236
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• 2006

A dilatometer was used to investigate the effect of cure conditions and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with number of cyclic cure. Post cured samples outside the mold led to less shrinkage compared with sample in the mold. And sample containing kaolin filler showed less shrinkage than unfilled sample.

• 한국해양공학회지
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• 제23권4호
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• pp.1-5
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• 2009

A dilatometer was used to investigate the effect of cure conditions, mold types and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with the number of cyclic cures. Post cured samples outside the mold led to less shrinkage compared with samples in the mold. Sample cured in a silicon mold represented less shrinkage than sample cured in an aluminum mold. Sample containing kaolin filler showed less shrinkage than unfilled sample.