• Title/Summary/Keyword: cu base

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Sythesis and Characterization of Transition Metal(II) Complexes with $NOTDH_2$ Schiff Base ($NOTDH_2$ Schiff Base를 가진 전이금속(II) 착물의 합성과 구조분석)

  • Oh, Jeong-Geun;Choi, Yong-Kook
    • Analytical Science and Technology
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    • v.12 no.6
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    • pp.498-503
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    • 1999
  • Co(II), Ni(II), and Cu(II) complexes with tetradentate schiff base-$NOTDH_2$, were synthesized. The structures of these complexes were characterized by elemental analysis, IR, UV-visible, NMR spectra, and thermogravimetric analysis. The mole ratio of schiff base($NOTDH_2$) to the metal(II) at complexes was found to be 1:1. Cu(II) complexes were four-coordinated configuration, while Co(II) and Ni(II) complexes were hexacoordinated configuration containing two water molecules and all complexes were non-ionic compounds.

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Characteristics of Brazed Joint of Sintered Bronze/steel Using Ag-Cu-Zn Type Filler Materials (Ag-Cu-Zn-Cd 계 용가재를 이용한 Bronze 소결체/강의 브레이징 접합부 특성 평가)

  • 이정훈;이창희
    • Journal of Welding and Joining
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    • v.17 no.3
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    • pp.79-89
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    • 1999
  • The study was carried out to examine in more detail metallurgical and mechanical properties of brazed joints of diamond cutting wheel. In this work, shank(mild steel) and sintered bronze-base tips were brazed with three different filler materials(W-40, BAgl and BAg3S). The machine used in this work was a high frequency induction brazing equipment. The joint thickness, porosities and microstructure of brazed joints with brazing variables(brazing temperature, holding time) were evaluated with OLM, SEM, EDS and XRD. Bending(torque) test was also performed to evaluate strength of brazed joints. Further wetting test was performed in a vacuum furnace in order to evaluate the wettability of filler metals on base metals9shank and tips). The brazing temperature had a strong influence on the joint strength and the optimum brazing temperature range was about $700~850^{\circ}C$ for the bronze/steel combinations. The strength of the brazed joint was found to be influenced by the three factors : degree of reaction region, porosity content, joint thickness. The reaction region was formed in the bronze-base tip adjacent to the joint. The reaction region resulted in a bad influence on the strength due to the formation of Cu5.6Sn, CuZn4, $\beta(CuZn)$ and CdAg, etc. Porosities increased as brazing variables(brazing temperature, holding time) increased, and the brazed joints with porosities of less than about 3-5% had an optimum strength for the bronze-base tip.

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Synthesis and Electrochemical Studies of Cu(II) and Ni(II) Complexes with Tetradentate Schiff Base Ligands

  • 조기형;정병구;김정희;전승원;임채평;최용국
    • Bulletin of the Korean Chemical Society
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    • v.18 no.8
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    • pp.850-856
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    • 1997
  • A series of tetradentate Schiff-base ligands; 1,3-bis(salicylideneimino) propane, 1,4-bis(salicylideneimino)butane, and 1,5-bis(salicylideneimino)pentane, and their Cu(Ⅱ) and Ni(Ⅱ) complexes have been synthesized. The properties of ligands and complexes have been characterized by elemental analysis, IR, NMR, UV-Vis spectra, molar conductance, and thermogravimetric anaylsis. The mole ratio of Schiff base to metal at complexes was found to be 1 : 1. All complexes were four-coordinated configuration and non-ionic compound. The electrochemical redox processes of the ligands and their complexes in DMF solution containing 0.1 M TEAP as supporting electrolyte have been investigated by cyclic voltammetry, chronoamperometry, differential pulse voltammetry at glassy carbon electrode, and by controlled potential coulometry at platinum gauze electrode. The redox process of the ligands was highly irreversible, whereas redox process of Cu(Ⅱ) and Ni(Ⅱ) complexes was observed as one electron transfer process of quasi-reversible and diffusion-controlled reaction. Also the electrochemical redox potentials of complexes were affected by chelate ring size of ligands. The diffusion coefficients of Cu(Ⅱ) and Ni(Ⅱ) complexes in DMF solution were determined to be 4.2-6.6×10-6 cm2/sec. Also the exchange rate constants were determined to be 3.6-9.7×10-2 cm/sec.

Effects of Base Metal on the Partial Oxidation of Methane Reaction (메탄의 부분산화반응에 미치는 Base metal의 영향)

  • 오영삼;장보혁;백영순;이재의;목영일
    • Journal of Energy Engineering
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    • v.8 no.2
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    • pp.256-264
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    • 1999
  • The performance of the Pt-B/cordierite catalysts (2 wt%) Pt, 70 wt% Alumina, 28 wt%) Ceria and Zirconia, B: base metal) loaded with 6∼12 wt% Mn, Cu, V, Co, Cr and Ba, respectively was studied for partial oxidation of methane reaction and compared with that of Ni loaded catalyst. As a results, it was found that Ba, Co, Cr as well as Ni loaded catalysts showed higher activity for methane partial oxidation of methane than the Mn, Cu and V loaded catalyst. But it was known that catalysts having good activity for methane showed the good activity for coke formation, too. A XRD analysis of the catalyst before and after the reaction using 5 wt% Ni/Al$_2$O$_3$) showed that there were three Ni phases. In these results, it was found that methane oxidation reaction occulted at the front of the catalyst bed consisted of NiAl$_2$O$_4$and NiO and reforming reaction occurred at the rear part of the catalyst bed consisted of reduced Ni.

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Structural Analysis of Cu Binding Site in [Cu(I)·d(CpG)·d(CpG)-2H]-1 Complex

  • Im, Yu-Jin;Jung, Sang-Mi;Kang, Ye-Song;Kim, Ho-Tae
    • Bulletin of the Korean Chemical Society
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    • v.34 no.4
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    • pp.1232-1236
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    • 2013
  • The Cu cation binding sites of $[Cu(I){\cdot}d(CpG){\cdot}d(CpG)-2H]^{-1}$ complex have been investigated to explain the $[Cu{\cdot}DNA]$ biological activity caused by the Cu association to DNA. The structure of $[Cu(I){\cdot}d(CpG){\cdot}d(CpG)-2H]^{-1}$ complex was investigated by electrospray ionization mass spectrometry (ESI-MS). The fragmentation patterns of $[Cu(I){\cdot}d(CpG){\cdot}d(CpG)-2H]^{-1}$ complex were analyzed by MS/MS spectra. In the MS/MS spectra of $[Cu(I){\cdot}d(CpG){\cdot}d(CpG)-2H]^{-1}$ complex, three fragment ions were observed with the loss of d(CpG), {d(CpG) + Cyt}, and {d(CpG) + Cyt + dR}. The Cu cation binds to d(CpG) mainly by substituting the $H^+$ of phosphate group. Simultaneously, the Cu cation prefers to bind to a guanine base rather than a cytosine base. Five possible geometries were considered in the attempt to optimize the $[Cu(I){\cdot}d(CpG){\cdot}d(CpG)-2H]^{-1}$ complex structure. The ab initio calculations were performed at B3LYP/6-31G(d) level.

Fabrication of RRR Measuring System for Disseminating IEC International Standard (IEC국제규격을 보급하기 위한 RRR측정장치 제작)

  • Kyu Won Lee;Kyu Tae Kim
    • Progress in Superconductivity
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    • v.4 no.1
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    • pp.80-85
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    • 2002
  • In order to disseminate the IEC international standard of RRR measurement of Cu/Nb/-Ti composite superconductors, a measuring system was developed at KRISS. The system consisted of helium reservoir, base plate, thermometer, voltmeter and current source. The helium reservoir and base plate provided a stable temperature of a range from 4.2 K to 300 K and the voltmeter measured several order of $mutextrm{V}$ on specimen for obtaining RRR of the Cu/Nb-Ti composite superconductor. Three specimens of the Cu/Nb-Ti composite superconductors were measured using this system for characterizing their RRR. The resistance-temperature curves ortho specimens showed 10/sup -6/ to 10/sup -5/ Ohms near transition temperature and 10/sup -4/ to 10/sup -3/ Ohms at 293 K. The RRR values of the specimens were 145, 71 and 140, respectively.

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The Effect of Weld Metal Copper Content on HAZ Cracking in Austenitic Stainless Steel welded with Al-brass

  • Lee, H.W.;Lee, J.S.;Choe, W.H.
    • Proceedings of the KWS Conference
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    • 2005.06a
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    • pp.152-154
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    • 2005
  • Austenitic stainless steel has good weldability but is sensitive to hot cracking such as solidification crack and liquation crack. In this study, the specimens of dissimilar metals made between austenitic stainless steel and Al-brass were welded by GTAW process using four different filler metals. Cracks were detected in the heat-affected zone of the stainless steel when welded with CuAl, CuSn and NiCu filler metals, but no cracks were detected a Ni filler metal was used. The cracks propagated along the grain boundary in the heat affected zone near the fusion line to base metal of 316L stainless steel. The cracks were located inside the weld bead with very fine hairline crack. All cracks initiated at the fusion line and moved forward in the base metal. From energy dispersion spectroscopy (EDS), Cu peak was detected only in the crack-opening area.

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Syntheses and Properties of Polydentate Schiff Base and Their Cu(Ⅱ) Complexes (여러자리 시프 염기 리간드와 구리(Ⅱ) 착물의 합성과 성질)

  • Kim, Seon Deok;Sin, Yun Yeol;Jang, Gi Ho
    • Journal of the Korean Chemical Society
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    • v.38 no.4
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    • pp.319-327
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    • 1994
  • The novel Schiff base hexadentate ligand, bis-(salicylaldehyde)-triethylentetramine (BSTT) and heptadentate ligand, bis-(salicylaldehyde)-tetraethylenpentamine(BSTP) were synthesized by the reaction of salicylaldehydes with triethylenetetramine and tetraethylenepentamine, having four and five nitrogen atoms, respectively. These liquid Schiff base ligands were become in form of the pale-yellow crystals in the specific pH 4.0 by adding acetic acid concentrated hydrochloric acid. The Cu(Ⅱ) complexes of the Schiff bases were synthesized by reaction of the Schiff base with Cu(Ⅱ) ion and their possible structures were proposed by several analytical data, and physical and chemical properties.

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A Study on Wetting, Interfacial Reaction and Mechanical Properties between Sn-Bi-Ag System Solders and Cu Substrate (Sn-Bi-Ag계 땜납과 Cu기판과의 젖음성, 계면 반응 및 기계적 성질에 관한 연구)

  • Seo, Youn-Jong;Lee, Kyung-Ku;Lee, Doh-Jae
    • Journal of Korea Foundry Society
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    • v.17 no.3
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    • pp.245-251
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    • 1997
  • Solderability, interfacial reaction and mechanical properties of joint between Sn-Bi-Ag base solder and Cu-substrate were studied. Solders were subjected to aging treatments to see the change of mechanical properties for up to 30 days at $100^{\circ}C$, and then also examined the changes of microstructure and morphology of interfacial compound. Sn-Bi-Ag base solder showed about double tensile strength comparing to Pb-Sn eutectic solder. Addition of 0.7wt%Al in the Sn-Bi-Ag alloy increase spread area on Cu substrate under R-flux and helps to reduce the growth of intermetallic compound during heat-treatment. According to the aging experiments of Cu/solder joint, interfacial intermetallic compound layer was exhibited a parabolic growth to aging time. The result of EDS, it is supposed that the soldered interfacial zone was composed of $Cu_6Sn_5$.

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